Study on the thermal interaction mechanism between C4F7N-N2 and copper, aluminum

Add time:07/29/2019    Source:sciencedirect.com

The thermal interaction mechanism between C4F7N (fluorinated nitrile)-N2 gas mixture using as substitute to SF6 with metal was investigated. We found that interaction between C4F7N-N2 and copper leads to surface corrosion or gas decomposition with interface temperature at 120℃-220℃. The oxidation of copper and accumulation of F, CFx and CN can be found and gaseous by-products such as C3F6, CF3H, C3F6O is produced. C4F7N-N2 has better compatibility with aluminum than that of copper due to the existence of alumina. The interaction between C4F7N and alumina surface has the lowest adsorption energy, charge transfer compared with that of copper and aluminum.

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