ARTICLE IN PRESS
N. Garcia et al. / Journal of Magnetism and Magnetic Materials 272–276 (2004) 1722–1729
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it is obtained inverse MR (see J.M. De Teresa, Science
286 (1999) 507) (large resistances at large fields). The
possibilities of magnetostriction effects have been
discussed in this contest, see Ref. [9]), although these
values of many thousands may be an illusion. One
important point, however, needs to be addressed
regarding the corresponding experiments of Ref. [8]
versus Ref. [9]. The former has shown negative BMR
while the latter inverse or positive MR, that is to say a
large resistance (R) at a large applied field. Moreover, as
the nanocontacts are grown on macroscopic Ni wires, it
is thinkable to assume that the magnetoelastic deforma-
tions may alter the nanocontact, and hence contribute to
the change of R by the applied field, and this needs to be
investigated. We have performed experiments measuring
MR and magnetostriction with an atomic force micro-
scope (AFM), and clearly observed that the existing
magnetostrictive changes cannot be assigned directly to
the cause of MR. Strictly speaking, however (although
hard evidence is lacking here), magnetoelastic effects
cannot be totally discarded when magnetic wires are
used as the support. In short, we have observed that
magnetostriction does not change resistance [10] in 90%
of the samples measured. The case where the magnetos-
triction may not be the cause of the generally observed
BMR was also explained in early experiments with Ni
nanocontacts deposited on Cu wires, which exhibited
magnetostriction deformations 100 times smaller than
Ni and from the very large values in permalloy [10] wires
that have 30 times smaller deformations than Ni. Lately,
during the last several months, we have been working on
Fe, Co and permalloy contacts electrodeposited in Cu
wires, but more importantly in Cu films as well. In the
latter case the magnetostrictive effect is unobservable
measured by our newAFM technique using a Dimen-
sion 3100 scanning probe microscope (SPM) with an
adapted magnetic field source [10], while at the same
time the BMR can reach values up to 400%. When we
use pure Cu wires or Cu plates as substrates, however,
with contacts of deposited permalloy we observe up to
300% MR, which is very reproducible in hundreds of
RðHÞ curves. In this case, the alleged deformations are
evidently belowthe minimum observable shift (1 nm) of
our AFM, with estimations for the deformation no
larger than 0.2 nm. These experiments in thin films may
be relevant from the technological point of viewbecause
they may permit the mass production and integration of
devices.
of Cu wire is 0.5 mm. We, furthermore, arrange them in
two different configurations (the ‘‘T’’ configuration and
the configuration with two Cu wire rings), and get a
nanocontact between two separate parts using electro-
chemical deposition. The details can be seen in our
previous publications. For the contacts grown on films,
the process for sample preparation is one of the
traditional methods used to get printed circuit boards.
It essentially entails drawing on the virgin board (20 mm
of copper deposited in an epoxy resin) with a waterproof
pen, and subsequently immersing the board in a solution
of chloridric acid and sodic perborate. This solution
basically attacks the exposed parts and leaves the
painted areas unaffected. After all the copper is removed
from the exposed parts, we take out the sample and
wash it in water. The process is completed by taking out
the paint with alcohol. We use insulating glue to cover
most of the surface of the Cu films, leaving only a small
area near the contact region for deposition. A schematic
diagram and the microscope picture are shown in
Fig. 1a. In the microscope picture, the yellow–red part
indicates the Cu film and the black part the substrate.
Before chemical deposition, we cleaned the sample by
ultrasonic immersion in alcohol and pure water. We also
controlled the thickness of Cu films by mechanical and
chemical methods, as shown in Fig. 1b, where the
bronze part indicates the Cu film and the thickness is
about 20 mm. We can then growFe, Co and permalloy
contact on Cu films with different thickness by etching
the Cu. The gap width where the magnetic material is
grown can, furthermore, be varied between 100 and
2 mm by depositing more Cu in a starting gap of 100 mm.
The magnetic nanocontact is, subsequently, grown
and its size is controlled by the contact resistance
(RðOÞ ¼ 12900=10a2; where a is the size of the contact in
nm. For R ¼ 1 O, aE30 nm). This estimation is done
assuming that each contact atom contributes with a
conducting channel assuming ballistic conduction for
the spin. In other words, the distance that the spin
travels without reversing has to be larger than a: Taking
into account that the spin reversing distances are of the
order of 30–40 nm, it is reasonable to assume ballistic
conductance for the spin in contact with resistances
larger than 1 O. We have attempted to visualize the
nanocontact by scanning electron microscope (SEM)
techniques, despite the difficulty in localizing the exact
position of the contact. Despite the latter difficulties,
however, we show in Fig. 1c an SEM micrograph of the
contact area in the deposit, even though this is taking
place through a particle of E1 mm size. The nanojunc-
tion cannot be identified here since it may be covered by
the particle. Similarly, the possibility of many nanojunc-
tions formed at the same time also cannot be excluded in
this scenario. This will be discussed below.
2. Ballistic magnetoresistance
In the present study, we have studied Fe, Co and
permalloy nanocontacts on Cu wires and Cu films. For
Cu wires, the preparation method is similar to that of
our previous work on Ni and NiFe wires. The diameter
Iron was deposited from 225 g/l FeSO4 ꢀ 7H2O in
120 g/l Na2SO4 ꢀ 10H2O, with a pH of 3, at a voltage