A.M. El-Sherik et al. / Journal of Alloys and Compounds 389 (2005) 140–143
143
Table 3
ronment coupled with its enhancement of fatigue strength
of the underlying substrate, manufacturers and end-users of
protective coatings may benefit from nanoprocessed nickel
electrodeposits.
Calculated internal stresses for nanocrystalline and microcrystalline nickel
electrodeposits with and without various substrates as measured by XRD
using Cu K-diffraction from (3 1 1) planes
Sample
Lattice mismatch
(%)
Internal stress
(kg/mm2)
Internal stress
(MPa)
Ni-1
Ni-2
Ni-3
Ni-4
Ni-5
Ni-6
2.51
−46.12
−80.05
−85.85
−14.60
−68.48
−76.17
−452.3
−785.1
−841.9
−143.2
−671.6
−747.0
Acknowledgement
17.20
18.66
18.66
N/A
The financial support of the Natural Sciences and Engi-
neering Research Council of Canada is gratefully acknowl-
edged.
N/A
Table 4
Room temperature coefficient of thermal expansion of the materials studied
in the present work
References
Material
Thermal expansion
coefficient
[1] S. Srmyanov, Defect Structure, in: H. Merchant (Ed.), Morphology
and Properties of Deposits, 1995, p. 273.
[2] J.W. Dini, Electrodeposition, in: The Materials Science of Coatings
and Substrates, Noyes Publications, Park Ridge, New Jersey, U.S.A.,
1993.
[3] J.K. Dennis, T.E. Such, Nickel and Chromium Plating, Woodhead
Publishing Ltd., Cambridge, England, 1972.
Copper
17.1
19.9
12.2
13.2
Brass (70Cu–30Zn)
Steel (0.23C, 0.6Mn)
Nickel
[4] C.O. Rudd, R.J. McDowell, D.J. Snoha, Powder Diffr. 1 (1986) 22.
[5] R. Mitra, R.A. Hoffman, A. Madan, J.R. Weertman, J. Mater. Res.
16 (2001) 1010.
[6] M.K. Minor, J.A. Barnard, J. Cryst. Growth 174 (1997) 501.
[7] P.G. Sanders, A.B. Witney, J.R. Weertman, R.Z. Vasiliev, R.W.
Seigel, Mat. Sci. Eng. A204 (1995) 7.
[8] F. Cerwinski, Electrochem. Acta 44 (1998) 6671.
[9] T. Yamasaki, Mater. Phys. Mech. 1 (2000) 127.
[10] C. Lamstaes, M. Sternitzke, L. Carroll, B. Derby, Ceram. Eng. Sci.
Proc. 17 (1996) 239.
[11] U. Erb, A.M. El-Sherik, G. Palumbo, K.T. Aust, Nanostruct. Mater.
2 (1993) 383.
[12] C. Cheung, G. Palumbo, U. Erb, Scripta Metall. et Mater. 31 (1994)
735.
[13] D. Osmola, E. Renaud, U. Erb, L. Wong, G. Palumbo, K.T. Aust,
Mat. Res. Soc. Symp. Proc. 286 (1993) 191.
[14] C. Cheung, U. Erb, G. Palumbo, Mat. Sci. Eng. A185 (1994) 39.
[15] A.M. El-Sherik, U. Erb, Plat. Surf. Finish. 82 (1995) 85.
[16] Nanocrystalline Metals, A.M. El-Sherik and U. Erb, U.S. Patent No.
5,352,266 (1994).
[17] A.M. El-Sherik, U. Erb, G. Palumbo, K.T. Aust, Scripta Metall. et
Mater. 27 (1992) 1185.
compressive stresses. The presence of compressive inter-
(polycrystalline) nickel electrodeposits [4] as well as in
nanoprocessed deposits which is in agreement with published
literature for nickel deposits prepared from Watts’ baths con-
taining sulfur-containing organic compounds [29,30] such as
saccharin. However, compressive stresses in microcrystalline
nickel deposit (Ni-4) prepared from additive-free Watts’ bath
isincontradictionwithpublishedliteraturefornickeldeposits
produced from similar baths using conventional DC plating.
This may be explained in terms of the effect of pulse plating
on decreasing the hydrogenation of the coatings. It can also be
seen from this table that the internal compressive stresses in
nanoprocessed nickel coatings increase with increasing coat-
ing/substrate lattice misfit. This is expected as the stresses
from distortion due to differences in lattice parameters at the
interface between the coating and substrate (Tables 3 and 4).
Comparison of samples Ni-5 and Ni-6 deposited from baths
A and B, respectively, shows that Ni-5 has lower internal
stresses. This may be attributed to the presence of the surfac-
tant SLS in bath A leading to low hydrogenation of deposit
Ni-5.
[18] A.T. Alpas, Private Communication, (1994).
[19] R. Rofagha, R. Langer, A.M. El-Sherik, U. Erb, G. Palumbo, K.T.
Aust, Scripta Metall. et Mater. 25 (1991) 2867.
[20] R. Rofagha, R. Langer, A.M. El-Sherik, U. Erb, G. Palumbo, K.T.
Aust, MRS Symp. Proc. 238 (1992) 751.
[21] O.E. Hall, Proc. Phys. Soc. London B64 (1951) 747.
[22] N.J. Petch, J. Iron Steel Inst. 25 (1953) 174.
[23] A.M. El-Sherik, U. Erb, J. Mat. Sci. 30 (1994) 5743.
[24] Test Method B 571-91, ASTM, Philadelphia, PA 19103.
[25] Test Method B 117-90, ASTM, Philadelphia, PA 19103.
[26] B.D. Cullity, Elements of X-ray Diffraction, Second Edition,
Addison-Wesley Publication, Reading, MA, 1978.
[27] H.P. Klug, L.E. Alexander, X-ray Diffraction Procedures for Poly-
crystalline and Amorphous Materials, 2nd Edition, Wiley, New York,
1974.
[28] R. Weil, H.C. Cook, J. Electrochem. Soc. 109 (1962) 295.
[29] J.K. Denis, J.J. Fuggle, Electroplat. Met. Fin. 20 (1967) 376.
[30] J.K. Denis, J.J. Fuggle, Electroplat. Met. Fin. 21 (1968) 16.
[31] T.R. Haasz, K.T. Aust, G. Palumbo, A.M. El-Sherik, U. Erb, Scripta
Metall. et Mater. 32 (1995) 432.
4. Conclusions
For the conditions studied in this work, all nickel deposits
contained compressive internal stresses. The internal stresses
in nanoprocessed (10 nm) nickel coatings are affected by sub-
strate type. Furthermore, the nanoprocessed coatings showed
about six times (−841.9 MPa) the internal stress of micro-
crystalline (5000 nm) nickel (−143.2 MPa) with a similar
substrate type. Given the excellent wear resistance, undimin-
ished adhesion and corrosion resistance to salt spray envi-