However, the resultant organocopper species were shown to
be reactive only toward aldehydes, acyl halides, and allylic
substrates.6 Transmetalation of ArSiF3 with (NHC)Cu(Br)
in the presence of a fluoride source to generate (NHC)Cu(Ar)
species was also proposed previously by the Hoveyda group7
in the conjugate addition of ArSiF3 to cyclic enones.8 In
addition, Cu-salts are known to improvethe product yields
in Pd-catalyzed Hiyama couplings.9 A previous report10
showed that [CuOC6F6] could mediate the coupling of
arylsilicon reagents with aryl iodides but with limited
substrates and required a stoichiometric amount of the
copper salt.11 Herein, we report the first Cu-catalyzed
Hiyama coupling of aryl- and heteroaryltriethoxysilanes
with aryl- and heteroaryl iodides, a transformation that
proceeds, depending upon the types of substrates, with and
without requiring the addition of ligands for the best
product yields. In addition, we have demonstrated a dual
role for CsF, one as a fluoride source to facilitate the trans-
metalation of ArSi(OEt)3 with CuI, and the other as a
stabilizer of monomeric [CuAr] species by preventing
aggregation in reactions that are conducted in the absence
of a ligand.
Our investigation began with the selection of different
ligands in conjunction with CuI for screening reaction
conditions in an attempt to couple arylsilicon reagents
with p-iodotoluene (Table 1). We found that the reaction
of PhSi(OEt)3 (a1) with p-iodotoluene (b1) proceeded in
the presence of a bidentate ligand PN-1 in 24 h in DMF
at 120 °C to afford 4-phenyltoluene (c1) in good yield
(60% by GC, entry 1) when CsF was utilized as a fluoride
source. Other similar P,N-ligands (see Supporting Infor-
mation (SI) for details) provided the product c1 in lower
yields (entry 2). To our surprise, the reaction of a1 with
p-iodotoluene proceeded even in the absence of PN-1,
albeit providing the biaryl product in only 40% GC
yield (entry 3). Replacing CuI with CuOtBu (purified by
sublimation)12 generated the product in 50% GC yield
(entry 4). The reaction does not proceed in the absence of
either the Cu-catalyst or CsF and affords the product in
<5% yield when CsF is replaced with other Fꢀ sources
(entries 5ꢀ7). Replacing a1 with PhSiMe3 yielded no
product at all (entry 8). Similarly, utilizing p-bromo- or
p-chlorotoluene as an aryl halide afforded only trace
amounts of the product (entry 9). Use of NMP and HMPA
as solvents provided the product in 30% and 40% GC
yields, respectively (entries 10, 11). Other solvents such as
DMSO, dioxane, toluene, or MeCN produced 4-phenyl-
toluene in <5% yield (entry 12).
Table 1. Optimization of Reaction Conditionsa
entry
modified conditions
standard conditions
yield (%)b
1
2
3
4
5
6
7
8
9
60 (55)c
PN-2ꢀPN-5 (see SI for details)
without ligand
45ꢀ50
40
50
0
with CuOtBu (sublimed) instead of CuI
without CuI
without CsF
0
LiF, NaF, KF, RbF, or TBAF instead of CsF
PhSiMe3 instead of PhSi(OEt)3
4-bromo- or 4-chlorotoluene instead of
4-iodotoluene
<5
0
<2
10
11
12
NMP instead of DMF
30
40
<5
HMPA instead of DMF
DMSO, dioxane, toluene, or MeCN instead
of DMF
a Reactions were run on a 0.1 mmol scale in 0.5 mL of anhydrous
DMF. CuI (99.999%) and CsF (99.9%) were used in all reactions.
b Calibrated GC yields using 2-nitrobiphenyl as a standard. c Number in
parentheses is the isolated yield from a 1.0 mmol scale reaction. Less
than 3% homocoupling products were observed. ∼30% unreacted
starting materials was observed based on GC.
(7) Lee, K. S.; Hoveyda, A. H. J. Org. Chem. 2009, 74, 4455.
(8) For the existence of similar organocopper species in the presence of
organosilicon reagents, see: (a) Miki, Y.; Hirano, K.; Satoh, T.; Miura, M.
Org. Lett. 2012, 15, 172. (b) Franz, A. K.; Woerpel, K. A. J. Am. Chem.
Soc. 1999, 121, 949. (c) Taguchi, H.; Ghoroku, K.; Tadaki, M.; Tsubouchi,
A.; Takeda, T. J. Org. Chem. 2002, 67, 8450. (d)Taguchi, H.; Ghoroku, K.;
Tadaki, M.; Tsubouchi, A.; Takeda, T. Org. Lett. 2001, 3, 3811. (e)
Tomita, D.; Wada, R.; Kanai, M.; Shibasaki, M. J. Am. Chem. Soc.
2005, 127, 4138. (f) Yamasaki, S.; Fujii, K.; Wada, R.; Kanai, M.;
Shibasaki, M. J. Am. Chem. Soc. 2002, 124, 6536. (g) Lam, P. Y. S.;
Deudon, S.;Averill, K. M.;Li, R. H.;He, M. Y.;DeShong, P.;Clark, C. G.
J. Am. Chem. Soc. 2000, 122, 7600. (h) Lin, B.; Liu, M.; Ye, Z.; Ding, J.;
Wu, H.; Cheng, J. Org. Biomol. Chem. 2009, 7, 869.
(9) For effects of Cu-salts on reactions involving organosilicon
reagents, see: (a) Denmark, S. E.; Baird, J. D. Org. Lett. 2004, 6, 3649.
(b) Hanamoto, T.; Kobayashi, T.; Kondo, M. Synlett 2001, 2001, 0281.
(c) Nakao, Y.; Imanaka, H.; Sahoo, A. K.; Yada, A.; Hiyama, T. J. Am.
Chem. Soc. 2005, 127, 6952. (d) Nakao, Y.; Takeda, M.; Matsumoto, T.;
Hiyama, T. Angew. Chem., Int. Ed. 2010, 49, 4447.
After establishing the optimal conditions (Table 1), we
examined the substrate scope of the new cross-coupling
protocol. The current conditions allow the reactions to
proceed for arylꢀaryl, arylꢀheteroaryl, and heteroarylꢀ
heteroaryl couplings in good to excellent product yields
(Tables 2, 3). The reactions conducted in the presence of
the ligand PN-1 consistently provided good yields of
products for the couplings of aryltriethoxysilanes with aryl
iodides (Table 2). The use of PN-1 increased the yields of
the arylꢀaryl coupling products by 20ꢀ54% relative to
that of the reactions conducted without the ligand (entries
3, 6, 15). Similarly, a variety of functional groups were
tolerated on the aryl rings of both the aryltriethoxysilanes
and the aryl iodides. Reactions proceed well with electron-
deficient and -rich aryl rings on both coupling partners.
Halogen, exemplified using chloride, is also tolerated
on both the aryltriethoxysilanes and the aryl iodides
(entries 8ꢀ10).
(10) Ito, H.; Sensui, H.; Arimoto, K.; Miura, K.; Hosomi, A. Chem.
Lett. 1997, 26, 639.
(11) For homocouplings of vinyl-, alkynyl-, and arylsilicon reagents
with stoichiometric amounts of copper salts, see: (a) Nishihara, Y.;
Ikegashira, K.; Toriyama, F.; Mori, A.; Hiyama, T. Bull. Chem. Soc.
€
Jpn. 2000, 73, 985. (b) Louerat, F.; Gros, P. C. Tetrahedron Lett. 2010, 51,
3558. (c) Itami, K.; Ushiogi, Y.; Nokami, T.; Ohashi, Y.; Yoshida, J.-I.
Org. Lett. 2004, 6, 3695. (d) Ikegashira, K.; Nishihara, Y.; Hirabayashi,
K.; Mori, A.; Hiyama, T. Chem. Commun. 1997, 1039.
(12) Lemmen, T. H.; Goeden, G. V.; Huffman, J. C.; Geerts, R. L.;
Caulton, K. G. Inorg. Chem. 1990, 29, 3680.
B
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