80238-12-6 Usage
General Description
2,6-Dimethylterephthalic acid, also known as DMTA or methylterephthalic acid, is a synthetic organic chemical compound. It contains the elements carbon, hydrogen, and oxygen, and typically appears as white solid crystals at room temperature. This acid falls under the category of aromatic carboxylic acids, known for their fragrant, or "aroma"-like, properties. 2,6-Dimethylterephthalic acid is often used in the synthesis of polyester resins, plasticizers and other types of polymers, contributing to the hardness and durability of final products. Its production and use may also result in its release to the environment, which under certain conditions could contribute to the formation of harmful or toxic byproducts.
Check Digit Verification of cas no
The CAS Registry Mumber 80238-12-6 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 8,0,2,3 and 8 respectively; the second part has 2 digits, 1 and 2 respectively.
Calculate Digit Verification of CAS Registry Number 80238-12:
(7*8)+(6*0)+(5*2)+(4*3)+(3*8)+(2*1)+(1*2)=106
106 % 10 = 6
So 80238-12-6 is a valid CAS Registry Number.
InChI:InChI=1/C10H10O4/c1-5-3-7(9(11)12)4-6(2)8(5)10(13)14/h3-4H,1-2H3,(H,11,12)(H,13,14)
80238-12-6Relevant articles and documents
Inclusion complex containing epoxy resin composition for semiconductor encapsulation
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, (2014/03/21)
The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.
