February 2004
Communications of the American Ceramic Society
301
reactive hot pressing. In situ-formed nanometer-sized SiC particles
were mainly entrapped in the Al O matrix grains, whereas
2
3
submicrometer-sized particles were located at the grain boundaries
or triple points of the Al O . The grain boundaries between Al O
2
3
2 3
and SiC bonded directly, with no amorphous phase. The intrafrac-
ture mode dominated the fracture process, because of the strongly
bonded interfaces and residual tensile stress in the Al O grains.
2
3
The bending strength of the nanocomposite RHP-treated at 1800°C
was 795 Ϯ 160 MPa, and the fracture toughness, measured by the
1
/2
indentation method, was 3.1 MPa⅐m
.
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Fig. 2. High-resolution TEM image of the grain boundary between an
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2
6
Figure 2 shows a high-resolution TEM image of the grain
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7
2
3
SiC particle. No obvious amorphous phase exists at the grain
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(
8
2
3
indicates a strong bonding between Al O and SiC particles and
9
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3
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1
0
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1
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2
3
1
2
expansion coefficients between Al O and SiC should have en-
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2
3
hanced this intrafracture process. On the other hand, this fracture
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3
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[
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IV. Summary
1
A simple approach was used to prepare Al O –SiC nanocom-
15
2
3
2 3
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(
1
6
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2 3
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7
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“
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9
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2
0
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“
2 3
O
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2
1
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3
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Fig. 3. SEM photograph of the fracture surface of the nanocomposite
showing intrafracture mode.
Ⅺ