
European Journal of Organic Chemistry p. 4705 - 4712 (2020)
Update date:2022-08-05
Topics:
Paul, Dipankar
Chatterjee, Paresh Nath
An investigation of the unexpected lability of the Csp3–Csp2 bond connecting 2,4,6-trimethoxyphenyl group and an allylic moiety is carried out. We observed that the catalytic presence of either Lewis or Br?nsted acid can render such 2,4,6-trimethoxyphenyl group labile. Several nucleophiles were found to substitute the labile C–C bond in mild reaction conditions resulting in very good yields of the allylated products. Even in the absence of a nucleophile, intramolecular cyclization of the parent substrate under acidic activation caused the labile C–C bond to cleave. A major motivation of this study is to understand the lability of electron-rich aryl group in acidic medium, employing 2,4,6-trimethoxyphenyl moiety as a case study. A plausible mechanism is proposed after carrying out several control reactions as well as UV/Vis and 1H NMR spectroscopic studies. This work provides an insight into the activation of electron-rich arenes as a labile entity in acidic medium while also adding a conceptually novel C–C bond breaking approach to the vast literature of allylation of arenes.
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Doi:10.1016/S0040-4039(99)00360-3
(1999)Doi:10.1002/adfm.201002502
(2011)Doi:10.1039/c1cc11176k
(2011)Doi:10.1039/c1cc11081k
(2011)Doi:10.1248/cpb.58.620
(2010)Doi:10.1016/j.ejmech.2011.03.020
(2011)