Copper(II) oxide powder manufacture for via-filling plating from H2O2 type etching wastes
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Add time:08/30/2019 Source:sciencedirect.com
COPPER(II) OXIDE (cas 1344-70-3) powder manufacture from H2O2 type etching waste is proposed. The basic copper carbonate, the intermediate product, is depends on the reaction mole ratio of sodium carbonate to copper hydroxide. The optimum reaction mole ratio is 2.64 at 80℃ under copper content of 57.5 wt.%.The optimum usage of NaOH is 120 g for Copper(II) oxide. The Copper(II) oxide yield and chlorine ion concentration, are 97.0 wt.% and 9.0 mg/L, respectively. The physical properties, such as mean particle size, dissolution time, and angle of repose are 20.0m, 60 s, and 34.1◦, respectively. The via-hole filling thickness is 9.4 μm, which satisfies general electroplating criteria, 15 μm.
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