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F.M. Tunez et al. / Thermochimica Acta 523 (2011) 124–136
influence on the chlorination rate, varying the required time to
complete the reaction between about 8 min at higher partial pres-
sures and 25 min for the lowest. Also, as in the isothermic essays at
constant pressure, the influence of the exothermic effect produced
by the chlorination reaction is observed, which causes a partial
evaporation of some reaction products, producing a difference
between the mass changes expected and those observed.
The chlorination rate of GaAs with pure Cl2 (1 atm) in the tem-
perature range between 300 and 900 ◦C is slightly affected by the
reaction temperature. Between 300 and 700 ◦C, and after the reac-
tion is finished, solid residues constituted by Ga2O3 and GaOAs4
remain. The formation of these compounds is due to the inter-
action in gaseous phase of the trichloride of Ga and As from the
chlorination of GaAs and the O2 contained in the used Cl2.
The effect of the partial pressure of Cl2 on the chlorination rate
at 300 and 500 ◦C is noticeable. The chlorination at 300 ◦C is com-
pleted in approximately 8 and 42 min, working with 1 and 0.2 atm
of Cl2, respectively. The residues of the chlorination at 0.2 atm con-
tain only GaAs because the reaction stops due to a lack of products
in the vapor phase which may continue catalyzing the chlorination
reaction.
References
[1] R.R. Moskalyk, Gallium the backbone of the electronics industry, Miner. Eng.
16 (2003) 921–929.
[2] D.R. Lide, Handbook of Chemistry and Physics, CRC Press Inc., Florida,
2006–2007.
[3] W.S. Lim, S.D. Park, B.J. Park, G.Y. Yeom, Atomic layer etching of (1 0 0/1 1 1)
GaAs with chlorine and low angle forward reflected Ne neutral beam, Surf.
Coat. Technol. 202 (2008) 5701–5704.
[4] J. Cui, L. Zhang, Metallurgical recovery of metals from electronic waste: a
review, J. Hazard. Mater. 158 (2008) 228–256.
[5] J. Cui, E. Forssberg, Mechanical recycling of waste electric and electronic equip-
ment: a review, J. Hazard. Mater. B99 (2003) 243–263.
[6] J.E. Hoffmann, Advances in the extractive metallurgy of selected rare and pre-
cious metals, JOM 43 (1991) 18.
[7] P.K. Jena, E.A. Brocchi, Metal extraction through chlorine metallurgy, Mineral
Process Extractive Metallurgy Review 16 (1997) 211.
[8] S. Kubo, M. Yukinobu, O. Yamamoto, G. Nabeshima, J. Okajima, Recovery of
high purity gallium metal from gallium-arsenide scrap, in: J.H.L. Van Linden,
D.L. Stward Jr., Y. Sahai (Eds.), In the Second International Symposium-recycling
of Metals and Engineered Materials, TMS, 1990, pp. 505–513.
[9] A. Jenichen, C. Engler, Etching of GaAs(1 0 0) surfaces by HCl: density functional
calculations to the mechanisms, Surf. Sci. 475 (2001) 131–139.
[10] W. Hung, S. Wu, C. Chang, Low-temperature chlorination of GaAs(1 0 0), J. Phys.
Chem. 102 (1998) 1141–1148.
[11] P. Bond, P.N. Brier, J. Fletcher, W.J. Jia, H. Price, P.A. Gorry, Reactive scat-
tering study of etching dynamics: Cl2 on GaAs(1 0 0), Surf. Sci. 418 (1998)
181–209.
[12] L. Jalabert, P. Dubreuil, F. Carcenac, S. Pinaud, L. Salvagnac, H. Granier, C.
Fontaine, High aspect ratio GaAs nanowires made by ICP-RIE etching using
Cl2/N2 chemistry, Microelectron. Eng. 85 (2008) 1173–1178.
[13] W.S. Lim, S.D. Park, B.J. Park, G.Y. Yeom, Atomic layer etching of (1 0 0)/(1 1 1)
GaAs with chlorine and low angle forward reflected Ne neutral beam, Surf. Coat.
Technol. 202 (2008) 5701–5704.
The reaction mechanism depends on temperature range. At all
temperatures steps b–j operates. At temperatures between −30 ◦C
and 200 ◦C, step a must be added as the initiation one. At tem-
peratures between 300 ◦C and 500 ◦C, the initiation step involves
the step h. Finally, at temperature between 600 ◦C and 900 ◦C, the
initiation step is Cl2(g) thermal dissociation.
[14] F. Stietz, J.A. Schaefer, A. Goldmann, Chemisorption of chlorine on GaAs(1 0 0)
surfaces studied by high-resolution electron energy-loss spectroscopy, Surf.
Sci. 383 (1997) 123–129.
[15] T. Ohno, Theory of adsorption of Cl2 molecules on GaAs(0 0 1) surfaces, Surf.
Sci. 357 (1996) 322–326.
6. Conclusions
[16] Y.N. Park, J.K. Kim, J.H. Lee, Y.W. Joo, H.S. Noh, J.W. Lee, S.J. Pearton, N2 effect on
GaAs etching at 150 mTorr capacitively-couped Cl2/N2 plasma, Microelectron.
Eng. 87 (2010) 548–552.
[17] F.M. Tunez, M. del C. Ruiz, J.A. González, Kinetics of chlorination of GaAs, in:
2nd Mercosur Congress on Chemical Engineering EMPROMER, 2005.
[18] HSC Chemistry for Windows, versión 5.1, Outokumpu Research, Finland, 2002.
[19] F.M. Tunez, J. González, M. del C. Ruiz, Equipo experimental de laborato-
rio para realizar termogravimetrías en atmósferas corrosivas y no corrosivas,
P060100450 (2007).
The results obtained permit to state that GaAs chlorination is
a viable methodology to recover Ga and As from GaAs. At low
temperature, Ga and As chlorides are in solid and/or liquid state,
and the pressure vapor diagrams versus temperature indicate that
separation by distillation is feasible.
Acknowledgment
[20] N.K. Singh, R. Krout, Thermal and electron-induced reactions of AsCl3 on
GaAs(1 0 0), Surf. Sci. 442 (1999) 442–454.
The authors wish to thank the National University of San Luis,
CONICET (National Council of Scientific and Technical Research)
and FONCyT (Fund for Scientific and Technological Research) for
financial support.
[21] Card N◦ 20-0426, JCPDS Powder Diffraction File (2003).
[22] Card N◦ 76-0573, JCPDS Powder Diffraction File (2003).
[23] Card N◦ 89-4432, JCPDS Powder Diffraction File (2003).
[24] Card N◦ 32-0389, JCPDS Powder Diffraction File (2003).