APPLIED PHYSICS LETTERS 94, 212902 ͑2009͒
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Dahlang Tahir,
Eun Kyoung Lee, Suhk Kun Oh, Tran Thi Tham, Hee Jae Kang,
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Hua Jin, Sung Heo, Ju Chul Park, Jae Gwan Chung, and Jae Cheol Lee
Department of Physics, Chungbuk National University, Cheongju 361-763, Republic of Korea
Advanced Surface Chemical Analysis Group, National Institute for Materials Science, 1-2-1 Sengen,
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Tsukkuba, Ibaraki 305-0047, Japan
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Analytical Engineering Center, Samsung Advanced Institute of Technology, Suwun 440-600,
Republic of Korea
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Received 8 February 2009; accepted 6 May 2009; published online 27 May 2009͒
The band alignment for atomic layer deposited ͑ZrO ͒ ͑SiO ͒
͑x=1.0, 0.75, 0.5, 0.25͒ gate
2 1−x
2
x
dielectric thin films grown on Si ͑100͒ was obtained by using x-ray photoelectron spectroscopy and
reflection electron energy loss spectroscopy. The band gap, conduction band offset, and the valence
band offset for ZrO thin film were 5.30, 1.83, and 2.35 eV, respectively. These values for Zr
2
silicates with x more than 0.5 are independent of SiO concentration but both holes and electrons
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have more symmetric barrier heights when x=0.25. The Zr silicate dielectrics are strongly affected
͓
The rapid scaling down of silicon-based metal-oxide-
semiconductor field effect transistor ͑MOSFET͒ devices in-
volves a reduction of gate insulator thickness below 2 nm,
reduces the insulating behavior of the gate dielectrics. In
order to avoid this undesirable physical phenomenon, several
alternative dielectrics have been proposed and investigated to
tunneling current through the gate oxide. There are two main
parameters for us to consider in reducing the tunneling cur-
rent. The first parameter is the physical thickness of dielec-
trics, and the second parameter is the proper band offset with
respect to Si. Hence, the band alignment is one of the most
fundamental physical properties needed in characterizing the
gate dielectrics. In addition to an adequate large band gap for
alternative high-k materials, asymmetry in barrier height be-
tween holes and electrons is a potentially significant limita-
tion for the operation and reliability of MOSFET devices and
circuits. To get a clear insight into the electrical properties
for thin high-k gate stack on Si, a better understanding for
the chemical and electronic structure of Zr silicates high-k
dielectrics is necessary, e.g., we need to characterize their
electronic structures such as band gap and band offsets on
nanometer-scale spatial resolution. In order to use Zr sili-
cates gate dielectrics materials in complimentary MOSFETs,
they should have sufficiently high tunneling barriers ͑at least
replace conventional SiO gate oxides. The basic criteria for
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gate dielectrics include barrier heights that will effectively
block holes and electrons, chemical stability in contact with
both silicon substrate and gate materials, and a low density
interface electronic states. Among many possible candidates,
transition metal ͑TM͒ oxides Hafnium dioxide ͑HfO ͒ and
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zirconium dioxide ͑ZrO ͒ with high dielectric constant of
2
2
gate dielectric. Even though they have higher dielectric
permittivity and good thermal stability with the Si at higher
temperatures, they tend to crystallize at relatively low tem-
peratures during postdeposition annealing, and hence there is
a definite need for further improvement. For this reason,
amorphous Zr and Hf based complex oxides have been in-
tensively studied because of their composition-tunable struc-
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eV from silicon͒ of both electrons and holes to inhibit
conduction through Schottky emission of carriers into their
bands. These barriers correspond to conduction and valence
band offsets between the semiconducting silicon substrate
and insulating dielectrics. The energy band alignment of Zr
compounds with Si is essential in understanding the transport
properties of MOSFET devices based on Zr compound di-
electrics. So far, band gap and band offset values of Zr sili-
cates have not been experimentally investigated adequately.
Hence, we would like to investigate the band gap, conduc-
tures and significant improvement in electrical properties.
Furthermore, the incorporation of SiO into TM oxides lends
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help for the stabilization of an amorphous TM silicates struc-
ture and for avoiding the formation of low-k interfacial oxide
layers. In addition to the TM silicates, rare-earth ͑RE͒ sili-
cates, and aluminates, binary alloy between TM and RE ox-
ide or two different TM or RE oxides have been also inves-
tigated recently to improve properties since the
tion and valence band offsets of ͑ZrO ͒ ͑SiO ͒ thin films
2 x
2 1−x
by using reflection electron energy loss spectroscopy
REELS͒ and x-ray photoelectron spectroscopy ͑XPS͒ mea-
surements.
ZrO and ͑ZrO ͒ ͑SiO ͒ thin films were grown on
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band gaps.
Zr silicates are other widely investigated ma-
terials because they have many attractive features. The pri-
2
2 1−x
2 x
mary goal of replacing SiO by a high-k material is to reduce
p-Si ͑100͒ substrate by atomic layer deposition method. Prior
to growing mixed oxide films, p-type Si substrates were
cleaned using the Radio Corporation of America method.
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a͒Present address: Department of Physics, Hasanuddin University, Makassar,
Zr͓N͑CH ͒͑CH CH ͔͒ and SiH͓N͑CH3͒2͔3 were used as
90245, Indonesia.
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4
b͒
Electronic mail: hjkang@cbu.ac.kr.
precursors for ZrO and SiO , respectively, and O vapor
2 2 3
0
003-6951/2009/94͑21͒/212902/3/$25.00
94, 212902-1
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