C O M M U N I C A T I O N S
Table 1. Device Parameters for Functionalized Pentacene and
Anthradithiophene OFETs (1-4) and Degree of π-Overlap for 1-3
µ
π
-overlap
(Å2)
lateral slip
(Å)
(cm2/V
‚s)
Ion/Ioff
1
2
3
4
0.17
105
103
107
NA
7.73
2.23
1.57
(no overlap)
0.9, 1.7
1.2
2.75, 1.76
(no π-overlap)
<10-4
1.0
NA
serving as gate electrode and dielectric. Gold source and drain
contacts were evaporated to yield devices with a channel length of
22 µm and a channel width of 340 µm. The gold electrodes were
then treated with pentafluorobenzenethiol to improve the electrode
interface.11 A 1-2 wt % solution of the acene in toluene was spread
across the device surface using a plastic blade, and the solvent was
allowed to evaporate. The devices were then heated in air at 90 °C
for 2 min to drive off residual solvent. All measurements were
performed in air at room temperature, and mobilities were calculated
from the saturation currents.
Pentacene 1 yielded devices with hole mobility of 0.17 cm2/V‚s
and an on/off current ratio of 105. These values are similar in
magnitude to those obtained from a vapor-deposited film of the
same material, likely due to the strong templating effect of the silyl
group. The anthradithiophene derivatives present an excellent study
of how subtle changes in functionalization lead to significant
differences in device performance. Triisopropylsilyl derivative 2
formed uniform thin films from solution, but they were amorphous:
the best mobility measured was <10-4 cm2/V‚s. In contrast,
triethylsilyl compound 3 formed uniform films of excellent quality,
yielding hole mobility of 1.0 cm2/V‚s with an excellent on/off
current ratio (107). The performance of this material is likely due
to the close π-stacked interactions in the crystal.10b Trimethylsilyl
derivative 4 formed needlelike crystals on the substrate, leading to
poor coverage and no transistor action. Clearly, the ability to form
high-quality films is essential to device performance, and the
strength of π-stacking interactions in the solid may influence the
uniformity of the solution-cast film.
Apparent in the ID-VDS plots for both 1 and 3 (Figure 2) is that
the performance of these devices is strongly contact-limited. High
source contact resistance is common in OFETs and can cause
current compression of ID for small VDS and high VG.12 Charge
injection limited by space charges near the source may also result
in the concave-down nonlinearity of ID for small VDS (as is seen
for 3).13 Addition of the silylethynyl groups to the aromatic core
increases the oxidation potential (and thus the HOMO energy level)
of these molecules by >300 mV versus the parent hydrocarbons.
While this increase may play a role in the improved oxidative
stability of the molecules, it also hampers hole injection into the
film.
Figure 2. Electrical characterization for OFETs of functionalized pentacene
1 (top) and anthradithiophene 3 (bottom). Left: plot of drain current (ID)
versus drain-source voltage (VDS). Right: plot of ID and ID versus gate-
1/2
source voltage (VGS).
development of new materials for organic electronics. We are
currently investigating modifications of 1 and 3 to improve the
efficiency of charge injection.
Acknowledgment. This research was supported by the Office
of Naval Research and DARPA (J.E.A.), and the National Science
Foundation (T.N.J.).
Supporting Information Available: Experimental details and cif
files. This material is available free of charge via the Internet at http://
pubs.acs.org.
References
(1) Reese, C.; Roberts, M.; Ling, M.-M.; Bao, Z. Mater. Today 2004, 20.
(2) For a review, see: Sheats, J. R. J. Mater. Res. 2004, 19, 1974.
(3) (a) Nelson, S. F.; Lin, Y.-Y.; Gundlach, D. J.; Jackson, T. N. Appl. Phys.
Lett. 1998, 72, 1854. (b) Li, X.-C.; Sirringhaus, H.; Garnier, F.; Holmes,
A. B.; Moratti, S. C.; Feeder, N.; Clegg, W.; Teat, S. J.; Friend, R. H. J.
Am. Chem. Soc. 1998, 120, 2206. (c) Meng, H.; Bao, Z.; Lovinger, A. J.;
Wang, B.-C.; Mujsce, A. M. J. Am. Chem. Soc. 2001, 123, 9214.
(4) (a) Afzali, A.; Dimitrakopoulos, C. D.; Breen, T. L. J. Am. Chem. Soc.
2002, 124, 8812. (b) Herwig, P.; Mu¨llen, K. AdV. Mater. 1999, 11, 480.
(c) Murphy, A. R.; Fre´chet, J. M. J.; Chang, P.; Lee, J.; Subramanian, V.
J. Am. Chem. Soc. 2004, 126, 1569.
(5) Mas-Torrent, M.; Durkut, M.; Hadley, P.; Ribas, X.; Rovira, C. J. Am.
Chem. Soc. 2004, 126, 984.
(6) Anthony, J. E.; Brooks, J. S.; Eaton, D. L.; Parkin, S. R. J. Am. Chem.
Soc. 2001, 124, 8812.
(7) Payne, M. M.; Odom, S. A.; Parkin, S. R.; Anthony, J. E. Org. Lett. 2004,
6, 3325.
(8) Sheraw, C. D.; Jackson, T. N.; Eaton, D. L.; Anthony, J. E. AdV. Mater.
2003, 15, 2009.
(9) Anthony, J. E.; Eaton, D. L.; Parkin, S. R. Org. Lett. 2002, 4, 15.
(10) (a) Laquindanum, J. G.; Katz, H. E.; Lovinger, A. J. J. Am. Chem. Soc.
1998, 120, 664. (b) Kwon, O.; Coropceanu, V.; Gruhn, N. E.; Durivage,
J. C.; Laquindanum, J. G.; Katz, H. E.; Cornil, J.; Bre´das, J. L. J. Chem.
Phys. 2004, 120, 8186. (c) Katz, H. E.; Li, W.; Lovinger, A. J.;
Laquindanum, J. Synth. Met. 1999, 102, 897.
On/off current ratios for all of these materials are high, on the
order of 105-107. Compound 3, in particular, has very low
conductivity in the “off” state, which speaks to the purity of the
material, as well as the absence of oxidative doping of the films.
The majority of OFET materials attain the required level of purity
from repeated sublimation, which can be a loss-type process. The
materials presented here were purified by recrystallization, which
is a simple and scalable purification process. This combination of
simple synthesis, easy purification, and ability to form high-quality
devices from solution-deposited films is an important step in the
(11) Gundlach, D. J.; Jia, L.; Jackson, T. N. IEEE Electron. DeV. Lett. 2001,
18, 571.
(12) Klauk, H.; Schmid, G.; Radlik, W.; Weber, W.; Zhou, L.; Sheraw, C. D.;
Nichols, J. A.; Jackson, T. N. Solid-State Electron. 2003, 47, 297.
(13) Kanicki, J.; Libsch, F. R.; Griffith, J.; Polastre, R. J. Appl. Phys. 1991,
69, 2339.
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