1
752
E. Napetschnig et al. / Surface Science 602 (2008) 1750–1756
The alumina film on NiAl(110) exhibits two types of domain
‘‘A” in Fig. 2b) as well as areas of pure Cu(111) (marked ‘‘B”),
p
p
boundaries [15–17], reflection domain boundaries between differ-
ent orientations of the oxide and line defects separating areas of
the same orientation of the oxide. The latter are often referred to
as anti-phase domain boundaries and caused by the stress due to
row matching with the substrate [17]. The domain boundaries ap-
pear bright in STM images at higher positive bias voltages because
of unoccupied states localized at the domain boundaries [17,18].
Both, antiphase and reflection domain boundaries can act as nucle-
ation centers for metal clusters on the alumina film on NiAl(110)
mainly at the domain boundaries of the ( 3 ꢀ 3)R30° structure.
Additionally, there are also a few small areas (marked ‘‘C”) where
p
p
the Al atoms are locally denser than in the ( 3 ꢀ 3)R30°
structure.
We have drawn the (1 ꢀ 1) lattice over the atomically resolved
STM images with chemical contrast (Fig 2c) and measured the
heights on the (1 ꢀ 1) positions, resulting in a bimodal distribution
(Fig. 2d). The histogram can be fitted by a superposition of two
Gaussian distributions. The ratio of the concentrations of Cu and
Al in the surface is equal to ratio of the areas under the two Gaus-
sians. The quantification results in a surface concentration of
[
7]. For example, Pd clusters nucleate at defects on the alumina
surface, i.e., at domain boundaries and step edges [19,20].
2
3 ± 2% Al, in excellent agreement with the previous AES result
of 22% obtained after annealing at a somewhat lower temperature
12].
2
. Experimental
[
+
The Cu–9at%Al(111) sample was prepared by 2 keV Ar sputter-
ing and annealing at 680 °C for 10 min in a UHV chamber with a
3
.2. Oxidized Cu–9%Al(111) crystal
ꢁ10
base pressure in the low 10
mbar range. The temperature was
After sufficient cleaning, oxidation of the crystal at 680 °C led to
measured by a thermocouple, which was mounted on the non-
transferable part of the sample holder and thus showed a different
temperature (600 °C). The true sample temperature was deter-
mined with a disappearing filament pyrometer, calibrated with
the thermocouple to eliminate the influence of light attenuation
by the viewport. We have checked the cleanness of the sample
after sputtering and annealing with AES. After several cycles of
sputtering and annealing, no impurities like sulphur or carbon
were detected. Unless noted otherwise, the alumina film was pre-
pared by dosing of 100 L oxygen with an oxygen partial pressure of
a surface covered by a well-ordered flat oxide film with large do-
mains and thus very good long range ordering (Fig. 3). To estimate
the thickness and surface composition of this oxide film we com-
pared it with the alumina film on NiAl(110), which has a well-
known thickness, stoichiometry and surface composition [14,15].
For the estimation of the thickness we calculated the expected
AES spectrum with the AES database SESSA [22] for the two crys-
tals covered by a thin alumina film. The results were corrected
by assuming that the sensitivity of the CMA is proportional to
the energy. Considering that we do not know the exact energy-
dependent analyzer sensitivity, that we use Auger peak-to-peak
heights instead of intensities and also considering possible system-
atic errors of the electron transport calculation, we should not di-
rectly compare the experimental and calculated results.
Nevertheless, assuming that the oxide films on both substrates
are equal, and further assuming equal influence of instrumental
factors on the Ni (848 eV) and Cu (920 eV) substrate lines, the
experimental intensity ratio between the oxygen line (510 eV)
and the substrate lines should be proportional to the calculated
one. Table 1 shows that the proportionality factor between mea-
sured and calculated oxygen/substrate ratios is only 6% lower for
the oxide on Cu–9at%Al(111) than for the oxide on NiAl(110). This
deviation is within the experimental uncertainty as well as within
the uncertainty of the calculation (both are estimated around 10%).
These results allow us to rule out a significantly different thickness
of the oxide, especially a different number of layers: removing the
ꢁ
7
1
.3 ꢀ 10 mbar at 680 °C. STM, AES, LEED and low-energy ion
scattering (LEIS) measurements were performed at room tempera-
ture in the analysis chamber, which has a base pressure below
5
ꢁ11
ꢀ 10
mbar. The STM measurements were performed using a
customized commercial STM (Omicron l-STM) with an electro-
chemically etched W tip. All STM images were obtained in constant
+
current mode. LEIS measurements were carried out with 1 keV He
ions at a scattering angle of 90° and a current density of about
2
3
nA/mm . The LEIS spectra were obtained with a hemispherical
energy analyzer operated with fixed retardation ratio. AES spectra
were taken with a cylindrical mirror analyzer (CMA) with a con-
centric electron gun and 3 keV electron energy; the Auger peak-
to-peak heights (APPH) of the differentiated spectra were used
for quantitative analysis. Pd was deposited from a rod using a
water-cooled electron-beam evaporator (Focus EFM3). During
deposition a retarding voltage was applied to the orifice of the
evaporator to suppress high-energy metal ions from the evapora-
tor, as such ions otherwise create nucleation centers on the surface
i i
interfacial layers Al and O would result in a calculated O/Cu inten-
sity ratio of 0.29; duplicating these layers gives a ratio of 0.92.
To determine the composition of the uppermost layer of the
oxide film on Cu–9%Al(111), we compared the ratios of the areas
of the oxygen to the Al peak in the LEIS spectra of the oxide films
on the two substrates. For the oxide on Cu–9%Al(111), the O/Al
peak intensity ratio was 0.72, which is 6% below that of the oxide
on NiAl(110). Considering the experimental error, this points to a
similar or possibly the same surface composition of the oxides on
Cu–9%Al(111) and NiAl(110).
[
21]. The deposition rate, calibrated with a quartz crystal microbal-
ance, was 0.07 ML/min. We define 1 ML Pd here as the amount of
atoms in one Pd(111) layer.
3
. Results
3
.1. Pure Cu–9%Al(111) crystal
We have investigated the clean Cu–9%Al(111) surface after
The LEED pattern of the oxidized surface of the Cu–9%Al(111)
crystal is shown in Fig. 4. It is a complex pattern with a multitude
of reflections, different from the diffraction pattern reported in
Refs. [8,10,11,13]. The LEED pattern shown is slightly distorted
due to residual magnetic fields and a non-perfect geometry. Never-
theless, we can use the pattern to derive the unit cells, a procedure
aided by the STM images (see below). The first structure (Fig. 4a) is
a rectangular one with three rotational domains, nearly commen-
surate with the substrate. The unit cell dimensions, derived from
the LEED pattern, are 18.2 Å ꢀ 10.6 Å. The long side of the unit cell
is rotated by 30° with respect to a close-packed row of the sub-
annealing at 680 °C, the same temperature as used for oxidation.
p
p
The LEED image shows a diffuse ( 3 ꢀ 3)R30° pattern (Fig. 2a).
Since cooling in our system is not fast enough to freeze the high-
temperature (1 ꢀ 1) phase, this observation is in agreement with
Refs. [11,13]. We have obtained atomically resolved STM images
with chemical contrast (Fig. 2b and c). Since the atomic radius of
Al is larger than that of Cu, and Al is the more reactive metal, we
attribute the bright species to Al, in agreement with the surface
composition known from the literature [12] (see below). The
p
p
images show areas with a ( 3 ꢀ 3)R30° superstructure (marked