H. Li et al. / Electrochimica Acta 54 (2008) 242–246
243
deposition, cyclic voltammetry of 20 mM CuBr2 aqueous solution
was carried out. The solution was deaerated and unstirred. The
working electrode was polycrystal Au sealed in Teflon with expo-
2
sure area of 0.2 cm . The cyclic voltammetry was run at a scan rate
of 10 mV/s.
X-ray diffraction measurements of the films were carried out
◦
◦
using the ꢁ–2ꢁ scan mode (2ꢁ varied from 20 to 80 , Cu K radi-
␣
1
ation (ꢂ = 1.54056 Å)) using a D/max 2550PC apparatus equipped
with thin film optics (Rigaku Corporation, Tokyo, Japan). Data was
◦
collected at a scan step of 0.02 and at conditions of 40 kV and
4
0 mA. FEI SIRION 200 field emission scanning electron micro-
scope (SEM) (FEI Corporation, USA) was used for observation of
the microstructures of the films and the SEM operation voltage
was 5.0 kV. energy dispersive spectroscopy (EDS) was used for the
composition analysis.
Fig. 2. X-ray diffraction ꢁ–2ꢁ scans of the electrodeposits onto ITO glass substrate
(a) and commercial CuBr powders (b). The electrodeposits obtained from 20 mM
Optical transmission spectra were measured on a Shimadzu UV-
CuBr2 aqueous solution and pH of the solution was adjusted to 3 using 0.1 M HBr
and the applied potential was −0.2 V versus SCE.
2
550 spectrophotometer (Shimadzu Corporation, Japan) at a scan
rate of 5 nm/s. Spectra were recorded at room temperature and ITO
glass was used as a reference. The photoluminescence spectra of
the CuBr were measured in air at room temperature using a Hitachi
F-2500 fluorimeter (Hitachi Corporation, Japan) with Xe lamp as
the excitation source. The power (W) of the Xe lamp used as the
exciting source is 150 W. The emission spectra were acquired at
following conditions: an excitation wavelength was set at 325 nm,
the slit width was set 2.5 nm for the emission and 2.5 nm for the
excitation, the scan rate was 15 nm/min, and the photomultiplier
tube voltage was 400 V.
In this work, the applied potentials ranged from 0.05 to −0.4 V
versus SCE versus SCE are chosen to deposit the CuBr.
3.2. Structure characterizations of CuBr thin films
The typical X-ray Bragg–Brentano scan of the electrodeposits
◦
is shown in Fig. 2a. There are one very strong peak at 2ꢁ = 27.1
◦
and one small peak at 2ꢁ = 44.9 . In order to determine the struc-
ture and composition of the electrodeposits, the powder of CuBr
obtained from commercial source was also examined by X-ray
Bragg–Brentano scan and the result is shown in Fig. 2b. There are
3. Results and discussion
◦
◦
◦
four characteristic peaks appeared in Fig. 2b at 27.1 , 44.9 , 53.3 ,
6
3.1. Electrochemical behaviour of CuBr2
◦ ◦
5.5 and 74.2 , respectively. Based on the standard pattern of CuBr
taken from the Joint Committee on Powder Diffraction Standards
(JCPDS) Database (JCPDS no. 82–2118), the XRD patterns in Fig. 2b
can be correspondingly indexed as (1 1 1), (2 2 0), (3 1 1), (4 0 0), and
(3 3 1) of the cubic CuBr, respectively. Compared the XRD patterns of
Fig. 2a to those of b, one can see that the electrodeposited thin films
belong to CuBr with strong preferential orientation along ꢀ1 1 1ꢁ
crystal axis.
The typical CV of 20 mM CuBr2 is shown in Fig. 1. The cathodic
reduction peak a can be attributed to the reduction of Cu2 to Cu+
+
and the potential is about −0.28 V versus SCE. The cathodic reduc-
+
tion peak b can be attributed to the reduction of Cu to Cu and
the potential is about −0.41 V versus SCE. The large anodic peak at
about 0.2 V versus SCE can be attributed to the oxidation of Cu to
+
Cu . Based on the results of CV, it is possible to form stable CuBr
SEM image of the electrodeposited CuBr thin films is shown
in Fig. 3a. Fig. 3a shows that the electrodeposited CuBr thin film
appears as dense film with triangular facet morphology. This is
consistent with the result of XRD that electrodeposited CuBr thin
film grow preferential orientation along the ꢀ1 1 1ꢁ crystal axis. In
order to further confirm that the electrodeposits belong to CuBr, the
EDS was performed for the electrodeposits and is shown in Fig. 3b.
Based on the EDS results, the compositions of the electrodeposits
are mainly composed of Cu and Br and the atom ratio of the Cu
and Br is 49.7:50.3. This again indicates that the electrodeposits are
mainly composed of CuBr.
among certain cathodic potential range. CuBr can be produced by
following reactions:
Cu2 + e → Cu+
+
(1)
(2)
Cu+ + Br− → CuBr
3.3. The effects of pH and applied potentials on orientation
growth of CuBr thin films
In electrocrystallization, the orientation growth usually is
affected by the solution pH and applied potentials. Here the effects
of solution pH and applied potentials have been conducted and
results are shown in Figs. 4 and 5, respectively. One can see that the
electrodeposited CuBr thin films still grow preferential orientation
along the ꢀ1 1 1ꢁ crystal axis under varied pH and applied potentials.
3
.4. Mechanism of orientation growth
Fig. 1. Cyclic voltammetry of 20 mM CuBr2 in aqueous solution and pH of the solu-
tion was adjusted to 3 using 0.1 M HBr. The solution was deaerated and unstirred.
The working electrode was polycrystal Au sealed in Teflon with the exposure area
Normally the preferential orientation of thin films elec-
2
of 0.2 cm . The cyclic voltammetry was run at a scan rate of 10 mV/s.
trodeposited on foreign substrate have two different cases: (1)