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T.-I. Leong et al. / Electrochimica Acta 56 (2011) 3941–3946
tial. Following each deposition experiment, the resulting deposit
was rinsed with deionized water to remove residual IL and then
dried. The diffraction peaks in the XRD pattern of a typical deposit
were sharp, as shown in Fig. 6, indicating the crystallinity to be
good. EDX reveals that in addition to Sn and Cu substrate, some
contaminated when exposed to the ambient atmosphere during
the deionized water rinsing procedure after deposition. The SEM
micrographs of the surface morphologies of the Sn-deposited sam-
ples are shown in Fig. 7. As can be seen, Sn deposits with interesting
morphologies which varied with the deposition potential are pro-
duced. At −0.65 V where the deposition is most likely to proceed
in the charge-transfer controlled region the surface is covered by
hollow hexagonal tubes with diameter of about 500 nm. When the
deposition rate is raised by changing the deposition potential to
−0.75 V, a layer of sponge formed by entangled wires is apparent.
Further change the deposition potential to make the deposition
to be performed in the mass-transport limited region, −0.84 V,
dendrite structures are obtained. While most previous studies on
electrodeposition of metals from ILs focused on the deposition of
dense and compact coatings, the growth of hollow tubes, entan-
trodeposition in aqueous electrolytes, the hollow tubes and wires
obtained in this study is rare. These unusual morphologies may
be related to the nature of both DCA− anion and tin. As has been
pointed out by Martindale et al. [23] the morphology of the Sn
deposit is dependent of the anion of the ILs.
magnitude as those reported for SnCl2 in several other ILs. Further-
more, Sn deposits with unusual morphologies especially hexagonal
hollow tubes are obtained by potentiostatic electrolysis at various
potentials.
Acknowledgement
This work was funded by the National Science Council of Repub-
lic of China, Taiwan (Grant no. NSC 99-2113-M-006-002-MY3)
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