Research PaperAn experimental study of enhanced heat sinks for thermal management using N-EICOSANE (cas 112-95-8) as phase change material
-
Add time:08/23/2019 Source:sciencedirect.com
This study experimentally explores the thermal performance enhancement of portable electronics; based on the N-EICOSANE (cas 112-95-8) used as a phase change material (PCM) filled pin-fin heat sinks. A constant heat flux ranging from 0.79kW/m2 to 3.17kW/m2 is applied at the base of heat sink. Comparison was carried out with and without n-eicosane for finned and un-finned heat sinks. Four configurations of pin-fin heat sinks are tested at four different volumetric fractions of n-eicosane including no fin heat sink to quantify the effectiveness of pin-fins for cooling of electronics. Pin-fins of constant volume fraction (9% to the total volume of heat sink) are used as thermal conductivity enhancers (TCEs) within PCM as the PCM has very low thermal conductivity to dissipate heat. TCEs are made of aluminum. Pin-fin heat sinks of fin thickness of 1mm, 2mm and 3mm, are investigated to examine the effect of fin thickness, amount of n-eicosane and input heat flux for three different critical set point temperatures (SPTs). The findings indicated that inclusion of n-eicosane in pin-fin heat sink had viable performance to keep the temperature of mobile devices in comfortable zone. At lower heat inputs steady state operating conditions, uniform charging of PCM takes longer duration, and more phase duration of latent heat is achieved. Enhancement ratios revealed that 2mm thick pin-fin heat sink had the maximum thermal performance for reliable performance of electronic package.
We also recommend Trading Suppliers and Manufacturers of N-EICOSANE (cas 112-95-8). Pls Click Website Link as below: cas 112-95-8 suppliers
Prev:Thermal-regulation of nonwoven fabrics by microcapsules of N-EICOSANE (cas 112-95-8) coated with a polysiloxane elastomer
Next:Fabrication of magnetic phase change N-EICOSANE (cas 112-95-8) @ Fe3O4/SiO2 microcapsules on wood surface via sol-gel method) - 【Back】【Close 】【Print】【Add to favorite 】
- Related Information
- Viscosity of n-hexadecane, n-octadecane and N-EICOSANE (cas 112-95-8) at pressures up to 243 MPa and temperatures up to 534 K08/29/2019
- Experimental investigation of N-EICOSANE (cas 112-95-8) based circular pin-fin heat sinks for passive cooling of electronic devices08/28/2019
- Properties of N-EICOSANE (cas 112-95-8)-filled microcapsules with different morphology. Phase Change Materials studied by positron spectroscopy and complementary methods08/27/2019
- High-pressure phase equilibria of systems carbon dioxide + N-EICOSANE (cas 112-95-8) and propane + N-EICOSANE (cas 112-95-8)08/26/2019
- Effect of temperature and graphite particle fillers on thermal conductivity and viscosity of phase change material N-EICOSANE (cas 112-95-8)08/25/2019
- Fabrication of magnetic phase change N-EICOSANE (cas 112-95-8) @ Fe3O4/SiO2 microcapsules on wood surface via sol-gel method08/24/2019
- Thermal-regulation of nonwoven fabrics by microcapsules of N-EICOSANE (cas 112-95-8) coated with a polysiloxane elastomer08/22/2019
- Synthesis and characterization of micro-nanoencapsulated N-EICOSANE (cas 112-95-8) with PMMA shell as novel phase change materials for thermal energy storage08/21/2019
- Microencapsulated N-EICOSANE (cas 112-95-8) PCM suspensions: Thermophysical properties measurement and modeling08/20/2019