COPPER FORMATE

Base Information

• Chemical Name: COPPER FORMATE
• CAS No.: 544-19-4
• Deprecated CAS: 54366-11-9,60065-34-1,60065-34-1
• Molecular Formula: 2CHO₂*Cu
• Molecular Weight: 153.581
• European Community (EC) Number: 208-865-8
• UNII: FQ5WX1800C
• DSSTox Substance ID: DTXSID6060268
• Nikkaji Number: J6.413K
• Wikidata: Q18212209
• Mol file: 544-19-4.mol

Synonyms:Copperformate (6CI);Formic acid, copper(2+) salt (8CI,9CI);Copper diformate;Copperformate (Cu(HCOO)2);Copper(2+) formate;Copper(II) formate;Cupric diformate;Cupric formate;Formic acid copper(2+) salt (1:1);Tubercuprose;

Chemical Property of COPPER FORMATE

Chemical Property:

• Appearance/Colour: blue crystalline powder
• Vapor Pressure: 36.5mmHg at 25°C
• Melting Point: 130 °C
• Boiling Point: 100.6 °C at 760 mmHg
• Flash Point: 29.9 °C
• PSA: 37.30000
• Density: 1,831 g/cm³
• LogP: 0.33420
• Water Solubility.: 12.5g/100mL H2O [CRC10]; insoluble most organic solvents [MER06]
• Hydrogen Bond Donor Count: 0
• Hydrogen Bond Acceptor Count: 4
• Rotatable Bond Count: 0
• Exact Mass: 152.924906
• Heavy Atom Count: 7
• Complexity: 7.5

Purity/Quality:

99.9% ^*data from raw suppliers

Copper(II) formate hydrate ^*data from reagent suppliers

Safty Information:

• Pictogram(s): Xn,N
• Hazard Codes: Xn,N
• Statements: 20/21/22-50/53-22
• Safety Statements: 22-36/37/39-61-60

MSDS Files:

Useful:

• Chemical Classes: Metals -> Metals, Inorganic Compounds
• Canonical SMILES: C(=O)[O-].C(=O)[O-].[Cu+2]
• Uses: Copper formate is used for the control of bacteria and mildew in cellulosic materials.

Technology Process of COPPER FORMATE

There total 21 articles about COPPER FORMATE which guide to synthetic route it. The literature collected by LookChem mainly comes from the sharing of users and the free literature resources found by Internet computing technology. We keep the original model of the professional version of literature to make it easier and faster for users to retrieve and use. At the same time, we analyze and calculate the most feasible synthesis route with the highest yield for your reference as below:

synthetic route:

Reference yield:

copper(II) formate tetrahydrate (5893-61-8,14690-98-3,15305-21-2,16842-73-2,22992-79-6,34729-06-1,133386-02-4,133386-04-6) → copper(II) formate (544-19-4,624-88-4,15907-03-6,20764-37-8,104613-47-0)

Guidance literature:

In neat (no solvent); heating to 110°C in vacuum;;

Reference yield:

copper (II) carbonate hydroxide + formic acid (64-18-6) → copper(II) formate (544-19-4,624-88-4,15907-03-6,20764-37-8,104613-47-0)

Guidance literature:

In water; for 2h; Cooling;

DOI:10.5012/bkcs.2014.35.1.147

Reference yield:

copper(II) hydroxide + formic acid (64-18-6) → copper(II) formate (544-19-4,624-88-4,15907-03-6,20764-37-8,104613-47-0)

Guidance literature:

In water; at 65 - 120 ℃; for 0.0833333 - 0.125h; Product distribution / selectivity;

upstream raw materials:

formic acid

formaldehyd

copper hydroxide

formate

Downstream raw materials:

copper hydroxide

phosphonic Acid

hypophosphoric acid

formic acid

Refernces

• 1、 Hwang, Jaeeun,Kim, Sinhee,Ayag, Kevin Ray,Kim, Hongdoo. "Copper electrode material using copper formate-bicarbonate complex for printed electronics". . p. 147 - 150. Retrieved 2014/02/14.
• 2、 Czakis-Sulikowska,Radwanska-Doczekalska,Czylkowska,Markiewicz,Broniarczyk. "New complexes of Mn(II), Co(II), Ni(II) and Cu(II) with 2,2'- or 2,4'-bipyridine and formates (Synthesis, thermal and other properties)". . p. 327 - 335. Retrieved 2008/10/09.