133902-2
Xin Liang
Appl. Phys. Lett. 111, 133902 (2017)
FIG. 1. Illustration of atomic models for three Cu
high temperature a phase (cubic). The blue and yellow balls represent Cu and S atoms, respectively. The fractional filling of Cu balls illustrates that Cu ions
have partial occupancy and are disordered in b and a phases.
2
S polymorphs: low temperature c phase (monoclinic), intermediate temperature b phase (hexagonal), and
þ
þ
have low tolerance for Ag content variation. Among all the
copper and silver based binary chalcogenides, Cu S superi-
scanning calorimetry apparatus (Netzsch STA 449 F3 Jupiter,
Germany). Mass densities q were measured using the
Archimedes method. All sintered samples were well densified
with relative mass densities above 96% as compared to the
2
onics, with electrical conductivity ꢂ10 S/cm from room tem-
2
perature to 800 K, appears to be a suitable model system for
3
the present work. In addition, Cu-S binary phase equilibria
suggests a reasonable range of stoichiometric modulation for
theoretical value of 5.787g/cm .
All Cu26dS samples remain the pure low temperature
LC c phase (PDF#33-0490), as seen from the room tempera-
ture X-ray diffraction patterns in Fig. 2. Thermal diffusivity
of Cu26dS superionic compounds measured from room tem-
perature to 923 K is presented in Fig. 3(a). There is an abrupt
change of thermal diffusivity across the phase boundary at
ꢂ373 K, while the one at 700 K is less remarkable. These
two phase changes are well recorded by measured specific
heat capacity with temperature, which is shown in Fig. 3(b).
The thermal conductivity of Cu26dS compounds is readily
obtained, as presented in Fig. 3(c), which has a weak depen-
dence on temperature except across phase boundaries. In
each phase region, there is an appreciable variation of ther-
mal conductivity with Cu content. To investigate the ionic
13
þ
Cu S compound, which provides the room for tuning Cu
2
content.
Stoichiometric Cu S compound has three transformable
2
polymorphs, as shown in Fig. 1. Below 370 K, it crystallizes
into low chalcocite (LC) c phase with a monoclinic lattice,
and stabilizes to a high chalcocite (HC) b phase with a hex-
agonal structure between 370 and 700 K. Above 700 K, Cu2S
transforms to a FCC cubic a phase, which has been long well
known as a classic superionic compound that is characteris-
þ
14
tics of disordered and fast mobile Cu ions. Also in HC b
compound, Cu are distributed over the sites of 2b, 4f and
þ
6
g in disorder and mobile through the interstices of hexago-
1
5
nal closed packed S atoms. Recently, it is found that Cu
þ
sublattices in b compound (HC) are indeed in liquid phase
contribution of mobile Cu ions to thermal conduction, it is
1
6
whereas S sublattices remain solid framework. The LC c
phase, where both cations and anions are ordered in rigid
framework, is a typical ionic compound without any superi-
onic characteristics.
necessary to carefully deduct the electronic contribution
from the measured thermal conductivity which consists of
contributions from all types of heat carriers.
The electronic contribution to thermal conductivity jel
can be obtained from the Wiedemann-Franz law
Cu26dS powders with varying Cu content (Cu1.98S,
Cu1.99S, Cu S, Cu2.03S, and Cu2.05S) were prepared by melt-
ing the pure substance Cu (shot, 99.9%, Alfa) and S (pieces,
2
jel ¼ LrT;
(2)
9
9.99%, Aladdin) in quartz tubes sealed under vacuum. The
mixtures were heated to 673 K in 10 h, and then ramped to
383 K with a rate of 3.5 K/min. After being thermally equil-
where r is the electrical conductivity. In Fig. 3(d), we present
the measured electrical conductivity from room temperature
1
ibrated for 10 h, the powders were furnace cooled to room
temperature. The samples were ground into fine powders and
then densified into solid pellets on a spark plasma sintering
V
R
system (SPS LABOX-325, Sinter Land , Japan), under an
axial compressive stress of 65 MPa in vacuum and held at
713 K for 5 min. X-ray diffraction patterns were taken at
room temperature under a Rigaku D/max 2500 PC X-ray dif-
fractometer using Cu Ka radiation. Temperature dependence
of electrical conductivity (r) and Seebeck coefficient (S)
were measured in the argon atmosphere on a Netzsch SBA
458 Nemesis system (Germany). Thermal conductivity (j)
was obtained using the standard relation j ¼ DCpq, where D
is the thermal diffusivity, C is the specific heat capacity,
p
and q is the mass density. Thermal diffusivity (D) was mea-
sured using the laser flash method on a Netzsch Micro
V
R
Flash LFA 457 (Germany) with flowing argon gas, and
then analyzed using a Cowan model with pulse correction.
The heat capacity Cp was measured on a differential
FIG. 2. Room temperature X-ray diffraction patterns of Cu26dS compounds
with varying Cu content.