LETTER
101
Low Catalyst Loadings for Copper-Catalyzed O-Arylation of Phenols with
Aryl and Heteroaryl Halides under Mild Conditions
LowCatalyst
uoadings for
i
Coppe
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r-Catalyz
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edO-Arylatio
o
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of Phenol
n
g Yong,a Yong-Chua Teo,*a Yaw-Kai Yan,a Guan-Leong Chuab
a
Natural Sciences and Science Education, National Institute of Education, Nanyang Technological University,
1 Nanyang Walk, Singapore 637616, Singapore
b
Division of Chemistry and Biological Chemistry, School of Physical and Mathematical Sciences, Nanyang Technological University,
21 Nanyang Link, Singapore 637371, Singapore
E-mail: yongchua.teo@nie.edu.sg
Received 26 September 2011
Thus, there is still a need to develop an optimized ligand-
metal and catalytic system to improve further the efficien-
cy and generality of the copper-catalyzed coupling of phe-
nols with aryl halides.
Abstract: A practical and mild strategy has been developed for the
cross-coupling of O-arylation of phenol with differently substituted
aryl halides and heteroaryl iodides using low catalyst loading of
copper iodide under low operating temperature in DMF with
TMHD as the ligand and Cs2CO3 as the base. This method tolerates
a variety of functional groups including sterically hindered phenols
and heteroaryl iodides to afford products in good to excellent yields
(up to 95%).
Recently, Bolm7 reported efficient Cu2O-catalyzed cross-
couplings with parts-per-million catalyst loadings and
emphasized the importance of high ligand-to-metal ratios
in the protocol. Therefore, the exploration of an optimized
ligand-to-metal ratio for the O-arylation reaction, espe-
cially for heteroaryl halides, that operates efficiently at
low reaction temperature remains highly attractive. In
continuation of our endeavors devoted to the development
of more economical and efficient catalytic systems for di-
aryl synthesis and from the viewpoint of cost effective-
ness and atom economy, herein, we wish to report an
optimized low-loading copper-ligand catalytic system for
the cross-coupling of aryl halides and heteroaryl iodides
with a wide variety of phenols.
Key words: cross-coupling, mild conditions, low catalyst loading,
copper-catalyzed, O-arylations, phenol
Diaryl ethers represent a very important class of organic
compounds in pharmaceutical, agricultural and polymer
industries.1 The Ullmann ether formation reaction2 has
been extensively used as it has emerged as one of the most
versatile strategies to access diaryl ethers directly. How-
ever, the harsh conditions of the classical Ullmann ether
synthesis has limited its utility due to the use of stoichio-
metric amounts of copper reagents and high reaction tem-
peratures.3 In recent years, it has been reported that the use
of additives or ligands enables the reaction to be per-
formed under milder conditions and in the presence of cat-
alytic amounts of the copper catalyst.4 Buchwald
demonstrated that the Cu-catalyzed coupling of phenols
and aryl halides can be performed in the presence of the
weak base Cs2CO3 in nonpolar solvents.5 Song further re-
ported that the use of 2,2,6,6,-tetramethylheptane-3,5-di-
one (TMHD) as ligand greatly accelerated the rate of
diaryl ether formation from aryl bromides or iodides and
phenols.6 However, the use of high ratios of CuCl (50
mol%) at 120 °C was required for this protocol. Despite
these advances, a number of limitations remains; typical-
ly, high catalyst loadings (10–20 mol%) and high reaction
temperatures are required for optimal yields and the use of
heteroaryl halides as the electrophilic precursors for the
cross-coupling reaction remains limited. In some cases,
the need for time-consuming and uneconomical transfor-
mations associated with the synthesis of specially de-
signed ligands bring additional disadvantages to the
method.
In our initial study, we examined the merits of various
copper salts for the O-arylation reaction using m-cresol (1
equiv) and iodobenzene (1.5 equiv) as model substrates
(Table 1, entries 1–6). Among them, the reaction cata-
lyzed by CuI (1 mol%) in combination with TMHD (10
mol%) and Cs2CO3 (2 equiv) in DMF at 60 °C gave the
best yield of 92% (Table 1, entry 6). The use of Cu(I) re-
agent was crucial for the success of this reaction as other
copper reagents gave significantly lower yields. Next, we
probed the ligand effect using a series of commercially
available ligands such as L-proline (L2, entry 7), trans-
1,2-diaminocyclohexane (L3, entry 8), N,N¢-dimethyleth-
ylenediamine (DMEDA, L4, entry 9) and N,N,N¢,N¢-tet-
ramethylethylenediamine (TMEDA, L5, entry 10). It was
shown that TMHD was the best ligand as it clearly accel-
erated the reaction even at low temperature and catalyst
loading. Further experiments revealed that the choice of
DMF as the solvent was important for this coupling reac-
tion, since the use of toluene or DMSO resulted in only
traces and 68% yield, respectively (entries 11 and 12).
Lower yields were obtained when the ligand loading was
reduced to 5 mol% or on lowering the reaction tempera-
ture to 50 °C (entries 13 and 14). In summary, the opti-
mized conditions for this mild and low catalyst copper-
catalyzed O-arylations were achieved using a combina-
tion of CuI (1 mol%), TMHD (10 mol%) and Cs2CO3 (2
equiv) in DMF at 60 °C for 24 hours. It is noteworthy that
SYNLETT 2012, 23, 101–106
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Advanced online publication: 13.12.2011
DOI: 10.1055/s-0031-1290110; Art ID: D29711ST
© Georg Thieme Verlag Stuttgart · New York