Preparation and properties of cured Diallyl phthalate (cas 131-17-9) resin modified with dimeric acid polyamide derivatives

Add time:09/29/2019    Source:infona.pl

The allyl ester of dimeric acid polyamide, a compound which has a flexible unit in the main chain and reacts with the Diallyl phthalate (cas 131-17-9) (DAP) resin to have an allyl group, was synthesized by the reaction of dimeric acid polyamide with allyl glycidyl ether. The allyl ester of dimeric acid polyamide was blended with DAP resin to improve the adhesive properties to metal. These blends were cured with dicumyl peroxide. By modification with allyl ester of dimeric acid polyamide, the T‐peel adhesive strength to copper improved. This result is due to the increase in flexibility generated by introducing the unit of dimeric acid polyamide and subsequent increase in interfacial adhesive strength due to the amide bond being located in the surface of the copper plate. On the other hand, the lap‐shear adhesive strength did not improve significantly because of the decrease in rigidity. On increasing concentration of allyl ester of dimeric acid polyamide, the glass‐transition temperature slightly decreased, but there was little decrease of the thermal decomposition temperature. From scanning electron microscope observations, it was found that the DAP resin modified with allyl ester of dimeric acid polyamide formed a microphase‐separated structure consisting of small dimeric acid polyamide particles dispersed in the DAP resin matrix. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012

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