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between brush growth and irradiation time was then exam-
ined using a traditional, multi-wafer approach as well as
a single wafer, multiple cover slip strategy. In the first
approach, a 1 mol% PTH/DMAEMA mixture was added to
multiple 6 ꢀ 6 mm silicon wafers, each wafer covered with 18 ꢀ
18 mm cover slips and was irradiated for different lengths of
time. At a PTH catalyst loading of 1 mol%, an inhibition
period of 1 h was observed, followed by a steady increase in
thickness over time resulting in a maximum brush height of
approximately 160 nm (6 h; Supporting Information, Fig-
ure S4). This SI-CRP behavior was further confirmed through
a novel single wafer kinetic study. In this approach, P-
(DMAEMA) brush growth kinetics was investigated on
a single, 2-inch silicon wafer, by sequentially placing individ-
ual drops (ca. 10 mL) of a 5 mol% PTH polymerization
mixture together with 0.5-inch diameter circular glass cover
slips on the wafer at different time periods after starting
irradiation (15, 30, 45, 60, 120, and 180 min). Significantly,
a reproducible and controlled increase in brush thickness with
increasing time is again observed and at this higher PTH
loading level, little or no incubation period is observed
(Supporting Information, Figure S5). These results further
illustrate the dual role of PTH, acting initially as an oxygen
scavenger, and in the absence of oxygen, functioning as
a photoredox polymerization catalyst for SI-CRP.[9a]
Figure 3. Patterning using glass cover slips of different shape. Digital
images showing the preparation of “MRL” brushes on a 4-inch
diameter ATRP-initiator functionalized silicon wafer. a) Initiator-func-
tionalized silicon wafer, b) “MRL” shaped glass cover slips on the
wafer prior to brush growth, c) resulting polymer brushes after removal
of cover slips and extensive washing and d) digital micrograph of
purified polymer brushes illustrating fidelity with “MRL”-shaped cover
slips.
ability to spatially control the synthesis of polymer brushes
under ambient conditions.
An enabling feature of this novel strategy is the central
role of a transparent cover slip for mediating brush growth.
The presence of a cover slip opens up new opportunities for
controlling SI-CRP and the resulting brush features. For
example, extension of transparent cover slips to photomask
allows patterned P(BnMA) brushes with feature resolution
down to about 1 mm to be obtained. AFM confirmed the
presence of patterned brushes with varied surface topography
and corresponding height profiles (Supporting Information,
Figure S6). Furthermore, the use of gradient photomasks
leads to more unique three-dimensional polymer brush
architectures. The gradient profile was confirmed through
AFM and profilometry demonstrating the expected linear
increase in brush height along the length of the structure
(Supporting Information, Figure S7). The success of these
photomodulated experiments prompted a broadening of this
cover slip concept to multiple cover slips and arbitrary shapes.
Initial studies with mm-sized hexagon-, circle-, star-, dia-
mond-, and triangle-shaped cover slips (5 mol% PTH) allows
brushes of P(DMAEMA) to be prepared with a high degree
of fidelity, reproducing the original shape of the glass cover
slips (Supporting Information, Figure S8). Significantly, this
strategy permits multiple cover slips of arbitrary shape to be
employed simultaneously on the same silicon wafer. In
demonstrating this additional level of control, M-, R-, and
L-shaped cover slips were fabricated, and used to control
brush growth of P(DMAEMA) from select areas of a 4-inch
diameter silicon wafer. As shown in Figure 3a–d, reproduc-
tion of the “MRL” cover slips as a polymer brush pattern is
achieved by adding monomer droplets to an initiator-func-
tionalized silicon wafer. Placement of the individual M-, R-,
and L-cover slips then conformally spreads the monomer
solution under the cover slips, and brush growth is achieved
by irradiation at 405 nm. These results clearly illustrate the
Of equal importance is the ability to prepare these
polymer brushes over large surface areas. Uniform coverage
of a 4-inch (10 cm) silicon wafer could be achieved using only
200 mL of reaction solution and a 4-inch diameter glass cover
slip (ca. 2.5 mLcmÀ2). Significantly, optical reflectometry
indicates formation of a uniform polymer brush layer
(41 nm; Supporting Information, Figure S9) which demon-
strates the scalability of this approach. The versatility of this
platform was also exemplified by the growth of a wide variety
of functional polymer brushes. Importantly, the monomer
scope is not limited by the solubility of PTH in this system. As
shown in the Supporting Information, Table S2, hydrophobic,
hydrophilic, and reactive methacrylate derivatives could be
polymerized under ambient conditions, resulting in uniform
polymer brush thicknesses (20–60 nm). By measuring the
ratio between swollen and dry polymer brush heights of
poly(methyl methacrylate) PMMA, the grafting density was
estimated to be 0.28 chainsnmÀ2 (see the Supporting Infor-
mation, Figure S11 for detailed calculations).[12]
The versatility of this platform then opens up the
possibility of simultaneously growing multiple polymer
brushes from minimal reaction volumes, a critical feature
for expensive or synthetically challenging monomers. To
demonstrate this advantage, the one-step synthesis of multi-
ple, emissive copolymer brushes from sub-milligram quanti-
ties of iridium-based monomers was examined. Taking
advantage of a library of Ir-complexes recently developed in
our group,[13] four different monomer solutions (10–15 mL),
each containing a distinct Ir-complex (0.5 mol% relative to
benzyl methacrylate), were placed on a functionalized 2-inch
silicon wafer and covered with four individual cover slips.
Irradiation at 405 nm for 2 h, followed by extensive washing,
led to four well-defined features composed of different
Angew. Chem. Int. Ed. 2018, 57, 1 – 7
ꢀ 2018 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim
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