R.S. Jayashree et al. / Electrochimica Acta 50 (2005) 4674–4682
4675
has faster room temperature kinetics and has less of a ten-
dency to crossover, but the energy density of formic acid is
only one-third that of methanol [9].
There are two proposed pathways for formic acid or
methanol oxidation, namely the ‘direct pathway’ and the ‘CO
pathway’. In the ‘CO pathway’, formic acid or methanol is
oxidized to an intermediate like CO, which bonds strongly
(catalyst poisoning). For methanol electro-oxidation, COpoi-
soning is reduced by the use of Pt/Ru catalysts [10]. Formic
acid oxidation on Pt surfaces occurs through both the ‘direct
pathway’ and the ‘CO pathway’ [8,11–13]. Lu et al. have
shown that formic acid oxidation typically proceeds through
the preferred ‘direct pathway’ on Pd-modified Pt surfaces
[11], and the suppression of CO formation on Pd-modified
Pt has been confirmed by FT-IR studies [14].
Generally, Pt and Pt-based metal nanoparticles with high
surface areas are used as catalysts in PEM-FCs. These
nanoparticles are typically painted onto the current collec-
tors with an ink containing the nanoparticles as well as a
certain percentage of Nafion solution to act as the binder
upon evaporation of the solvent [15,16]. The presence of
Nafion as a binder in catalyst inks provides good adhesion
as well as good protonic conductivity, but hampers the elec-
tronic conductivity of the matrix. McGovern et al. reported a
13% decrease in surface area and a 40% decrease in oxida-
tion current density resulting from inclusion of Nafion in Pt
application thus inhibits the complete utilization of the cat-
alyst. Alternatively, Pt-based metal catalysts can be applied
to carbon-based high surface area supports via electrodepo-
sition [7,18,19]. Here we obtain high surface area catalyst
structures on smooth supports by electrodeposition at high
deposition rates leading to rough deposits [20,21]. A key ad-
vantage of using electrodeposition as the catalyst deposition
technique is its compatibility with MEMS and post-CMOS
processing, enabling more straightforward integration of mi-
cro fuel cells in silicon-based microelectronic applications.
In this paper, we report on the preparation, structural
characterization, and the electrochemical activity of elec-
trodeposited dendritic Pt (pure Pt), spontaneously deposited
Pd on dendritic Pt (Pt/Pd-SD), co-electrodeposited Pt/Pd
(Pt/Pd = 1:1), and electrodeposited Pd (pure Pd) catalyst
structures towards formic acid oxidation. The performance
of silicon-based micro fuel cells equipped with these catalyst
structures will also be studied and compared.
Fig. 1. Schematic diagram of micro fabricated Si-based MEA. In this paper,
the cathode catalyst is always pure Pt, and the anode catalyst is pure Pt,
Pt/Pd = 1:1, pure Pd, or Pt/Pd-SD.
˚
front side with a 1000 A Au layer by dc magnetron sputter-
ing (∼10−2 Torr of Ar background pressure). Subsequently,
this Au layer, the eventual current collector, is further pat-
terned into circular grids using a multistep procedure involv-
ing photolithography and liftoff, as reported previously [22].
In brief, the same side was then covered via spincoating with
that was further patterned and etched using deep reactive ion
etching (Plasma-Therm SLR 770) from the top and the bot-
tom to yield the 50-m thick Si-grids with 100-m square
holes. Si-MEAs (Fig. 1) were prepared by bonding two Si-
grids to a Nafion-112 membrane (Fuel Cell Scientific, Stone-
ham, MA) in a sandwich configuration. Bonding of two Si-
grids to the Nafion membrane was achieved using a hot press-
ing method in an anodic bonder (EV, 501 series) at 120 ◦C
and a pressure of ∼200 N/cm2. A polyimide adhesion pro-
moter (VM652, HD Microsystem) was employed to enhance
the adhesion between the Nafion membrane and the PMDA-
ODA-covered surface of the Si-grids. A detailed description
of the fabrication of these Si-MEAs can be found elsewhere
[2,22].
2.2. Pt and Pt/Pd deposition
2.2.1. Pt deposition
High surface area, dendritic Pt catalyst structures (pure Pt)
were prepared by electrodeposition on Au-coated Si-grids,
either potentiostatically (−1, −2, or −5 V) versus a Ag/AgCl
reference electrode (in 3 M NaCl, BAS, West-Lafayette, IN),
or galvanostatically (−230, −1135, or −1365 mA/cm2) in a
0.08 M H2PtCl6·6H2O solution (Alfa Aesar) for 120 s, using
an Autolab PGSTAT-30 potentiostat.
2.2.2. Spontaneous Pd deposition
The spontaneously deposited Pd on dendritic Pt (Pt/Pd-
SD) sample was obtained by depositing Pd onto the high sur-
face area dendritic Pt structures (pure Pt, Section 2.2.1) by
spontaneous deposition as described elsewhere [11]. In short,
the Pt-covered Si-MEAs were first cleaned electrochemically
in 0.1 M H2SO4 (GFS Chemicals, Powell, OH) by cycling
between 0 and 1.5 V versus RHE. Then the electrodes were
placed in a 5 mM Pd(NO3)2 (Aldrich, 10 wt.% solution in
10 wt.% HNO3) + 0.1 M H2SO4 solution for 5 min, followed
by thorough rinsing with Milli-Q water (Barnsted E-pure wa-
ter, 18 Mꢀ cm). These electrodes were electrochemically an-
nealed by cycling five times between 0.05 and 0.95 V in 0.1 M
2. Experimental
2.1. Microfabrication of Si-MEA assemblies
Silicon-based membrane electrode assemblies (Si-MEAs)
were prepared using standard microfabrication processes. A
100 mm N-doped double-sided polished Si-wafer (Silicon
Quest, 500 m thick, ꢀ1 0 0ꢁ oriented) was covered on the