2
30
X.H. Fan et al. / Chemical Physics Letters 334 (2001) 229±232
2. Experimental
with the inert gas, thus leading to a reduced
evaporation rate as compared with that in a vac-
uum. It can be derived that the rate of material loss
from the source varies inversely with the inert gas
pressure. Next, diusion was responsible for
transporting SiO vapor from the source to the
depositing position. The diusion coecient also
has an inverse relationship with the ambient
pressure P [12]. The above two factors both give
rise to a slower rate of supply of SiO vapor for
deposition at a higher ambient pressure. This in
turn leads to a lower deposition rate of SiNWs.
For an open deposition system with ¯owing inert
gas, the eect of ambient pressure on the evapo-
ration rate of SiO source is less signi®cant, because
the evaporated atoms or molecules are swept away
by the carrier gas from the surface of the source
material. As the ¯owing gas keeps on transporting
SiO vapor to the deposition location, the ambient
pressure would thus have a lesser eect on the
partial pressure of the SiO vapor at both the
evaporation and the deposition locations. Fur-
thermore, in an open system, some smaller SiNWs
are likely to be swept away from the system by the
carrier gas. These factors collectively lead to lower
yields of SiNWs in an open system than in our
closed system.
The apparatus used here was the same as that
2 3
reported before [3±8]. An Al O tube (about 38
mm in diameter and 760 mm in length) was placed
inside a horizontal tube furnace. A few grams of
SiO powder (purity: 99.98%, particle size: ꢀ45 lm,
3
density: 2.1 g/cm ) was put into a 72 mm long
Al
tube was pre-evacuated to 10 Torr, and then
lled with ambient gas (Ar + 5% H ) to a dierent
2 3 2 3
O boat at the center of the furnace. The Al O
�
2
®
2
pressure. Then the system was closed by cutting o
the inert gas and sealing the vacuum system. The
temperature of the furnace was then brought to
1
350°C and maintained for 2 h. As a result, loose
material with a color of light-brown to yellow
deposited at both ends of the tube, about 185 mm
from the center of the furnace. The temperature of
the deposition locations was measured to be about
9
50°C. In the experiment, it was found that the
loose material grew very quickly, and in about 2 h,
it ®lled up the whole cross-section of the tube.
Further examinations with transmission electron
microscopy (TEM) con®rmed that the loose ma-
terial was SiNWs.
3
. Results and discussion
The morphologies of SiNWs deposited in the
present closed system at dierent pressures were
characterized by TEM. As shown in Fig. 1a, under
an ambient pressure of 100 Torr, all SiNWs have a
smooth surface and an average diameter of 18 nm.
As the ambient pressure was increased to 200 Torr,
the wires were of similar diameter to those de-
posited at 100 Torr. However, a certain amount of
nano-particles appeared on the surface of some
nanowires (Fig. 1b). When the ambient pressure
was increased to 300 Torr, the surface of all
nanowires was packed with numerous nano-par-
ticles (Fig. 1c), and the wire diameters were
coarsened to about 45 nm. Fig. 2 shows a typical
Si nano-particle whose crystal lattice is separated
from that of the bulk SiNW by an amorphous
layer. This suggests that the particle was formed
on the surface of the SiNW after the nanowire had
formed. This kind of particle has not been ob-
served on SiNWs synthesized with the open sys-
tem.
It was found that the ambient pressure had an
important eect on the yield and morphology of
the SiNWs. The yield of SiNWs obtained in the
present closed system was twice that obtained in
the previous open system with a ¯owing inert gas,
reaching a value of about 20% (wt) of the con-
sumed SiO source materials. As the pressure in-
creased, the yield of SiNWs decreased.
The reason for a lower yield of SiNWs at high
pressure can be attributed to two factors. First,
less SiO vapor was evaporated at the position of
the SiO source due to the presence of inert gas [12].
In this case, the surface of the source materials was
surrounded by a thin vapor layer through which
the atoms or molecules evaporating from the
source materials would diuse. Once the atoms or
molecules reached the outer boundary of the layer,
they could be carried away or returned to and re-
deposited on the source materials due to collisions