Reference

The viscosity of polymer solutions in upper and lower region of critical solution temperatures

The viscosity of polymer solutions in upper and lower region of critical solution temperatures. Rigler, J. K.; Wolf, B. A.; Breitenbach, J. W. (Chem. Werke Huels A.-G., Marl, Ger.). Angew. Makromol. Chem., 57(1), 15-27 (German) 1977. CODEN: ANMCBO. DOCUMENT TYPE: Journal CA Section: 35 (Synthetic High Polymers) The changes in the viscosity of solns. of polystyrene (I) [9003-53-6] in cyclohexane [110-82-7] near the upper crit. soln. temp. agreed qual. with literature values. For solns. of I in Et2O [60-29-7]-(MeO)3CH [149-73-5], the viscosity-temp. curve showed an anomalous increase near the lower crit. soln. temp., and this viscosity behavior was described by an equation analogous to that used for lower soly. gaps.

Heat-resistant adhesives

Heat-resistant adhesives. Suzuki, Shuichi (Tokyo Shibaura Electric Co., Ltd., Japan). Japan. Kokai JP 52038591 25 Mar 1977 Showa, 6 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C08F299-00. APPLICATION: JP 75-114455 22 Sep 1975. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Fabrication and Uses) A heat-resistant resin compn. is prepd., contg. a reaction product of N,N'-substituted bismaleimide compd. with acetyl-contg. ketone compds., and an orthoformate ester. Alternatively, a resin component consisting of 5-95% of the reaction product and 5-95% epoxy resin, is mixed with a formate ester to give a heat-resistant resin compn. Thus, a mixt. of dioxan (I) 801, PhMe 89.3, Me Et ketone 115, 4,4'-diamino diphenylmethane 59, and 4,4'-bismaleimidodiphenylmethane 716 g was heated 2 h at 80.degree. and 10 h at 90-5.degree., cooled to 30.degree., mixed with 1187 g I, and stirred to give a ketone-bismaleimide copolymer [56927-74-3] which was mixed with 0.1% Me orthoformate (II) [149-73-5]. The resulting resin compn. was coated on both sides of a polyimide film, air-dried, and heated 10 min at 110.degree. to give a prepreg which was sandwiched with 2 stainless steel plates, pressed 30 min to 200.degree. and 5 kg/cm2, and allowed to stand 1 h at 200.degree., giving a bonded metal plate with adhesive strength 94 kg/cm2. The bonded metal plate was heated 240 h at 200.degree. to give a product with adhesive strength 113 kg/cm2 compared with 60-70 kg/cm2 for a control when II was omitted.