ARTICLE
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We analyzed the topography of the semiconducting layer on
the OTS-SiO2 layer. The two polymer films showed a compact
structure on the surface, with the smallest crystallites, with-
out annealing treatment. After thermal annealing, we could
observe crystallites of larger grain size, and a smoother
surface (roughness <0.8 nm) for the polymer 4 film, indicat-
ing highly connected and compact structures compared
to those in the polymer 8 film (roughness <3.5 nm). This
could explain why the device based on thermally annealed 4
demonstrated the highest mobility.
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The two solvent-annealed films showed a quite similar surface
topography and the roughness. A high coverage of the sub-
strate was achieved even after solvent annealing. The crystal-
lite grain size was larger than in pristine films. It may be that
the degree of crystallization becomes higher and the highly
packed crystalline molecules on the dielectric layer can
improve carrier transport with good connection behavior.
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CONCLUSIONS
We have successfully synthesized and characterized new
DTT-based conjugated polymers that are solution process-
able. Polymers 4 and 8 not only form smooth films on large
surfaces but also show better homogeneous layer formation
with relatively small crystallites via thermal annealing and
solvent vapor annealing. GI-XRD showed strong intermolecu-
lar interactions and preferred edge-on orientation of the
polymer chains in the thermally annealed crystalline film. In
brief, the two polymers incorporating a dithienothiophene
moiety not only offers high carrier mobility of the order of
10ꢂ2 cm2/Vs (lFET ¼ 0.01–0.05 cm2/Vs) but also have high
on/off current ratios, after both thermal annealing and sol-
vent annealing. In particular, the 4,40-substitution of the do-
decyl side chain in polymer, 4 drives higher crystallization,
even before thermal annealing, and more efficient edge-on
molecular arrangement, as shown by GI-XRD, resulting in
higher TFT performances. In the samples treated under
toluene vapor, the corresponding TFT devices also displayed
device performances comparable to those of devices pre-
pared from thermally annealed polymers. The process has
advantages for use in assembly of OTFTs in low cost fabrica-
tion of practical devices.
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18 van Breemen, A. J. J. M.; Herwig, P. T.; Chlon, C. H. T.;
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This research work was supported by 21st Century Frontier
Research Program (F0004091-0000-00, 2010), and Korea
Science and Engineering, (KOSEF R0120070001128402008),
and Priority Research Centers Program through the National
Research Foundation of Korea (NRF) funded by the Ministry of
Education, Science and Technology (NRF20100020209). Mr.
K. H. Kim thanks the financial support by the Seoul R&BD
Program (10543).
19 Yang, H.; Shin, T. J.; Yang, L.; Cho, K.; Ryu, C. Y.; Bao, Z.
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