Russian Journal of Applied Chemistry, Vol. 78, No. 9, 2005, pp. 1444 1449. Translated from Zhurnal Prikladnoi Khimii, Vol. 78, No. 9,
2005, pp. 1469 1474.
Original Russian Text Copyright
2005 by Turaev, Kruglikov, Parfenova.
APPLIED ELECTROCHEMISTRY
AND CORROSION PROTECTION OF METALS
Regeneration by Membrane Electrolysis of an Etching Solution
Based on Copper Chloride
D. Yu. Turaev, S. S. Kruglikov, and A. V. Parfenova
Mendeleev Russian University of Chemical Engineering, Moscow, Russia
Received March 24, 2005
Abstract Regeneration of an acid solution for copper etching, based on copper(II) chloride, hydrochloric
acid, and ammonium chloride, by membrane electrolysis was studied. The concentrations of copper(I, II) ions
in the cathode and anode spaces, current efficiency, degree of copper recovery, and specific consumption
of electric power at different quantities of electricity passed through the electrolyzer were measured. The in-
fluence exerted by the current density on the electric power expenditure for recovery of metallic copper was
examined. The anode current efficiency by chlorine was determined with a spent etching solution and an
H2SO4 solution used as anolyte.
One of the main procedures in manufacture of
printed-circuit boards is copper etching, for which an
acid solution based on Cu(II) chloride is frequently
used. The working principle of this etching solution is
based on the reaction
exchange membrane and circulation of the etching
solution between the anode chamber and the etching
machine was considered in [2]. It should be noted that
the amount of ions of bivalent copper(II) formed
at the anode in a process of this kind will always
markedly exceed the amount of copper ions that
passed across the membrane from the anode space
into the cathode chamber. This mismatch leads to a
decrease in the concentration of copper ions and in-
crease in that of hydrogen ions in the catholyte. This,
in turn, gives rise to a side reaction of hydrogen
evolution at the cathode. Thus, circulation of the etch-
ing solution only between the anolyte and the etching
machine leads to limitation of the rate of copper re-
moval from the etching solution by the rate of its
migration across the cation-exchange membrane from
the anode space into the cathode space in the form of
Cu2+ + Cu + 4CI = 2[CuCl2] ,
(1)
whence follows that the etching solution should con-
tain chloride ions in an amount sufficient for binding
of the whole amount of copper(I) into a complex.
The necessary excess of chloride ions is introduced
into solution in the form of HCl, NH Cl, or NaCl. In
4
the course of etching, the concentration of Cu(II) ions
decreases through an increase in the concentration
of Cu(I) ions, which makes slower the etching rate.
Under industrial conditions, such a spent etching
solution can be regenerated [1] by oxidizing Cu(I)
ions with atmospheric oxygen or hydrogen peroxide.
2+
Cu ions. In the steady state, the current efficiency
by copper will be rather low, because it should be
2+
equal to the transport number of Cu ions across
To maintain a constant, nearly optimal composition
of the solution, all its components except Cu(II) ions
should be added to it. As a result, each cycle of etch-
ing and chemical regeneration leads to a substantial
increase in the volume of the etching solution and in-
volves an additional expenditure of chemicals. Fur-
thermore, the appearing excess amount of the solution
requires an appropriate treatment, which consists at
the majority of plants in the reagent method for pro-
duction of metallic copper or of its sparingly soluble
the membrane. The additional supply of copper ions,
which is necessary for maintaining their concentration
in the catholyte at a prescribed level, can be provided
by circulating the etching solution not only through
the anode chamber, but also through the cathode
chamber.
Copper is removed from the surface of printed-cir-
cuit boards in the etching machine by spraying of
the etching solution over a printed-circuit board.
Owing to the contact between the etching solution and
atmospheric oxygen, copper(I) ions are partly oxidized
to Cu(II) already in the etching machine. This reaction
compounds (oxides, CuO CuCl ).
2
Electrochemical regeneration of a spent etching
solution in a two-chamber electrolyzer with cation-
1070-4272/05/7809-1444 2005 Pleiades Publishing, Inc.