Design of multilayered polymeric dielectric insulators for advanced microelectronics packaging

Article abstract of DOI:10.1080/10587259408039221

2,2-Bis[ 4-{ (4-fluorophenyl)buta-1,3-diynyl} phenyloxyphenyl] hexafluoropropane and co-polymer of 1,4-bis(4-fluorophenyl)buta-1,3-diyne and hexafluorobisphenol-A were prepared for the use as photosensitive multilayered polymeric dielectric insulators. Th

Full text of DOI:10.1080/10587259408039221

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Molecular Crystals and Liquid Crystals
Science and Technology. Section A.
Molecular Crystals and Liquid Crystals
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Design of Multilayered Polymeric
Dielectric Insulators for Advanced
Microelectronics Packaging
Young Tae Park a , Newell Chiesel b & James Economy b
a Department of Chemistry , College of Natural Science
Keimyung University , Daegu, 704-701, S. Korea
b Department of Materials Science and Engineering , University
of Illinois , Urbana-Champaign, IL, 61801, U.S.A.
Published online: 04 Oct 2006.
To cite this article: Young Tae Park , Newell Chiesel & James Economy (1994) Design of
Multilayered Polymeric Dielectric Insulators for Advanced Microelectronics Packaging, Molecular
Crystals and Liquid Crystals Science and Technology. Section A. Molecular Crystals and Liquid
Crystals, 247:1, 351-363, DOI: 10.1080/10587259408039221
To link to this article: http://dx.doi.org/10.1080/10587259408039221
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