Kinetic Analysis of Electroless Deposition of Copper

Article abstract of DOI:10.1021/j100266a037

Kinetic data on elelctroless copper deposition from a formaldehyde/EDTA solution are analyzed and discussed in terms of a formal kinetic rate law.The derived rate equation shows first-order dependence on the methylene glycol anion and zeroth order on cupric ion.Kinetic preexponential factors evaluated from temperature dependencies of reaction rates indicate that the rate-determining step involves an adsorbed species.A primary kinetic isotope effect k_H/k_D = 5 upon substitution of deuterium for protium in formaldehyde indicates that cleavage of the carbon-hydrogen bond of the adsorbed methylene glycol anion is rate determining.