
Journal of the Electrochemical Society p. 1477 - 1483 (1988)
Update date:2022-08-31
Topics:
Pattee
McConica
Baughman
du Pont PI-2575-D polyimide films were characterized to determine their suitability for use as an interlevel dielectric with a selective tungsten via fill process. Polyimide films cured at 400 degree and 440 degree C were found to breakdown at voltages greater than 1 multiplied by 10**6 V/cm. The pinhole density, when processed in a non-cleanroom environment, is below 1 per cm**2. The dielectric constant for 1. 6 mu m films is 3. 9. Adhesion to thermal oxide is 100% for films in boiling water up to 1h. The maximum moisture absorption is 1. 7 w/o at 90% relative humidity. Perfect tungsten selectively was achieved in the absence of nearby tungsten surfaces at 216 degree C, 0. 75-7. 5 torr total pressure, 15:1 H//2:WF//6 and times to 210 min.
Contact:18710867521(wechat)
Address:Rm10516,Galaxy Tech Building #2,No.25 Tangyan Rd,Hi-Tech Zone,Xi'an, China
Lyrin Industrial Corporation Limited
Contact:86-731-82571800
Address:Rm 2408,Asia Economy International Building,Shaoshan Road South,Yuhua District,Changsha,Hunan,China
Jiangsu Haian Petro chemical Plant
Contact:+86-513-88902723
Address:99, Changjiang West Road, Haian County, Jiangsu
Jinan Baozhao Pharmaceutical Co., Ltd
Contact:0086-531-86397156 82371858 82371868
Address:Huaneng Road, Jinan, Shandong ,China
Yingkou Sanzheng New Technology Chemical Industry Co., Ltd.
Contact:+86-417-2927806
Address:yingkou
Doi:10.1039/C39780001089
(1978)Doi:10.1002/pola.26624
(2013)Doi:10.1021/ol0486932
(2004)Doi:10.1039/j39680000258
(1968)Doi:10.1016/j.tetlet.2006.03.034
(2006)Doi:10.1016/j.ejmech.2013.09.060
(2013)