043113-3
Tutuc, Guha, and Chu
Appl. Phys. Lett. 88, 043113 ͑2006͒
structure similar to that of Fig. 3͑b͒, except that the shell
thickness was 12 nm thick. The nanowires were dispersed on
a highly conductive Si substrate with a 30nm-thick thermally
grown oxide. Using standard electron-beam lithography fol-
lowed by lift-off we patterned Ni leads in order to contact the
nanowires. Our measurements show that B-doped Ge nano-
wires exhibit resistor-like I−V characteristics and show very
little change to a voltage applied to Si substrate, which acts
as a backgate here. Since undoped Ge nanowires are insulat-
ing in the same transport configuration, we conclude that the
transport in the B-doped Ge nanowire occurs in the B-doped
shell. In order to quantify the dopant concentration in the
B-doped Ge shells, we have scaled the measured resistance
of the B-doped Ge nanowires by the wire length as well as
by the shell cross-section area, in order to measure the shell
resistivity. The result is =0.001–0.004 ⍀ cm. These num-
bers correspond to a carrier concentration of 0.7–4
ϫ1019 cm−3 for the B-doped Ge shell.11
responding to a ratio Rv /RlӍ180. While this ratio still indi-
cates a significant wire tapering compared to the undoped
case, the lower B2H6 dilution clearly results in less of a
nanowire tapering.
In summary we have presented an unusual growth
mechanism of Ge nanowires exposed to B2H6, which results
in a highly doped shell growth, and also quantified the B
incorporation in the Ge shell. Our study point out that the
doping of Ge nanowires may not be straightforward, and
substantially complicate attempts to modulate the doping
profile along the wire. On the other hand, these findings
open-up possibilities of a low temperature core/dielectric/
gate in situ field effect transistor growth.
The authors thank J. Hannon, F. M. Ross, Guy Cohen,
M. C. Reuter, and J. Ott for illuminating discussions and
technical assistance. This work was supported in part by
DARPA/SPAWAR contract No. N66001-05-C-8043.
The B-enhanced, highly doped Ge conformal growth
shown in Fig. 3 opens up the tantalizing possibility of a low
temperature, Ge nanowire based, cylindrical metal-oxide-
semiconductor field effect transistor growth. For example, in
the first stage an undoped Ge nanowire growth is used to
create the Ge core which serves as the transistor’s channel.
Next, a low temperature conformal dielectric growth, e.g.,
atomic layer depositions of Al2O3, followed by a highly
B-doped Ge shell, will create the dielectric and the gate,
respectively. The undoped wire acts a the semiconducting
channel, while the highly doped Ge shell acts as gate, much
like the highly doped, polycrystalline Si gates used in current
CMOS technology.
Finally, we comment on the role of B2H6 concentration
in enhancing the conformal Ge deposition at low temperature
and the ensuing nanowire tapering. Our experiments were
focused on a relatively high, 1% concentration of the B2H6
precursor. To explore the effect of B2H6 dilution, we have
performed a similar growth to that of Fig. 2 except for a
lower B2H6 concentration: namely T=285 °C, 60 sccm
GeH4 ͑10%͒, 2 sccm B2H6 ͑20 ppm͒, and total pressure 5
Torr. In these conditions, our results show conformal Ge
deposition of about 20 nm/h, and Ge nanowire tapering cor-
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