Inorganic Chemistry
Article
fully occupied octahedral divalent Bi3 and complex occupation
by interstitial Cu atoms (Cu3, Cu4, and Cu5) surrounding the
random distribution of Se5 atoms. The 14 atomic sites of Cu, Bi,
and Se in a unit cell are summarized in Supporting Information
(Table S1). For the engineering of electronic and thermal
transport properties in this complex structure by doping
approach, the fundamentals of the structural characteristics for
each atomic site including atomic position, bonding, and charge
valence should be clarified.
To address this issue, the Rietveld refinements of high-
resolution synchrotron powder diffractions were performed for
three compositions of Cu1.3Bi4.9Se8, Cu1.7Bi4.7Se8, and
Cu1.9Bi4.6Se8 as shown in Figure 2. For a high accuracy of
less than unity. Refinement results are summarized in Supporting
Information (Tables S1 and S2). Note that the occupancies of
the interstitial Cu sites (Cu3−Cu6) considerably increased with
increasing Cu content in Cux+yBi5−ySe8, whereas the occupancies
of substitutional Cu sites were almost same with altering Cu/Bi
ratio. This indicates that Cu ions are favorable to occupy the
interstitial atomic sites rather than the substitutional ones in this
structure. Total occupancy ratio (Occint/Occsub) between
interstitial (Occint) and substitutional (Occsub) Cu sites were
11.26, 15.04, and 16.92 for Cu1.3Bi4.9Se8, Cu1.7Bi4.7Se8, and
Cu1.9Bi4.6Se8, respectively. Both lattice constants and the value of
β angle were slightly changed maintaining the similar volume
with varying Cu/Bi ratio. Interestingly, the lattice parameter of b
decreased with increasing Cu content, while the value of β angle
increased. This implies that the lattice distortion and atomic
disordering are relevant to the configuration of Cu ions (that is,
the occupancy of interstitial Cu sites). Thus, a large structural
change can be induced by the impurity doping on the interstitial
Cu sites together, leading to the expectation of a dramatic change
in TE transport properties. The simulated charge density
distributions of the (2 0 0) planes based on the structure
refinements are represented in the insets of Figure 2. The charge
densities of four interstitial Cu ions at c = 1/2 are overlapping
each other along the b-axis, and the degree of charge density
overlapping between the interstitial Cu ions depends on the
occupancy of interstitial Cu, resulting in the change in the lattice
parameter of b. This is correlated with the change in electronic
transport properties, since the interstitial Cu sites along b-axis
become a conduction path, leading to an improvement of
electron transfer across the basal plane.3 Additionally, interstitial
Cu sites distributed in a zigzag pattern along b-axis can effectively
scatter (or block) the heat-carrying phonon between alternating
slabs. Indeed, the highest σ and the lowest κ values were observed
in Cu1.9Bi4.6Se8 with highest Cu content.3 This strongly suggests
that the interpretation of structural characteristics can predict the
changes of electronic and thermal transport properties by doping
at interstitial sites.
(a). Divalent Substitutional Cu (Cu1 and Cu2) and
Interstitial Cu Site (Cu3, Cu4, Cu5, and Cu6). Cu sites in
Cux+yBi5−ySe8 can be categorized into two types in terms of
coordination number and site occupancy shared with adjacent Bi
sites (Figure 1c). Substitutional Cu sites (Cu1 and Cu2, azure)
share the occupancy with the nearest neighbor Bi1 or Bi2 sites.
Otherwise, the others are interstitial Cu sites (Cu3−Cu6, blue).
Divalent Cu ions are distributed at two substitutional sites of
trivalent Bi sites (Bi1(2a) and Bi2(4i)) being substituted in the
accreting slab and at four interstitial sites (4i) in nonaccreting
slab. Substitutional Cu sites are very close to the neighboring Bi
sites (Cu1−Bi1 (0.54 Å), Cu2−Bi2 (1.10 Å)), while the
interatomic distances for Cu1−Cu6 (4.0 Å), Cu2−Cu6 (2.98
Å), and Cu1−Cu2 (3.77 Å) are too long. Interstitial Cu sites are
statistically distributed in a zigzag pattern around c = 1/2 along b-
axis. In nonaccreting slab, Cu−Cu bonding along b-axis
consisting of Cu3−Cu5 (1.77 Å), Cu5−Cu3 (1.77 Å), and
Cu3−Cu3 (1.25 Å) connections in a diamond shape can form an
electrical conduction path. In accreting slab, zigzag-shaped
bonding between Cu6−Cu6 (2.32 Å) chains can also make
another electrical conduction path along b-axis. Thus, the
electron conduction might be more favorable in a path parallel to
b-axis, suggesting the anisotropy in electrical and electronic
thermal conductivities. These directional atomic distributions
and bondings between interstitial Cu ions can also induce the
Figure 2. Refinement results of Rietveld analyses for (a) Cu1.3Bi4.9Se8,
(b) Cu1.7Bi4.7Se8, and (c) Cu1.9Bi4.6Se8 pavonite homologues.
Synchrotron XRD patterns (black line), calculated patterns (red circle),
calculated Bragg peak positions (green) for primary (up) and secondary
(down: Bi2Se3) phases, and residual, which is the difference between
measured and calculated patterns (blue). Measured range is from 1.5° to
50° in 2θ. (inset) The charge densities on the (2 0 0) planes for each
compound.
refinements between experimental and calculated diffraction
patterns, thermal displacement parameters were refined first
under the fixed occupancies followed by the refinement of
occupancy for each atom considering three structural con-
straints: (i) the divalent Bi site (Bi3) is fully occupied, (ii) the
total occupancies of Se is 4, and (iii) the sum of occupancy for
substitutional Bi (Bi1 and Bi2) and Cu (Cu1 and Cu2) sites is
C
dx.doi.org/10.1021/ic5014945 | Inorg. Chem. XXXX, XXX, XXX−XXX