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GALVANOSTATIC PULSE PLATING OF COPPER AND COPPER (I) HALIDES FROM ACID COPPER (II) HALIDE SOLUTIONS.

DOI: 10.1149/1.2119804

Source and publish data:

Journal of the Electrochemical Society p. 786 - 790 (1983)

Update date:2022-08-12

Topics:

Authors:

YeowYeow

HibbertHibbert

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Article abstract of DOI:10.1149/1.2119804

CuX (X equals Cl or Br) is formed during the galvanostatic pulse plating of copper from acid solutions containing Cu**2** plus and X** minus . The reaction Cu**2** plus plus Cu degree plus 2X** minus yields 2CuX occurs in the relaxation period of the puls

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Full text of DOI:10.1149/1.2119804

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Downloaded on 2015-05-30 to IP 137.99.31.134 address. Redistribution subject to ECS terms of use (see ecsdl.org/site/terms_use) unless CC License in place (see abstract).  
Evaluation Only. Created with Aspose.PDF. Copyright 2002-2021 Aspose Pty Ltd.  
Downloaded on 2015-05-30 to IP 137.99.31.134 address. Redistribution subject to ECS terms of use (see ecsdl.org/site/terms_use) unless CC License in place (see abstract).  
Evaluation Only. Created with Aspose.PDF. Copyright 2002-2021 Aspose Pty Ltd.  
Downloaded on 2015-05-30 to IP 137.99.31.134 address. Redistribution subject to ECS terms of use (see ecsdl.org/site/terms_use) unless CC License in place (see abstract).  
Evaluation Only. Created with Aspose.PDF. Copyright 2002-2021 Aspose Pty Ltd.  
Downloaded on 2015-05-30 to IP 137.99.31.134 address. Redistribution subject to ECS terms of use (see ecsdl.org/site/terms_use) unless CC License in place (see abstract).  

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