ELECTRODEPOSITION OF METALS FROM THEIR TRIFLUOROACETATE-AMIDE BATHS.

Article abstract of DOI:10.1016/0013-4686(80)87126-X

This study deals with the electrodeposition of copper and nickel from the Cu(CF//3COO)//2-HCONH//2 bath, Ni(CF//3COO)//2-HCONH//2 bath, Cu(CF//3COO)//2-HCON(CH//3)//2 bath and Ni(CF//3COO)//2-HCON(CH//3)//2 bath. The properties of these baths and the mechanism of the electrodeposition of copper and nickel from these baths were studied. While solvolysis occurs in the HCONH//2 bath, it does not occur in the HCON(CH//3)//2 bath. A complex is formed in each bath. Since the bond between the metallic ion and the solvent in the HCON(CH//3)//2 bath is stronger than that in the HCONH//2 bath, and since the dielectric constant of the solvent in the former is also lower than in the latter, is difficult to electrodeposit metal and Cu//2O is formed at cathode in the Cu(CF//3COO)//2-HCON(CH//3)//2 bath.