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P.G. Karlsson et al. / Surface Science 602 (2008) 1803–1809
local chemical surrounding is obtained by the chemical shift. The
technique is surface sensitive by nature due to the detection of
electrons. By exploiting the virtues of high photon flux and variable
photon energy at a synchrotron radiation source the surface sensi-
tivity can be dramatically enhanced as compared to standard XPS
instruments. This allows for studies of the very low surface cover-
ages needed in order to understand the initial nucleation
processes.
In this paper, we use STM and core level PES to study the initial
stages of ZrO2 chemical vapor deposition on the Si(100)-(2 ꢀ 1)
surface from the ZTB precursor. We report on the details in the
ZTB surface reactions involved in the formation of submonolayer
structures. It is possible to identify two principal surface processes:
Silicon carbonization and formation of ZrO2. We propose that the
two types of surface modifications can be distinguished in the
STM images. The carbonization process leads to characteristic sur-
face reconstructions, the structures of which are discussed. Indica-
tions for Zr–Si bond formation are found but there is no sign of
silicon oxidation. The absence of observable Si oxidation makes
the initial stages quite different from the latter stages of growth.
ple steps were also oriented 90°. Hence, the small terraces are not
primarily induced by the cleaning procedure but are an inherent
property of the wafer.
While heated to 400 °C, the sample was exposed to ZTB via a
stainless steel tube (10 mm in diameter). Some relatively thick
films were always produced to confirm that the system was work-
ing satisfactorily and to further passivate the UHV parts. The doses
are given in milliLangmuirs (mL, 1 mL = 10ꢁ9 Torr s) read as the
background pressure.
3. Results
3.1. STM images
A top view of the clean Si(100)-(2 ꢀ 1) surface is presented in
Fig. 1a. It consists in elongated terraces typically about 20 nm wide
and separated by monoatomic steps. No step bunching was ob-
served and the step density is as expected for the specified misori-
entation of the wafer. Rows of silicon dimers run along the terraces,
rotated by 90° from one to another. Two different types of defects
are observed in good agreement with previously published data
and consist in single dimer vacancy (DV) defects (also denoted type
A defects) and half missing dimer defects (type C defects). Their
density is also in agreement with the literature, with about 1 A-type
defect and 1.2 C-type defect per 5 ꢀ 5 nm2 [16,17]. Overview
images of at least 100 ꢀ 100 nm2 (not showed here) exhibit the
same low defect density. The zigzag chains are due to imaging of
‘‘frozen” buckled dimers, as observed previously [16].
2. Experimental
The experiments were performed in two different Ultra High
Vacuum (UHV) systems with
a base pressure lower than
2 ꢀ 10ꢁ10 torr, one for each technique used (STM and PES). The
STM measurements were performed with a customised variable
temperature (VT) UHV scanning probe microscope from Omicron
Vakuumphysik GmbH, Germany. All STM data were acquired in
the constant current mode at room temperature (RT), and are pre-
sented as top view grey scale images with darker colors corre-
sponding to lower levels. Both Pt/Ir and W tips were used for the
experiments. Subsequent reconditioning of the tip was undertaken
by running line scans at 10 V sample bias and 50 nA tunnelling cur-
rent. This procedure resulted in stable and reproducible images of
the surface. All images shown here correspond to occupied states
(Vt < 0), since it was very difficult to probe the unoccupied states
after ZTB dosing. The photoelectron spectroscopy (PES) measure-
ments were carried out at beam-line I311 at MAX-lab [14]. The
end station is equipped with an electron energy analyzer of type
SCIENTA SES200. The spectra are calibrated relative to the Si 2p3/
The image presented in Fig. 1b corresponds to a 20 ꢀ 20 nm2
topograph obtained after 0.1 mL ZTB exposure. It stands clear that
the defects density has increased dramatically already after this
small dose. The number of dimer vacancies is considerably higher
than before ZTB exposure, with up to 15.5 DV per 5 ꢀ 5 nm2. At
several places adjoining DVs are observed forming one-dimen-
sional ‘‘trenches” perpendicular to the dimer rows. Extended
ꢀ
grooves along the Si(100) [011] direction are also imaged (la-
belled E). The depth of these dark areas is about 0.5–1.0 Å. As their
length varies, the evaluation of their density is not reported here.
Moreover, a small number of very bright protrusions can be ob-
served, typically adjacent to the grooves E. The height of the bright
spot from the top of the dimer rows is about 1.5 Å. From the line
scan in Fig. 1 it can be inferred that this height is in good agree-
ment with the apparent step height.
peak for the clean Si(100)-(2 ꢀ 1) surface, set to 99.2 eV binding
2
energy (BE) relative to the Fermi level.
In both cases, a separate preparation chamber is connected to the
analysis chamber, equipped with low energy electron diffraction
(LEED)andsampleheatingfacilities, andonwhichthedosingsystem
was connected. The zirconium tetra-tert-butoxide (ZTB) precursor
(99.99%, Stream Chemicals) was introduced in a pyrex tube welded
to a conflat (CF)flange and swiftly connectedvia a valve to the dosing
system. The later was in its turn connected to the preparation cham-
ber via a precision leak valve. All vacuum parts were thoroughly pas-
sivated by exposure to ZTB right after baking.
Small rectangular samples were cut from n-doped (P) Si(100)
wafers (Polishing Corp. of America, 0.5°, 0.1–1.0 ohm cmꢁ1). Dust
particles were removed by blowing with dry N2. The samples were
put into the UHV systems as received. This was followed by a thor-
ough outgasing/annealing procedure [15], which involved flashes
to 1250 °C by passing direct current through the sample. This pro-
cedure resulted in clean samples according to PES and STM
standards.
Furthermore, an intriguing observation is the appearance of
small reconstruction patches (R) randomly across the surface, with
a density of about 4 per 5 ꢀ 5 nm2. In these patches, one dimer is
missing and the other is replaced by a smaller protrusion. These
patches thus cover each an area approximately corresponding to
a (3 ꢀ 2) cell. The protrusion within the R feature is centered in
the direction of the dimer rows and off centered in the direction
perpendicular to the dimer rows. In the STM images, the protru-
sions appear at intermediate height as compared to the bottom
of the grooves E and the dimer rows. They are not tip-induced arti-
facts as their position varies from defect to defect within the same
image and are independent of the scanning angle. The vast major-
ity of the defects observed at this stage can be assigned to DV, E
and R categories, either separately or in combination. However,
the R reconstructions are always observed as separate entities or
in combination with E or DV defects, that is, there is no tendency
for extended (3 ꢀ 2) island formation.
It can be noted that the tolerance for misorientation is 0.5° for
the present grade of silicon wafer. The misorientation observed
on the stepped images obtained on the clean surface is within this
value. For different samples cut from approximately the same po-
sition of the wafer but rotated 90° relative to each other, the sam-
Fig. 2 shows a 50 ꢀ 50 nm2 STM topograph after a ZTB exposure
of 0.2 mL, i.e. after approximately doubling the exposure. The sub-
strate dimer rows are still visible and the (2 ꢀ 1) areas amount to
at most 50%. The rest of the surface is basically imaged as depres-
ꢀ
sions running along the ½011ꢂ and the [011] directions. At this