13676-54-5Relevant articles and documents
Study of Diels–Alder reactions between furan and maleimide model compounds and the preparation of a healable thermo-reversible polyurethane
Truong, Thuy Thu,Nguyen, Ha Tran,Phan, Man Ngoc,Nguyen, Le-Thu T.
, p. 1806 - 1814 (2018)
A study of the reactions between various furan and maleimide model compounds and the effects of reaction conditions was performed, allowing for a proper design and preparation of a thermo-reversible polyurethane (PU) material crosslinked via Diels–Alder (DA) bonds. Thus, a linear polyurethane containing furan groups along the main chain was synthesized and crosslinked with a bismaleimide by means of DA reaction. The obtained thermoset exhibited thermo-reversibility as evidenced by DSC and FTIR microscopy, providing the material recyclability and scratch healability. Optical microscopy, SEM and tensile analysis of a scratched PU film revealed that efficient scratch healing was enabled by heating at 110 °C for 30 min and subsequently keeping at room temperature for 24 h, resulting in an approximately 80% recovery of the pristine mechanical strength. This material is a promising candidate for the development of self-healing coatings.
Thermal and electrical behavior of hybrid thermosets based on epoxy and maleimide resins cured with p-aminobenzoic acid
Mustata, Fanica,Tudorachi, Nita,Asandulesa, Mihai,Bicu, Ioan
, p. 799 - 814 (2019/08/07)
Two thermoset systems based on maleimides and diglycidyl ether of bisphenol A (DGEBA) cured with p-aminobenzoic acid were characterized in terms of thermal and electrical behavior. Thermal characterization has been undertaken by means of thermogravimetric analysis in nitrogen atmosphere up to 600°C using simultaneous thermogravimetric/Fourier transform infrared/mass spectrometry (TG/FT-IR/MS) analysis. In the first stage of thermal degradation, the global kinetic parameters [activation energy (Ea) and preexponential factor (log A1 (s?1))] were calculated using the isoconversional method of Friedman. The energies variation as well as the shape of the differential thermal analysis curves suggests that the thermal decomposition process occurred in multiple stages. The evolved gases analysis was conducted by simultaneous TG/FT-IR/MS coupled techniques. Dielectric relaxation spectroscopy characterization was also made.
Cardanol based benzoxazine blends and bio-silica reinforced composites: Thermal and dielectric properties
Arumugam,Krishnan,Chavali,Muthukaruppan
, p. 4067 - 4080 (2018/03/21)
In the present work, a novel cardanol based benzoxazine was synthesised by reacting three different amines (aniline (CrAb), N,N-dimethylaminopropylamine (CrDb) and caprolactam modified N,N-dimethylaminopropylamine (CrCb)) with cardanol in the presence of formaldehyde under appropriate experimental conditions. The resulting benzoxazines were characterised for their molecular structure and thermal behaviour using different analytical methods. Among the different systems studied, the tertiary amine derivatives were found to reduce the curing temperature efficiently (CrAb-275 °C > CrDb-265 °C > CrCb-251 °C) and were confirmed by DSC analysis. These cardanol based CrAb benzoxazines were blended with conventional benzoxazines (Bzs) and bismaleimides (BMIs) as binary and ternary systems and their thermal properties were studied. Three different catalysts (4-hydroxy acetophenone, 4-aminophenol, and 4-hydroxyphenyl maleimide) were used to study the effect of lowering the curing temperature. Further, the prepared benzoxazines were reinforced with varying weight percentages (1, 3, 5 and 10 wt%) of bio-silica derived from rice husk to obtain hybrid composites. The dielectric studies of bio-silica reinforced cardanol benzoxazines infer that the values of dielectric constant decreased with increasing wt% of bio-silica. It was further observed that 10 wt% bio-silica reinforced cardanol benzoxazines show the lowest value of dielectric constant of 1.9 at 1 MHz. From the data obtained from the different studies, it is concluded that the blends of cardanol based benzoxazines can be used in the form of sealants, encapsulants, adhesives and matrices in the fields of microelectronics and automobile applications for better performance.