Kim et al.
Synthesis and Characterization of Arylacetylene Derivative as Solution Processable Organic Semiconductors for OTFTs
2.2.5. Synthesis of 4,7-Bis((4-(thiophen-2-yl)phenyl)
ethynyl)benzo[c][1,2,5]thiadiazole(5)
2-(4-Ethynylphenyl)thiophene (3, 100 mg, 0.54 mmol),
speed (6 mm/min). The solutioꢀn-sheared substrates were
placed in a vacuum oven at 90 C for 3 hr to remove the
residual solvent. Film thicknesses were characterized by
profilometer (DEKTAK-XT, Brucker) with a thickness in
the 20–50 nm range. Gold source and drain electrodes
(40 nm) were thermally evaporated through a shadow
mask with various channel lengths length (L; 50 ꢀm) and
width (W; 1000 ꢀm).
4,7-diiodobenzo[c][1,2,5]thiadiazole
(4,
104
mg,
0.26 mmol), Pd(PPh3ꢃ4 (16 mg, 0.013 mmol), and CuI
(5.4 mg, 0.028 mmol) were dissolved in 10 mL of tri-
ethylaꢀmine/THF (1:1). The reaction mixture was heated
at 60 C for 24 h under N2 atmosphere. After completion
of the reaction (indicated by TLC), solvent was removed
by reducing pressure. The crude mixture was dissolved
in CH2Cl2 and washed with water and brine solution.
Then, organic layer was separated, dried over anhydrous
MgSO4 and evaporated in vacuo. Then the crude prod-
uct was purified by column chromatography on silica
gel to give compound 5 as a yellow solid (84.8 mg,
66%).11ꢄ15 1H NMR (400 MHz, CDCl3ꢃ: ꢁ 7.79 (s, 2H),
7.64 (q, 12.84, 12.12 Hz, 8H), 7.37 (d, 3.68 Hz, 2H),
7.31 (dd, 4.76, 5.12 Hz, 2H), 7.09 (q, 4.76 Hz 2H).
13C NMR (100 MHz, CDCl3): ꢁ 155.09, 144.22, 135.84,
135.72, 133.76, 133.26, 133.16, 128.98, 127.01, 126.54,
126.43, 124.65, 124.58, 122.03, 117.88, 98.24, 87.02,
125.9, 124.5, 124.4, 120.3, 120.1, 109.6. HRMS-EI(m/z):
[M + Na+] calcd. for C30H16N2S3Na+, 523.0368; found,
523.0376.
2.5. Characterization
Thermogravimetric analyses (TGA, TA Instrument Q50-
1555) were performed on sample in a platinum crucible;
the sample was heated from 40 to 700 ꢀC at a heating rate
ꢀ
of 20 C min−1, while the chamber was purged continu-
ously with N2 gas at a rate of 100 mL min−1. Differential
scanning calorimetry (DSC) analyses (TA instrument Q20-
ꢀ
2487) were performed at a scan rate of 20 C min−1 from
ꢀ
40 to 350 C. The UV-visible spectra of the compound in
chloroform were obtained using JASCO V-530 spectrome-
ter with quartz cuvette over the special range 200–800 nm.
Cyclic voltammetry (CV) experiments were performed
with a conventional three-electrode configuration (glassy
carbon working electrode, platinum-wire counter elec-
trode, and Ag/AgCl reference electrode) with support-
ing electrolyte of tetrabutylammonium tetrafluoroborate in
the specified dry solvent on AUT302N Electrochemical
Analyzer (Autolab). All electrochemical potentials were
referenced to an Fc /Fc internal standard. The current–
voltage characteristics of fabricated OTFT devices were
measured at room temperature under vacuum using a
Keithley 4200 SCS. Carrier mobilities (ꢀ) were calculated
in the saturation regime by the formula, ꢀsat = ꢆ2IDSLꢃ/
ꢇWCiꢆVG − VTꢃ2ꢈ, where IDS is the source-drain current,
L is the channel length, W is the channel width, Ci
is the areal capacitance of the gate dielectric (Ci =
11ꢂ4 nF cm−2), VG is the gate voltage, and VT is the thresh-
old voltage.
2.3. Theoretical Calculation
Density functional theory (DFT) calculations on the
Delivered by Ingenta to: Adelaide Theological Library
IP: 141.101.201.88 On: Mon, 29 Aug 2016 21:0+3:22
present semiconductor were performed using the B3LYP
Copyright: American Scientific Publishers
(Becke’s 3 parameters employing the Lee-Yang-Parr) func-
tional and the 6-31G(d) basis set as implemented in
Gaussian 03W program.
2.4. Device Fabrication
Top-contact/bottom-gate organic thin-film transistors
(OTFTs) were fabricated on a heavily n-doped (100)
silicon wafers (resistivity <0.005 ꢅ·cm) with a thermally
grown silicon dioxide (300 nm SiO2) as dielectric layer.
The Si/SiO2 substrate was washed in an ultrasonic bath
using acetone for 10 min, dried using a N2 gun and
cleaned by air plasma for 5 min (Harrick Plasma, 18 W).
The general recipes were employed for the treatment
of PS-brush layer9 and OTS self-assembled monolayer20
on the Si/SiO2 substrates. Hydroxyl end-functionalized
polystyrene (Mn = 10 kg/mol, Polymer Source) was
employed for the formation of PS-brush layer. Semicon-
ducting layers were formed via solution-shearing (SS)
method. For the SS process, a few drops of semiconductor
solution were cast onto a heated substrate (1×2 cm2), and
the substrate was covered with a dewetting OTS-modified
top substrate.21 For the optimization of film-forming
process, various solvents including toluene, chloroben-
zene, p-xylene, 1,2,4-trichlorobenzene with concentration
(1 mg/mL) were employed. Solvent evaporation was
controlled by a deposition temperature (60% of the sol-
vent boiling point in centigrade) and a solution shearing
The surface morphology and film microstructure of thin
films was characterized using an atomic force microscope
(AFM, NX10, Park Systems) and X-ray diffraction (XRD,
Miniflex, Rigaku), respectively.
3. RESULTS AND DISCUSSION
3.1. Synthesis
The synthetic pathway for the preparation of 5 is illus-
trated in Scheme 1. First 2-(4-ethynylphenyl)thiophene (3)
was prepared in three steps, namely: Sonogashira
coupling of 1-bromo-4-iodobenzene (1a) and TMS-
acetylene (1b) to afford ((4-bromophenyl)ethynyl)tri-
methylsilane (2);14 followed by Suzuki coupling of this
compound and thiopheneboronic acid (2a) to afford tri-
methyl((4-(thiophen-2-yl)phenyl)ethynyl)silane (2);15 after
which the TMS group was deprotected to afford
2-(4-ethynylphenyl)thiophene (3).16
J. Nanosci. Nanotechnol. 16, 10331–10336, 2016
10333