11252 J. Phys. Chem. B, Vol. 110, No. 23, 2006
Wu and Shi
tilt angle by combination of the electrochemical technique and
surface reaction. The method described here can be easily
extended to any other substrates, such as stainless steel, silicon
wafer, glass, and PTFE, for fabricating thermally stable super-
hydrophobic coatings. Moreover, as electroplating of copper film
is a low-cost and mature technology in industry, the method
described here can be easily magnified to a large scale. Fur-
thermore, we successfully applied the fabrication method of
superhydrophobic copper wires with submicrofibers structures,
which is similar to the leg of water striders. The superhydro-
phobic wire causes a much larger curvature force than that of
a thiol-treated smooth copper wire. This work may help us to
understand why water strider can move quickly on the water
surface and why it chooses the hierarchical structure of
micrometer-sized tiny hairs with fine nanogrooves.
(7) Chen, W.; Fadeev, A. Y.; Heieh, M. C.; Oner, D.; Youngblood, J.;
McCarthy, T. J. Langmuir 1999, 15, 3395-3399.
(8) Onda, T.; Shibuichi, S.; Satoh, N.; Tsujii, K. Langmuir 1996, 12,
2
125-2127.
(9) (a) Shirtcliffe, N. J.; McHale, G.; Newton, M. I.; Chabrol, G.; Perry,
C. C. AdV. Mater. 2004, 16, 1929-1932. (b) Shirtcliffe, N. J.; McHale, G.;
Newton, M. I.; Perry, C. C. Langmuir 2005, 21, 937-943.
10) Jiang, Y.; Wang, Z.; Yu, X.; Shi, F.; Xu, H.; Zhang, X. Langmuir
005, 21, 1986-1990.
(11) Zhang, X.; Shi, F.; Yu, X.; Liu, H.; Fu, Y.; Wang, Z. Q.; Jiang, L.;
(
2
Li, X. Y. J. Am. Chem. Soc. 2004, 126, 3064-3065.
12) Han, J. T.; Jang, Y.; Lee, D. Y.; Park, J. H.; Song, S. H.; Ban, D.
Y.; Cho, K. J. Mater. Chem. 2005, 15, 3089-3092.
13) Zhai, L.; Cebeci, F. C.; Cohen, R. E.; Rubner, M. F. Nano Lett.
2004, 4, 1349-1353.
14) Li, H.; Wang, X.; Song, Y.; Liu, Y.; Li, Q.; Jiang, L.; Zhu, D.
Angew. Chem., Int. Ed. 2001, 40, 1743-1746.
15) Feng, L.; Li, S.; Li, Y.; Li, H.; Zhang, L.; Zhai, J.; Song, Y.; Liu,
B.; Jiang, L.; Zhu, D. AdV. Mater. 2002, 14, 1857-1860.
16) Tadanaga, K.; Morinaga, J.; Matsuda, A.; Minami, T. Chem. Mater.
2000, 12, 590-592.
17) Lau, K. K. S.; Bico, J.; Teo, K. B. K.; Chhowalla, M.; Amaratunga,
G. A. J.; Milne, W. I.; McKinley, G. H.; Gleason, K. K. Nano Lett. 2003,
(
(
(
(
(
Acknowledgment. This work was supported by the National
Natural Science Foundation of China (50533030, 90401011,
(
2
0374034, 50225311) and 973 project (2003CB615700). We
3
, 1701-1705.
thank Prof. X. Zhang and Mr. F. Shi (Tsinghua University
China) for useful discussions and help with the contact angle
measurements.
(18) Wu, X. F.; Shi, G. Q. Nanotechnology 2005, 16, 2056-2060.
(19) Li, M.; Zhai, J.; Liu, H.; Song, Y.; Jiang, L.; Zhu, D. J. Phys. Chem.
B 2003, 107, 9954.
20) Yan, H.; Kurogi, K.; Mayama, H.; Tsujii, K. Angew. Chem., Int.
Ed. 2005, 44, 3453.
21) Gu, Z. Z.; Uetsuka, H.; Takahashi, K.; Nakajima, R.; Onishi, H.;
Fujishima A.; Sato, O. Angew. Chem., Int. Ed. 2003, 42, 894.
22) Erbil, H. Y.; Demirel, A. L.; Avci, Y.; Mert, O. Science 2003, 299,
377.
23) Hu, D. L.; John, B. C.; Bush, W. M. Nature 2003, 424, 663.
24) Dickinson, M. Nature 2003, 424, 621.
(25) Gao, X. F.; Jiang, L. Nature 2004, 432, 36.
26) Shi, F.; Wang, Z. Q.; Zhang, X. AdV. Mater. 2005, 17, 1005.
27) Wu, X. F.; Bai, H.; Zhang, J. X.; Chen, F. E.; Shi, G. Q. J. Phys.
Chem. B 2005, 109, 22836.
28) Cudennec, Y.; Lecert, A. Solid State Sci. 2003, 5, 1471-1474.
29) Ang, T. P.; Wee, T. S. A.; Chin, W. S. J. Phys. Chem. B 2004,
08, 11001-11010.
30) Bensebaa, F.; Zhou, Y.; Deslandes, Y.; Kruus, E.; Ellis, T. H. Surf.
Sci. 1998, 405, L472-L476.
31) Moulder, J. F. Handbook of X-ray photoelectron spectroscopy;
Perkin-Elmer Physical Electronics Division, 1992.
(
Supporting Information Available: Detailed information
of the water contact angle at different treated temperature.
This material is available free of charge via the Internet at
http://pubs.acs.org.
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(
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References and Notes
(
(
(
1) Nakajima, A.; Hashimoto, K.; Watanabe, T. Monatsh. Chem. 2001,
32, 31-41.
2) Lam, P.; Wynne, K. J.; Wnek, G. E. Langmuir 2002, 18, 948-
1
(
51.
(
(
9
(
3) Nakajima, A.; Fujishima, A.; Hashimoto, K.; Watanabe, T. AdV.
1
Mater. 1999, 11, 1365-1368.
(
(
4) (a) Morra, M.; Occhiello, E.; Garbassi, F. Langmuir 1989, 5, 872-
8
76. (b) Morra, M.; Occhiello, E.; Garbassi, F. J. Colloid Interface Sci.
(
1
989, 132, 504.
(5) (a) Erbil, H. Y.; Demirel, A. L.; Avci, Y.; Mert, O. Science 2003,
(
(
32) Wenzel, R. N. Ind. Eng. Chem. 1936, 28, 988.
2
99, 1377-1380. (b) Ma, M. L.; Hill, R. M.; Lowery, J. L.; Fridrikh, S.
33) Lafuma, A.; Quere, D. Nat. Mater. 2003, 2, 457-460.
V.; Rutledge, G. C. Langmuir 2005, 21, 5549-5554. (c) Feng, L.; Li, S.;
Li, H.; Zhai, J.; Song, Y.; Jiang, L.; Zhu, D. Angew. Chem., Int. Ed. 2002,
(34) Cassie, A. B. D.; Baxter, S. Trans. Faraday Soc. 1944, 40, 546-
4
1, 1221-1223. (d) Feng, L.; Song, Y.; Zhai, J.; Liu, B.; Xu, J.; Jiang, L.;
Zhu, D. Angew. Chem., Int. Ed. 2003, 42, 800-802.
6) Jiang, L.; Zhao, Y.; Zhai, J. Angew. Chem., Int. Ed. 2004, 43, 4338-
341.
551.
(35) He, Y.; Wu, X. F.; Lu, G. W.; Shi, G. Q. Nanotechnology, 2005,
16, 791-796.
(36) Keller, J. B. Phys. Fluids 1998, 10, 3009.
(
4