PHOSPHORUS, SULFUR, AND SILICON
39
d(ln β)
d(1/T p)
Ea
nR
=
(2)
where n is the reaction order, other parameters are the same as
TGA was carried out on a SII EXSTAR6000-TGA6300 in
nitrogen at 10 °C/min. Wide-angle X-ray diffraction measure-
ments were performed at room temperature on a PANalytical
EMPYREAN X-ray diffractometer at 40 KV and 40 mA with
CuKα radiation (λ = 0.1541 nm). Refractive indexes of the
epoxy monomers and epoxy systems before curing were
determined using WZS-1 Abbe refractometer (Shanghai optical
instrument factory). Refractive indexes of the 2 mm cured epoxy
films formed on 7.62 cm silicon wafers were measured at the
wavelength of 632.8 nm with a Metricon Model 2010/M prism
coupler.
Scheme . Chemical structures of epoxy resins and curing agent.
1
group). H-NMR (400 MHz, CDCl3): δ = 7.42 (s, 2H, Ar-H),
7.26 (d, 2H, Ar-H), 7.19 (d, 2H, Ar-H), 3.00–3.06 (m, 4H, CH2),
2.89–2.93 (m, 2H, CH epoxy), 2.70 (t, 2H, CH2 epoxy), 2.47(dd,
J = 6.0 Hz, 2H, CH2 epoxy). 13C-NMR (400 MHz, CDCl3): 136.5
(C9), 135.8 (C8), 133.4 (C7), 129.6 (C6), 129.2 (C5), 129.0 (C4),
50.9 (C3), 47.3 (C2), 36.6 (C1). FD-MS (m/z): 392.25 (M+).
Preparation of cured epoxy resins
Acknowledgments
MeHHPA were used as curing agent to thermally cure the 4SEP
and DGEBA epoxy resins. The chemical structures of the epoxy
resins and curing agent are shown in Scheme 2. The reaction
compositions were mixed homogeneously in a 1:1 molar ratio
according to the EEW values. The mass ratio of the accelera-
tor BPP to resin was 0.5:100. The mixtures were degassed in a
vacuum and poured into a preheated stainless steel mold, and
was cured according to the following curing regime: 120 °C-2 h,
150 °C-1 h.
This study is financially supported by the National Natural Science Foun-
dation of China (No. 51203163).
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Characterization
The 1H-NMR was recorded on a BRUKER AVANCE 400 MHz
NMR spectrometer, using deuterated chloroform as solvent and
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d(ln β)
d(1/T p)
1.052Ea
=
(1)
R
where β is heating rate, A is preexponential factor, R is universal
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