5
06
TOMASHPOL’SKII et al.
Table 3. Electrical properties of PZT films
ature to 850°C improves the structural perfection of the
films, and the pseudocubic structure gives way to the
equilibrium, tetragonal structure.
Ps,
µC/cm
Pr,
µC/cm
E ,
kV/cm
c
Film no.
ε20
εTC
2
2
6
8
650 1225
650 1000
600 1350
250 1000
300 1450
250 1750
8
6
5
5
42
44
CONCLUSION
PZT films with Ti : Zr = 0.6 : 0.4 and good ferroelec-
tric properties were prepared by spray pyrolysis of car-
boxylate solutions. The perfection of the films was
found to strongly depend on the composition and con-
centration of the precursor solutions and annealing con-
ditions. The introduction of methacrylic acid and ethyl-
ene glycol into the precursor solution leads to smoother
film surfaces, reduces the amount of cracking and
porosity, and allows the annealing temperature to be
reduced without an adverse effect on the properties of
the films.
12
14
16
18
8
5
120
84
14
13
18
10
10
15
120
107
optimal concentration was 2 g/l. At this concentration,
the films had smooth surfaces without pores or cracks.
At lower concentrations, the microstructure does not
improve, but the process takes more time, and the con-
sumption of the precursor solution increases. The intro-
duction of ethylene glycol raises the solution viscosity,
inhibits vaporization of the solvent from the substrate,
and notably improves the quality of the film surface.
The presence of methacrylic acid reduces the mechan-
ical stress in the deposited layer, which also favors the
formation of pore- and crack-free films. The consecu-
tive deposition of several layers helps obtain stress-free
films uniform in thickness. Our experiments demon-
strate that, all other factors being the same, the porosity
and amount of cracking are lower in multilayer films.
ACKNOWLEDGMENTS
We are grateful to S.S. Korovin for his valuable sug-
gestions and helpful discussions.
REFERENCES
1
. Burfoot, J.C. and Taylor, I.G.W., Polar Dielectrics and
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2. Tomashpol’skii, Yu.Ya., Plenochnye segnetoelektriki
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1
984.
The optimal substrate temperature in the course of
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to the substrate. The optimal temperature of the first
stage of annealing is 350°C. At this temperature, the
organic precursors fully decompose, without creating a
reducing atmosphere. Since data on the optimal anneal-
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carried out anneals at 650, 750, and 850°C—the most
frequently reported temperatures; the heating rate was
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3
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tion containing methacrylic acid, the grain size is
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7
8
9
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7
50°C. All other factors being the same, the presence of
methacrylic acid favors grain growth. The average
grain size after annealing at 750°C is 0.6 µm in the film
prepared with the use of acetic acid and 1.4 µm in the
case of methacrylic acid. At 850°C, we obtain, respec-
tively, 2.2 and 3.4 µm. Increasing the annealing temper-
. De Veirman, A.E.M. et al., Transmission Electron
Microscopy Study of PbTiO and PbZr Ti O Films,
3
x
1 – x
3
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INORGANIC MATERIALS Vol. 37
No. 5 2001