Welcome to LookChem.com Sign In|Join Free

CAS

  • or
Copper(I) sulfide, also known as copper glance, is a copper sulfide in which the metal is in the +1 oxidation state. It occurs in nature as the mineral chalcocite with varying colors and exhibits metal-like electrical conductivity, chemical-sensing capability, and suitable characteristics for absorption of solar energy. Copper(I) sulfide is characterized by its dark-blue or black orthogonal crystals, insolubility in water, and slight solubility in hydrochloric acid. It decomposes in nitric acid and concentrated sulfuric acid and is moderately soluble in ammonium hydroxide.

22205-45-4 Suppliers

Post Buying Request

Recommended suppliersmore

  • Product
  • FOB Price
  • Min.Order
  • Supply Ability
  • Supplier
  • Contact Supplier
  • 22205-45-4 Structure
  • Basic information

    1. Product Name: COPPER(I) SULFIDE
    2. Synonyms: Copper(I) Sulphide 99.5%;Copper(I) sulfide anhydrous, powder, 99.99% trace Metals basis;Chalcocite, naturally occurring mineral, grains, approximately 1.5-4.8mm;Copper(I) sulfide, 99.5% trace metals basis;copper(i);coppersulfide(cu2s);cuprasulfide;cuproussulfide(cu2s)
    3. CAS NO:22205-45-4
    4. Molecular Formula: Cu2S
    5. Molecular Weight: 159.16
    6. EINECS: 244-842-9
    7. Product Categories: Inorganics;Chalcogenides;Materials Science;Metal and Ceramic Science;metal chalcogenides
    8. Mol File: 22205-45-4.mol
  • Chemical Properties

    1. Melting Point: 1100°C
    2. Boiling Point: N/A
    3. Flash Point: N/A
    4. Appearance: Black/powder
    5. Density: 5.6 g/mL at 25 °C(lit.)
    6. Refractive Index: N/A
    7. Storage Temp.: Keep in dark place,Inert atmosphere,Room temperature
    8. Solubility: N/A
    9. Water Solubility: Slightly soluble in hydrochloric acid, ammonium hydroxide. Insoluble in water.
    10. Merck: 14,2667
    11. CAS DataBase Reference: COPPER(I) SULFIDE(CAS DataBase Reference)
    12. NIST Chemistry Reference: COPPER(I) SULFIDE(22205-45-4)
    13. EPA Substance Registry System: COPPER(I) SULFIDE(22205-45-4)
  • Safety Data

    1. Hazard Codes: N/A
    2. Statements: 20/21/22-40
    3. Safety Statements: 7-22-36/37/39
    4. WGK Germany: 3
    5. RTECS: GL8910000
    6. TSCA: Yes
    7. HazardClass: N/A
    8. PackingGroup: N/A
    9. Hazardous Substances Data: 22205-45-4(Hazardous Substances Data)

22205-45-4 Usage

Uses

1. Used in Luminous Paints:
Copper(I) sulfide is used as a luminous pigment in luminous paints for its ability to absorb and emit light, making it suitable for applications requiring visibility in low-light conditions.
2. Used in Antifouling Paints:
In the marine industry, copper(I) sulfide is used as an antifouling agent in paints to prevent the growth of microorganisms, algae, and other organisms on submerged surfaces.
3. Used in Solid Lubricant Mixtures:
Copper(I) sulfide is utilized as a component in solid lubricant mixtures due to its ability to reduce friction and wear, making it ideal for applications in the automotive and machinery industries.
4. Used in Solar Cells:
Copper(I) sulfide is employed in the manufacturing of solar cells for its suitable characteristics in absorbing solar energy, contributing to the efficiency of the photovoltaic devices.
5. Used in Electrodes:
Copper(I) sulfide is used in the production of electrodes for its electrical conductivity properties, making it a valuable material in the electronics and energy storage industries.
6. Used as a Catalyst:
Copper(I) sulfide acts as a catalyst in various chemical reactions, facilitating the process and improving the overall efficiency of the reactions.
7. Used in Grain Mounts, XRD, and Microprobe Standards:
Copper(I) sulfide is also used for grain mounts, X-ray diffraction (XRD), and in microprobe standards for the identification of unknown minerals in the field of geology and mineralogy.
8. Used as a Precursor for Copper(I) Oxide and Copper Metal:
Copper(I) sulfide serves as a precursor in the preparation of copper(I) oxide and copper metal, which are essential materials in various industrial applications.

Preparation

Copper(I) sulfide is available in nature as the mineral chalcocite. It also may be made by heating copper(II) sulfide with hydrogen, in the presence of small amounts of sulfur. Alternatively, copper(I) sulfide may be prepared by heating copper with hydrogen sulfide and hydrogen; or by heating the metal with sulfur in an atmosphere of carbon dioxide and methanol vapor.

Reactions

When heated in air, copper(I) sulfide oxidizes forming copper(II) oxide, and sulfur dioxide: Cu2S + 2O2→ 2CuO + SO2 Heating in the absence of air produces copper(II) sulfide and copper: Cu2S→ CuS + Cu When heated with nitric acid, copper(I) sulfide decomposes forming copper nitrate and hydrogen sulfide. The compound dissolves in aqueous solutions containing cyanide ions forming soluble copper-cyanide complexes. Copper(I) sulfide reacts with polysulfide anions in aqueous solutions forming soluble copper polysulfides.

Check Digit Verification of cas no

The CAS Registry Mumber 22205-45-4 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 2,2,2,0 and 5 respectively; the second part has 2 digits, 4 and 5 respectively.
Calculate Digit Verification of CAS Registry Number 22205-45:
(7*2)+(6*2)+(5*2)+(4*0)+(3*5)+(2*4)+(1*5)=64
64 % 10 = 4
So 22205-45-4 is a valid CAS Registry Number.
InChI:InChI=1/2Cu.H2S/h;;1H2/q2*+1;-2

22205-45-4 Well-known Company Product Price

  • Brand
  • (Code)Product description
  • CAS number
  • Packaging
  • Price
  • Detail
  • Alfa Aesar

  • (14718)  Copper(I) sulfide, 99.5% (metals basis)   

  • 22205-45-4

  • 50g

  • 604.0CNY

  • Detail
  • Alfa Aesar

  • (14718)  Copper(I) sulfide, 99.5% (metals basis)   

  • 22205-45-4

  • 250g

  • 2727.0CNY

  • Detail
  • Alfa Aesar

  • (14718)  Copper(I) sulfide, 99.5% (metals basis)   

  • 22205-45-4

  • 1kg

  • 9770.0CNY

  • Detail
  • Alfa Aesar

  • (42532)  Chalcocite, naturally occurring mineral, grains, approximately, 0.06-0.19in   

  • 22205-45-4

  • 1g

  • 122.0CNY

  • Detail
  • Alfa Aesar

  • (42532)  Chalcocite, naturally occurring mineral, grains, approximately, 0.06-0.19in   

  • 22205-45-4

  • 5g

  • 422.0CNY

  • Detail
  • Alfa Aesar

  • (42532)  Chalcocite, naturally occurring mineral, grains, approximately, 0.06-0.19in   

  • 22205-45-4

  • 25g

  • 1793.0CNY

  • Detail
  • Aldrich

  • (510653)  Copper(I)sulfide  anhydrous, powder, 99.99% trace metals basis

  • 22205-45-4

  • 510653-5G

  • 1,261.26CNY

  • Detail
  • Aldrich

  • (342459)  Copper(I)sulfide  powder, −325 mesh

  • 22205-45-4

  • 342459-250G

  • 2,733.12CNY

  • Detail
  • Aldrich

  • (342459)  Copper(I)sulfide  powder, −325 mesh

  • 22205-45-4

  • 342459-1KG

  • 8,856.90CNY

  • Detail

22205-45-4SDS

SAFETY DATA SHEETS

According to Globally Harmonized System of Classification and Labelling of Chemicals (GHS) - Sixth revised edition

Version: 1.0

Creation Date: Aug 13, 2017

Revision Date: Aug 13, 2017

1.Identification

1.1 GHS Product identifier

Product name copper(I) sulfide

1.2 Other means of identification

Product number -
Other names copper stearate

1.3 Recommended use of the chemical and restrictions on use

Identified uses For industry use only. Intermediates
Uses advised against no data available

1.4 Supplier's details

1.5 Emergency phone number

Emergency phone number -
Service hours Monday to Friday, 9am-5pm (Standard time zone: UTC/GMT +8 hours).

More Details:22205-45-4 SDS

22205-45-4Synthetic route

Cu2Pt4S8

Cu2Pt4S8

A

sulfur
10544-50-0

sulfur

B

platinum(II) sulfide

platinum(II) sulfide

C

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
decompn. under argon at about 800 K;A 100%
B 100%
C 100%
pyrite

pyrite

copper(II) sulfate
7758-99-8

copper(II) sulfate

A

copper(I) sulfide
22205-45-4

copper(I) sulfide

B

iron(II) sulfate

iron(II) sulfate

Conditions
ConditionsYield
In water byproducts: H2SO4; pptn. of Cu2S (99.3%) and formation of FeSO4 and H2SO4 by reaction of 5%ic CuSO4- soln. with FeS2 at 200 °C in presence of quartz; quartz prevents formation of Fe2O3, Cu2O and CuS as by-products; formation of CuS with higher per cent FeS2;;A 99.3%
B n/a
In water byproducts: H2SO4; pptn. of Cu2S (99.3%) and formation of FeSO4 and H2SO4 by reaction of 5%ic CuSO4- soln. with FeS2 at 200 °C in presence of quartz; quartz prevents formation of Fe2O3, Cu2O and CuS as by-products; formation of CuS with higher per cent FeS2;;A 99.3%
B n/a
copper diacetate
142-71-2

copper diacetate

thiourea
17356-08-0

thiourea

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
In water for 1h; Sonication;91%
In ethanol Cu acatate and thiourea dissolved in abs.EtOH, stirred for 10 min, dip coated onto glass substrate, heated at 200°C for 10 min (several cycles), heated at 200°C for 60 min;
water
7732-18-5

water

copper(l) chloride

copper(l) chloride

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
With hydrogen sulfide In neat (no solvent) on passing over H2O-vapor at about 450°C in presence of excess H2S;;
carbon oxide sulfide
463-58-1

carbon oxide sulfide

copper(l) chloride

copper(l) chloride

A

copper(I) sulfide
22205-45-4

copper(I) sulfide

B

carbon dioxide
124-38-9

carbon dioxide

Conditions
ConditionsYield
In hydrogenchloride complete decompn.;;
In hydrogenchloride complete decompn.;;
Conditions
ConditionsYield
In water quick react. with powdered Cu;
In water slow react. at room temp., fast react. on boiling;;
In water slow react. at room temp., fast react. on boiling;;
In neat (no solvent) heating in vac. to about 110°C;;
copper(II) nitrate

copper(II) nitrate

sodium thiosulfate

sodium thiosulfate

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
In water electroless thin film deposition from copper(II)/S2O3(2-) soln. (molar ratio Cu(II)/S2O3(2-)=1:2), pH ca. 5 (acetic acid), bath temp. 50°C;; rinsed with water, air dried; Rutherford back scattering anal., scanning electron microscopy, X-ray diffraction;
copper(II) chloride pentahydrate

copper(II) chloride pentahydrate

sodium thiosulfate

sodium thiosulfate

N,N-dimethylthiourea
534-13-4

N,N-dimethylthiourea

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
In water aq. soln. of CuCl2*5H2O, dimethylthiourea and Na2S2O3 prepd. in deionized H2O, mixed, pH=2.3 at 70 °C, deposition time 3.5 h;
copper(II) ion

copper(II) ion

sodium thiosulfate

sodium thiosulfate

A

copper(I) sulfide
22205-45-4

copper(I) sulfide

B

copper(II) sulfide

copper(II) sulfide

C

sulfur
7704-34-9

sulfur

Conditions
ConditionsYield
In water on boiling, excess Na2S2O3; product ratio depending on react. time, Na2S2O3 concn., acidity of soln.;;
In water on boiling, excess Na2S2O3; product ratio depending on react. time, Na2S2O3 concn., acidity of soln.;;
copper(II) ion

copper(II) ion

sodium thiosulfate

sodium thiosulfate

A

copper(I) sulfide
22205-45-4

copper(I) sulfide

B

sulfur
7704-34-9

sulfur

Conditions
ConditionsYield
In water on boiling, excess Na2S2O3;;A >99
B n/a
In water on boiling, excess Na2S2O3;;A >99
B n/a
copper(II) sulfate
7758-99-8

copper(II) sulfate

sodium thiosulfate

sodium thiosulfate

A

copper(I) sulfide
22205-45-4

copper(I) sulfide

B

copper(II) sulfide

copper(II) sulfide

C

sulfur
7704-34-9

sulfur

Conditions
ConditionsYield
In water heating with excess Na2S2O3 in a closed tube to 140-200°C;;
In water heating with excess Na2S2O3 in a closed tube to 140-200°C;;
copper(II) sulfate
7758-99-8

copper(II) sulfate

sodium thiosulfate

sodium thiosulfate

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
In water electroless thin film deposition from copper(II)/S2O3(2-) soln. (molar ratio Cu(II)/S2O3(2-)=1:2), pH ca. 5 (acetic acid), bath temp. 50°C;; film rinsed with water, air dried; Rutherford back scattering anal., scanning electron microscopy, X-ray diffraction;
sodium thiosulfate

sodium thiosulfate

copper dichloride

copper dichloride

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
In melt on melting;;
In melt on melting;;
copper(I) oxide

copper(I) oxide

sodium thiosulfate

sodium thiosulfate

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
In not given sol. in Na2S2O3 soln; on heating pptn. of Cu2O and Cu2S;;
In not given sol. in Na2S2O3 soln; on heating pptn. of Cu2O and Cu2S;;
Conditions
ConditionsYield
In neat (no solvent) at elevated temperature with pure CS2-vapor or in mixture with CO2 or N2;;
In neat (no solvent) with CS2 vapor or with CS2 vapor with CO2 or N2 at elevated temp.;;
In neat (no solvent) with CS2 vapor or with CS2 vapor with CO2 or N2 at elevated temp.;;
In neat (no solvent) with CS2 contg. CO2 at elevated temp., heating to 860°C in vac.;; 99.8% Cu2S;;
In neat (no solvent) with CS2 contg. CO2 at elevated temp., heating to 860°C in vac.;; 99.8% Cu2S;;
iron sulfide

iron sulfide

silica copper(I) oxide

silica copper(I) oxide

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
In neat (no solvent) byproducts: FeSiO3; at 1800°C;;
In neat (no solvent) byproducts: FeSiO3; at 1800°C;;
copper(I) oxide

copper(I) oxide

iron sulfide

iron sulfide

A

iron(II) oxide
1345-25-1

iron(II) oxide

B

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
In melt
barium sulfide

barium sulfide

copper(l) chloride

copper(l) chloride

copper(I) sulfide
22205-45-4

copper(I) sulfide

copper(I) bromide
7787-70-4

copper(I) bromide

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
With H2S In acetonitrile
cadmium(II) sulphide

cadmium(II) sulphide

copper(II) sulfate
7758-99-8

copper(II) sulfate

A

copper(I) sulfide
22205-45-4

copper(I) sulfide

B

digenite

digenite

C

Cu1.90S

Cu1.90S

Conditions
ConditionsYield
With potassium nitrate In melt Cd-salt subjecting to electrostimulated ion exchange in melt of K-salt, residue treatment in melt of Cu-salt, according to V. A. Fedorov et al.,Phys. Status Solidi A 139 (1993) 9;
copper(l) chloride

copper(l) chloride

A

copper(I) sulfide
22205-45-4

copper(I) sulfide

B

copper dichloride

copper dichloride

Conditions
ConditionsYield
With sulfur dioxide In hydrogenchloride in dild- HCl-soln.;;
With SO2 In hydrogenchloride in dild- HCl-soln.;;
copper(l) chloride

copper(l) chloride

copper(I) sulfide
22205-45-4

copper(I) sulfide

Conditions
ConditionsYield
With sodium dithionite In water
With hydrogen sulfide In hydrogenchloride pptn.;;
With hydrogenchloride; sulfur dioxide In hydrogenchloride 5 - 15 wt.-% HCl soln.;;
copper(I) sulfide
22205-45-4

copper(I) sulfide

copper(I) oxide

copper(I) oxide

Conditions
ConditionsYield
With oxygen In neat (no solvent) at 700°C, O2-N2-mixtures with 10 or 0% O2, 72 or 28min.;;98%
With O2 In neat (no solvent) at 700°C, O2-N2-mixtures with 10 or 0% O2, 72 or 28min.;;98%
With oxygen byproducts: SO2; heat of the reaction is given;
copper(I) sulfide
22205-45-4

copper(I) sulfide

sulfur
7704-34-9

sulfur

hydrazine
302-01-2

hydrazine

NH2NH3(1+)*NH2NH2*Cu7S4(1-)=N4H9Cu7S4

NH2NH3(1+)*NH2NH2*Cu7S4(1-)=N4H9Cu7S4

Conditions
ConditionsYield
In neat (no solvent) in inert atm. Cu2S and S were stirred at room temp. with hydrazine in sealed vial for 90 h; soln. was filtered and evapd. under N2 flow; elem. anal.;89%
for 48h;
calcium(II) sulfide

calcium(II) sulfide

copper(I) sulfide
22205-45-4

copper(I) sulfide

erbium(III) sulfide

erbium(III) sulfide

potassium bromide
7558-02-3

potassium bromide

KCaEr2CuS5

KCaEr2CuS5

Conditions
ConditionsYield
In melt (N2); mixt. of Cu2S, Er2S3, CaS (molar ratio = 1:2:3) and excess of KBr flux heated at 1000°C in Al2O3-crucible placed in evacuated silica tube for 180 h, slow cooling to 700°C over 90 h; washing with water at room temp.;65%
gadolinium

gadolinium

copper(I) sulfide
22205-45-4

copper(I) sulfide

sulfur
7704-34-9

sulfur

Cu2Gd0.67S2

Cu2Gd0.67S2

Conditions
ConditionsYield
With iodine In neat (no solvent, solid phase) Cu2S, Gd, S and I2 were kept for 2 wks under temp. gradient from 1173 Kto 1073 K;60%
copper(I) sulfide
22205-45-4

copper(I) sulfide

A

copper(I) oxide

copper(I) oxide

B

copper(II) sulfate
7758-99-8

copper(II) sulfate

Conditions
ConditionsYield
With oxygen In neat (no solvent) byproducts: SO2; at 500°C, O2-N2-mixtures with up to 60% O2;;A 50%
B n/a
With O2 In neat (no solvent) byproducts: SO2; at 500°C, O2-N2-mixtures with up to 60% O2;;A 50%
B n/a
With oxygen byproducts: SO2; over 500°C;
silver sulfide

silver sulfide

copper(I) sulfide
22205-45-4

copper(I) sulfide

stromeyerite

stromeyerite

Conditions
ConditionsYield
at room temp.; 48h;;45%
at room temp.; 24h;;24%
at room temp.; 12h;;15%
copper(I) sulfide
22205-45-4

copper(I) sulfide

A

sulfur
7704-34-9

sulfur

B

copper(l) chloride

copper(l) chloride

Conditions
ConditionsYield
With chlorine In neat (no solvent) at 100-300°C;;A n/a
B 30%
With iron(III) chloride byproducts: FeCl2;
With chlorine In neat (no solvent) at 400°C;;A n/a
B >99
calcium(II) sulfide

calcium(II) sulfide

copper(I) sulfide
22205-45-4

copper(I) sulfide

uranium(IV) sulfide

uranium(IV) sulfide

potassium bromide
7558-02-3

potassium bromide

KCuUS3

KCuUS3

Conditions
ConditionsYield
In neat (no solvent, solid phase) US2, Cu2S mixed, loaded in silica tube, sealed under 1E-4 Torr, heated at 1273 K for 10 d, mixed with CaS and KBr, ground, sealed, heated to 1123 K in 60 h, kept at 1123 K for 240 h, slowly cooled at 3 K/h to 853 K; washed with H2O, dried with acetone;10%
iron(III) oxide

iron(III) oxide

copper(I) sulfide
22205-45-4

copper(I) sulfide

sodium chloride
7647-14-5

sodium chloride

copper dichloride

copper dichloride

Conditions
ConditionsYield
byproducts: Na2SO4; information about the react. eqs. in detail;
byproducts: Na2SO4; information about the react. eqs. in detail;
iron(III) oxide

iron(III) oxide

copper(I) sulfide
22205-45-4

copper(I) sulfide

copper(II) oxide

copper(II) oxide

Sulfate
14808-79-8

Sulfate

Conditions
ConditionsYield
With chlorine; sulfur increased SO4(2-) prodn. between 100 and 300°C; SO4(2-) detn. in aq. extract;
With chlorine between 100 and 300°C almost entirely SO4(2-) prodn.; SO4(2-) detn. in aq. extract;
With chlorine between 100 and 300°C almost entirely SO4(2-) prodn.; SO4(2-) detn. in aq. extract;
With chlorine; sulfur increased SO4(2-) prodn. between 100 and 300°C; SO4(2-) detn. in aq. extract;
iron(III) oxide

iron(III) oxide

copper(I) sulfide
22205-45-4

copper(I) sulfide

copper(II) sulfate
7758-99-8

copper(II) sulfate

Sulfate
14808-79-8

Sulfate

Conditions
ConditionsYield
With chlorine between 100 and 300°C, react. at 300°C also; SO4(2-) detn. in aq. extract;
With chlorine between 100 and 300°C, react. at 300°C also; SO4(2-) detn. in aq. extract;
iron(III) oxide

iron(III) oxide

copper(I) sulfide
22205-45-4

copper(I) sulfide

A

copper(I) oxide

copper(I) oxide

B

iron(II) oxide
1345-25-1

iron(II) oxide

C

iron(III) sulfate

iron(III) sulfate

D

copper(II) ferrite

copper(II) ferrite

E

copper(II) oxide

copper(II) oxide

Conditions
ConditionsYield
With air byproducts: SO2, SO3; mixing of Fe2O3 and Cu2S (1:1) mech. before roasting; information about the react. eqs. in detail, about dependence on temp. from 300 till 550°C and about the effect of Fe2O3; further products;
With air byproducts: SO2, SO3; mixing of Fe2O3 and Cu2S (1:1) mech. before roasting; information about the react. eqs. in detail, about dependence on temp. from 300 till 550°C and about the effect of Fe2O3; further products;
iron(III) oxide

iron(III) oxide

copper(I) sulfide
22205-45-4

copper(I) sulfide

A

copper(I) oxide

copper(I) oxide

B

iron(II) oxide
1345-25-1

iron(II) oxide

C

copper(II) ferrite

copper(II) ferrite

D

copper(II) oxide

copper(II) oxide

Conditions
ConditionsYield
byproducts: SO2, SO3; at roasting of Cu2S in presence of Fe2O3;
iron(III) oxide

iron(III) oxide

copper(I) sulfide
22205-45-4

copper(I) sulfide

sulfur dioxide
7446-09-5

sulfur dioxide

Conditions
ConditionsYield
In neat (no solvent) Kinetics; kinetics and statics described;; generation of SO2;;
manganese(III) oxide

manganese(III) oxide

copper(I) sulfide
22205-45-4

copper(I) sulfide

manganese oxide

manganese oxide

Conditions
ConditionsYield
In neat (no solvent) byproducts: Cu, SO2; react. at 700 °C;;
In neat (no solvent) byproducts: Cu, SO2; react. at 700 °C;;
Conditions
ConditionsYield
With NH3; C In ammonia aq. NH3; Cu2S nanowires on copper grids with or without carbon coating washed with HCl for ca. 20 min, then by H2O and then immersed into aq. NH3 for 2 h; samples of Cu(OH)2 nanobelts washed with H2O, dried (air);
Conditions
ConditionsYield
In neat (no solvent) byproducts: SO2, H2; at light red heat;;
In neat (no solvent) byproducts: SO2, H2; at light red heat;;
In neat (no solvent) byproducts: H2S, H2, sulphur; weak react. at red heat, violent react. at white heat;;
copper(I) sulfide
22205-45-4

copper(I) sulfide

water
7732-18-5

water

copper(I) oxide

copper(I) oxide

Conditions
ConditionsYield
In neat (no solvent) on heating;;
In neat (no solvent) on heating;;

22205-45-4Relevant articles and documents

Synthesis and the crystal structure of CeCuS2

Komatsuzaki,Takase,Smura,Takahashi,Takano,Sekizawa,Clarke

, p. 586 - 588 (2006)

Single phase of CeCuS2 has been prepared by the mixture of CeO2 and Cu2S at 1000 ° C in CS2/Ar atmosphere. All X-ray diffraction peaks of CeCuS2 are indexed on the basis of the monoclinic system (space group: P21c) the same as LaCuS 2 and NdCuS2. The lattice parameters obtained by Rietveld analysis are a=0.6573(1) nm, b=0.7256(1) nm, c=0.6875(1) nm, and β=98.566(1)°.

Growth of bi-partite and metallic copper whiskers

Jha,Grieveson

, p. 2299 - 2311 (1990)

Conditions for the growth of metallic copper and bi-partite whiskers of copper and cuprous sulphide are described with particular emphasis on the physical chemistry of the growth process. The mechanism of growth is explained and the significance of phase

CuS nanostructures prepared by a hydrothermal method

Huang, Qing-Li,Chen, Hu,Zhang, Yong Cai,Le Wu, Chang

, p. 6382 - 6387 (2011)

Without using any surfactant or template, novel CuS three-dimensional (3D) structures consisting of nanosheets were successfully synthesized via a convenient one-step hydrothermal approach. X-ray diffraction pattern showed that the as-prepared product was pure hexagonal phase CuS. Scanning electron microscopy and high-resolution transmission electron microscopy images revealed that the as-prepared product comprised 3D microspheres (about 1-3 μm in diameter), which were further constructed with randomly oriented, single-crystalline CuS nanosheets (about 20 nm in thickness). The UV-vis absorption spectrum of the as-synthesized CuS 3D microspheres displayed an optical absorption minimum near 672 nm. Besides, the thermal stability of the as-synthesized CuS 3D microspheres was also studied.

Phosphine stabilized copper(i) complexes of dithiocarbamates and xanthates and their decomposition pathways

Afzaal, Mohammad,Rosenberg, Chico L.,Malik, Mohammad A.,White, Andrew J. P.,O'Brien, Paul

, p. 2773 - 2780 (2011)

Phosphine stabilized compounds [Cu(i)(S2CNEt2)PR 3]2 (1-3) (R = OMe, Me and Et, respectively) and [Cu(i)(S2COEt)PR3]2 (4, 5), (R = OMe, and Me, respectively) have been prepared and characterised. The structures of compounds (1-3) were determined by X-ray single crystallography. The structures of all three compounds are based on centro-symmetric dimers which crystallise in the monoclinic space group P21/n with two [Cu(i)(S2CNEt 2)PR3]2 molecules per unit cell. The thermal decomposition of selected complexes was investigated by thermogravimetric, differential scanning calorimetry and gas chromatography with mass spectroscopy to understand the possible decomposition pathways.

Synergistic Effect of Chemical Substitution and Insertion on the Thermoelectric Performance of Cu26V2Ge6S32Colusite

Shimizu, Yuta,Suekuni, Koichiro,Saito, Hikaru,Lemoine, Pierric,Guilmeau, Emmanuel,Raveau, Bernard,Chetty, Raju,Ohta, Michihiro,Takabatake, Toshiro,Ohtaki, Michitaka

, p. 11364 - 11373 (2021)

Copper-based sulfides are promising materials for thermoelectric applications, which can convert waste heat into electricity. This study reports the enhanced thermoelectric performance of Cu26V2Ge6S32 colusite via substitution of antimony (Sb) for germanium (Ge) and introduction of copper (Cu) as an interstitial atom. The crystal structure of the solid solutions and Cu-rich compounds were analyzed by powder X-ray diffraction and scanning transmission electron microscopy. Both chemical approaches decrease the hole carrier concentration, which leads to a reduction in the electronic thermal conductivity while keeping the thermoelectric power factor at a high value. Furthermore, the interstitial Cu atoms act as phonon scatterers, thereby decreasing the lattice thermal conductivity. The combined effects increase the dimensionless thermoelectric figure of merit ZT from 0.3 (Cu26V2Ge6S32) to 0.8 (Cu29V2Ge5SbS32) at 673 K.

Sonochemical preparation of copper sulfides with different phases in aqueous solutions

Kristl, Matja?,Hojnik, Nu?a,Gyergyek, Sa?o,Drofenik, Miha

, p. 1184 - 1188 (2013)

There is a growing interest in the synthesis of nanostructured copper sulfides due to their ability to form compounds with various stoichiometries. We report a sonochemical route for the preparation of copper sulfides with different compositions in aqueous solutions, using different, general and convenient copper sources such as copper acetate, copper hydroxide or basic copper carbonate and thiourea or thioacetamide as sulfur precursors under ambient air. Phase analysis, purity and morphology of the products were studied by X-ray powder diffraction (XRD), transmission electron microscopy (TEM), and thermogravimetric analysis (TGA). The results revealed that nanoparticles of covellite, CuS, with crystallite sizes between 7 and 18 nm can be obtained by using different precursors and complexing agents and that chalcocite, Cu 2S, can also be prepared sonochemically.

Field emission from crystalline copper sulphide nanowire arrays

Chen, Jun,Deng,Xu,Wang, Suhua,Wen, Xiaogang,Yang, Shihe,Yang, Chunlei,Wang, Jiannong,Ge, Weikun

, p. 3620 - 3622 (2002)

Straight crystalline copper sulphide (Cu2S) nanowire arrays have been grown by using a simple gas-solid reaction at room temperature. These were demonstrated to exhibit semiconductor properties. Field emission was observed at a field of ~6MV/m, and its current-field characteristics deviate from Fowler-Nordheim theory, i.e., showing a nonlinear Fowler-Nordheim plot. The uniform emission from the whole arrays was observed using transparent anode technique, and their variation with applied field was recorded. The emission from individual nanowires was also studied using a field emission microscope, and was found to consist of a number of spatially resolved diffuse spots. Finally, stable emission current at different levels and over time was recorded. These findings indicate that semiconductor nanowires as cold cathode have a potential future, worthy of further comprehensive investigation. The technical importance of using semiconductor nanowires as cold cathode emitter is given.

Effect of Precursor Mixture Composition on the Phase Composition and Electrical Transport Properties of Cu1.85ZnSnS4 and Cu1.5Zn1.15Sn0.85S4 Kesterite Solid Solutions Prepared in Molten KI

Gapanovich,Agapkin,Odin,Rakitin,Sedlovets,Kolesnikova,Novikov

, (2018)

We have studied the effect of precursor mixture composition on the phase composition and electrical transport properties of Cu1.85ZnSnS4 and Cu1.5Zn1.15Sn0.85S4 solid solutions with the kes

Hydrothermal synthesis of transition-metal sulfide dendrites or microspheres with functional imidazolium salt

Li, Kangfeng,Wang, Qiaojian,Cheng, Xianyi,Lv, Tianxi,Ying, Taokai

, p. L31-L35 (2010)

A series of transition-metal sulfide (PbS, CdS, ZnS, CoS, Cu2S) compounds were successfully synthesized through a facile hydrothermal method using 1-butyl-3-methlyimidazole thiocyanate ([BMIM][SCN]) as both sulfur source and capping ligand. The resultant products were characterized by X-ray powder diffraction (XRD) measurements in order to determine the crystalline phase of the products. The structural and morphological features of the samples were investigated by scanning electron microscopy (SEM), which showed that the morphologies of PbS and CdS were novel hierarchical dendrites, but rough exterior microspheres of ZnS, CoS and Cu2S. A possible reaction process was simply discussed in the end.

Thermal stability and kinetic studies of new dinuclear copper(II) complexes with octaazamacrocyclic and multidonor bidentate ligands

Sovilj, Sofija P.,Babi?-Samard?ija, Ksenija,Mini?, Dragica M.

, p. 29 - 35 (2001)

The thermal properties of four copper(II) complexes with N,N′,N″,N?-tetrakis(2-pyridylmethyl)-1,4,8, 11-tetraazacyclote-tradecane (tpmc) and several bidentate ligands N,S (thiosemicarbazide and thiourea) or N,O donors (semicarbazide and urea), of the general formula [Cu2(X)tpmc](ClO4)4, have been investigated by thermogravimetry (TG) and differential scanning calorimetry (DSC). The thermal stability order can be recognized for the examined complexes, depending on coordinated bidentate bridging N,S or N,O ligand. Kinetic data demonstrated first-order thermal decomposition. A plausible mechanism has been proposed which explains the major products of the degradation.

Post a RFQ

Enter 15 to 2000 letters.Word count: 0 letters

Attach files(File Format: Jpeg, Jpg, Gif, Png, PDF, PPT, Zip, Rar,Word or Excel Maximum File Size: 3MB)

1

What can I do for you?
Get Best Price

Get Best Price for 22205-45-4