F. Wang et al. / Electrochimica Acta 51 (2006) 4250–4254
4251
operating parameters for fabricating the Fe–Pd thin films with
about 30 at.% Pd. Subsequently, by X-ray diffractometer (XRD),
scanning electron microscope (SEM) and high-resolution trans-
mission microscope (HR-TEM), the microstructures and the
thermoelastic behaviors of the films have been investigated in
detail.
2
. Experimental
The plating bath consisted of 0.1875 mol l FeSO4·7H2O
−
1
−
1
and 0.0125 mol l PdCl2·6H2O as the source of metal ions
2
+
2+
−1
−1
(
(
Fe /Pd = 15:1). In addition to the metal salts, 0.375 mol l
NH4)2C4H4O , 0.0625 mol l C H8O7·H2O and 0.30 mol l
−
1
6
6
−
1
NH3·H2Owereemployedasacomplexagents, while0.6 mol l
NH4Cl was added as the supporting electrolyte. The pH of plat-
ing bath was finally adjusted to 8.0 with dilute NH3·H2O. The
Fe–Pd thin films were electrodeposited on Pt buffer layers with
3
0 nm thickness, which were grown on Cr-seeded Si substrates.
The buffer/seed layers were deposited by the sputtering method.
The anode material was a titanium grid coated with platinum.
−1
Fig. 1. Voltammetric curves for deposition of Fe and Pd: (a) 0.1875 mol l
−
2
2
+
−1
2+
−1
The current density was ranged from 8.0 to 30 mA cm , and all
Fe ; (b) 0.1875 mol l
(c) 0.0125 mol l
Fe + 0.375 mol l
(NH ) C H O + NH ·H O;
4
2
4
4
6
3
2
◦
−1
Pd2+
−1
2+
−1
the deposition processes were performed at 25 C under the total
;
(d) 0.0125 mol l
Pd + 0.0625 mol l
−
1
−
2
C H O ·H O + NH ·H O; (e) (b) + (d). Supporting electrolyte: 0.6 mol l
6
8
7
2
3
2
electric charge of 10 C cm . The plating cell was a beaker of
00 cm with magnetic stirrer agitation. Finally, the as-deposited
films were sealed in a quartz tube, and heated at 900 C for
−
1
NH4Cl. Scan rate: 2 mV s
.
3
2
◦
4
5 min followed by quenching into iced water.
Polarization behaviors of the plating baths were measured
voltammetric curves for Fe–Pd electrodeposition at the temper-
◦
2+
2+
ature of 25 C. The deposition potentials of Fe and Pd were
compared with those of the solutions without complexing agent.
using an automatic polarization system (Hz-3000, Hokuto
Denko) with an Ag/AgCl electrode as the reference electrode.
All curves were measured at the scanning rate of 2 mV s
The chemical compositions of thin films were measured by
the energy dispersive X-ray analysis (EDX) (JED-2001, JEOL)
performed in a JOEL JEM-6100 scanning electron microscope.
The structures of the deposited films were determined by X-ray
diffractometer (XRD) (M21X TXJ-FO88, MAC Science) and
a high-resolution transmission microscope (HR-TEM) (JEM-
As can be seen, the deposition potentials of Fe2 and Pd are
shifted toward more negative potential by the complex formation
with ammonium tartrate, citric acid monohydrate and ammonia
+
2+
−
1
.
2+
solution, and the potential shift of Pd by complex formation is
2
+
2+
significantly larger than that of Fe . Deposition of the Pd is
2
+
markedly inhibited by the formation of [Pd(NH3)4] complex
ions between Pd2 and NH3·H2O since the complex ions cannot
+
2
+
be reduced as easilyas the free Pd . It is evidentthatthe addition
of complexing agents in the plating baths causes the deposition
2
000FE, JEOL). To characterize the thermoelastic behaviors
of the quenched Fe–Pd films, in situ observation of crystal
structures was performed on the thermal cycling between room
potentials of Fe2 and Pd shift to close with each other, thus
+
2+
2
+
2+
◦
promoting the co-deposition of Fe and Pd . Moreover, it is
observed that the deposition of Pd2 in plating bath contain-
ing complexing agents starts at about −0.65 V versus Ag/AgCl,
while that of Fe2 starts at about −1.1 V versus Ag/AgCl. The
temperature (RT) and −160 C using the X-ray diffraction tech-
+
nique. Magnetization measurements were performed with a
vibrating sample magneto-meter (VSM-5-18, Toei).
+
co-deposition of Fe2 and Pd starts at about −1.1 V versus
+
2+
3
. Results and discussion
2
+
Ag/AgCl. This indicates that for the co-deposition of Fe and
2+
Pd under galvanostatic condition, the cathodic current density
3
.1. Potentiodynamic studies of Fe–Pd electrodeposition
−2
should be controlled to be larger than 5.0 mA cm . The voltam-
metric measurement results demonstrate the effectiveness of the
addition of complexing agents in the plating baths for achiev-
ing the co-deposition of iron and palladium from the aqueous
solutions.
In Fe–Pd, electrodeposition system, it is difficult to obtain
Fe–Pd thin films from the plating baths only containing sim-
ple metal ions since the standard electrode potentials of iron
and palladium differ by approximately 1.4 V. In order to bring
the potentials of iron and palladium close enough to achieve
the co-deposition, ammonium tartrate, citric acid monohydrate
and ammonia solution were used to form complexes with metal
ions in the plating baths. All the plating baths prepared in the
present study showed superior electrochemical stability, thereby
allowing the preparation of Fe–Pd thin films. Fig. 1 shows
3.2. Preparation and characterization of Fe–Pd thin films
Fig. 2 shows the current density-dependence of Pd content
in the Fe–Pd films. A decrease of the Pd content in deposit was
achieved by an increase of cathodic current density. This sug-