Welcome to LookChem.com Sign In|Join Free

CAS

  • or
Copper(I) iodide (CuI), also known as cuprous iodide, is a versatile catalyst widely used in organic synthesis, including multicomponent reactions, trifluoromethylation, click chemistry, C–O/N–S bond formation, and sulfenylation reactions. It efficiently facilitates transformations such as the synthesis of propiolamidine derivatives, trifluoromethylated triazoles, glucopyranosyl triazoles, benzothiadiazines, and sulfenyl pyrroles under mild conditions, often with high yields and selectivity. Its role in copper-catalyzed processes is enhanced by additives like bases (e.g., triethylamine) or promoters (e.g., tetrabutylammonium iodide), and it operates effectively in various solvents, including acetonitrile, DMF, and water. CuI's broad applicability spans pharmaceuticals, agrochemicals, and materials science, underscoring its importance in modern synthetic chemistry.

7681-65-4 Suppliers

Post Buying Request

Recommended suppliersmore

  • Product
  • FOB Price
  • Min.Order
  • Supply Ability
  • Supplier
  • Contact Supplier
  • 7681-65-4 Structure
  • Basic information

    1. Product Name: Copper(I) iodide
    2. Synonyms: Coppermonoiodide;Copper(1+) iodide;Copper(I) iodide;Cuprous iodide(CuI);Copper iodide (CuI);
    3. CAS NO:7681-65-4
    4. Molecular Formula: CuI
    5. Molecular Weight: 190.45047
    6. EINECS: 231-674-6
    7. Product Categories: N/A
    8. Mol File: 7681-65-4.mol
  • Chemical Properties

    1. Melting Point: 605℃
    2. Boiling Point: 1290 °C
    3. Flash Point: 1290°C
    4. Appearance: white to grey or tan powder
    5. Density: 5.62 g/cm3
    6. Refractive Index: N/A
    7. Storage Temp.: N/A
    8. Solubility: N/A
    9. Water Solubility: INSOLUBLE
    10. CAS DataBase Reference: Copper(I) iodide(CAS DataBase Reference)
    11. NIST Chemistry Reference: Copper(I) iodide(7681-65-4)
    12. EPA Substance Registry System: Copper(I) iodide(7681-65-4)
  • Safety Data

    1. Hazard Codes:  Xi:Irritant;
    2. Statements: R36/37/38:;
    3. Safety Statements: S24/25:;
    4. WGK Germany:
    5. RTECS:
    6. HazardClass: N/A
    7. PackingGroup: N/A
    8. Hazardous Substances Data: 7681-65-4(Hazardous Substances Data)

7681-65-4 Usage

Chemical Description

Copper(I) iodide is a yellowish-white solid with the chemical formula CuI.

Check Digit Verification of cas no

The CAS Registry Mumber 7681-65-4 includes 7 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 4 digits, 7,6,8 and 1 respectively; the second part has 2 digits, 6 and 5 respectively.
Calculate Digit Verification of CAS Registry Number 7681-65:
(6*7)+(5*6)+(4*8)+(3*1)+(2*6)+(1*5)=124
124 % 10 = 4
So 7681-65-4 is a valid CAS Registry Number.
InChI:InChI=1/Cu.HI/h;1H/q+1;/p-1

7681-65-4 Well-known Company Product Price

  • Brand
  • (Code)Product description
  • CAS number
  • Packaging
  • Price
  • Detail
  • Alfa Aesar

  • (43153)  Copper(I) iodide, Puratronic?, 99.998% (metals basis)   

  • 7681-65-4

  • 5g

  • 383.0CNY

  • Detail
  • Alfa Aesar

  • (43153)  Copper(I) iodide, Puratronic?, 99.998% (metals basis)   

  • 7681-65-4

  • 25g

  • 1295.0CNY

  • Detail
  • Alfa Aesar

  • (43153)  Copper(I) iodide, Puratronic?, 99.998% (metals basis)   

  • 7681-65-4

  • 100g

  • 4126.0CNY

  • Detail
  • Alfa Aesar

  • (11606)  Copper(I) iodide, 98%   

  • 7681-65-4

  • 250g

  • 897.0CNY

  • Detail
  • Alfa Aesar

  • (11606)  Copper(I) iodide, 98%   

  • 7681-65-4

  • 1kg

  • 2708.0CNY

  • Detail
  • Sigma-Aldrich

  • (205540)  Copper(I)iodide  98%

  • 7681-65-4

  • 205540-50G

  • 398.97CNY

  • Detail
  • Sigma-Aldrich

  • (205540)  Copper(I)iodide  98%

  • 7681-65-4

  • 205540-250G

  • 1,103.31CNY

  • Detail
  • Sigma-Aldrich

  • (205540)  Copper(I)iodide  98%

  • 7681-65-4

  • 205540-1KG

  • 3,256.11CNY

  • Detail
  • Aldrich

  • (215554)  Copper(I)iodide  99.999% trace metals basis

  • 7681-65-4

  • 215554-5G

  • 517.14CNY

  • Detail
  • Aldrich

  • (215554)  Copper(I)iodide  99.999% trace metals basis

  • 7681-65-4

  • 215554-25G

  • 1,750.32CNY

  • Detail
  • Aldrich

  • (215554)  Copper(I)iodide  99.999% trace metals basis

  • 7681-65-4

  • 215554-100G

  • 5,303.61CNY

  • Detail
  • Aldrich

  • (215554)  Copper(I)iodide  99.999% trace metals basis

  • 7681-65-4

  • 215554-1KG

  • 37,978.20CNY

  • Detail

7681-65-4SDS

SAFETY DATA SHEETS

According to Globally Harmonized System of Classification and Labelling of Chemicals (GHS) - Sixth revised edition

Version: 1.0

Creation Date: Aug 16, 2017

Revision Date: Aug 16, 2017

1.Identification

1.1 GHS Product identifier

Product name iodocopper

1.2 Other means of identification

Product number -
Other names cooper iodide

1.3 Recommended use of the chemical and restrictions on use

Identified uses For industry use only.
Uses advised against no data available

1.4 Supplier's details

1.5 Emergency phone number

Emergency phone number -
Service hours Monday to Friday, 9am-5pm (Standard time zone: UTC/GMT +8 hours).

More Details:7681-65-4 SDS

7681-65-4Synthetic route

Conditions
ConditionsYield
In tetrahydrofuran all operations in sealed evacuated tubes with thoroughly dried and degassed solvents; soln. of t-BuOCu added to a blue-green soln. of Sm complex; ppt. sepd. and washed with 10% HNO3; ppt. of CuI insoluble in HNO3 sepd. off; remaining soln. concd. and kept at 80° until complete dissolution of a fine ppt.; cooled slowly to ca. 20°; crystal sepd.; dried; identified by elem. anal., IR;A 100%
B 97.7%
C 92.3%
LaI3(tetrahydrofuran)3
147312-03-6

LaI3(tetrahydrofuran)3

copper (I) tert-butoxide
35342-67-7, 35342-68-8

copper (I) tert-butoxide

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

lanthanum tert-butoxycuprate

lanthanum tert-butoxycuprate

Conditions
ConditionsYield
In tetrahydrofuran all operations in sealed evacuated tubes with thoroughly dried and degassed solvents; soln. of the cuprate added to a soln. of La complex; stirred for 0.5 h at ca. 20° and for 2 h at 60°; ppt. of CuI sepd. by centrifugation; reaction mixt. concd. and kept at 80° until complete dissolution of a finely dispersed ppt.; cooledslowly to 20°; crystals sepd. and dried in vacuo; identified by elem. anal. and IR spectrum;A 90.2%
B 95%
tris(tetrahydrofurane)triiodidoneodymium(III)
113316-94-2

tris(tetrahydrofurane)triiodidoneodymium(III)

copper (I) tert-butoxide
35342-67-7, 35342-68-8

copper (I) tert-butoxide

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

neodymium tert-butoxycuprate

neodymium tert-butoxycuprate

Conditions
ConditionsYield
In tetrahydrofuran all operations in sealed evacuated tubes with thoroughly dried and degassed solvents; soln. of the cuprate added to a soln. of Nd complex; stirred for 0.5 h at ca. 20° and for 2 h at 60°; ppt. of CuI sepd. by centrifugation; reaction mixt. concd. and kept at 80° until complete dissolution of a finely dispersed ppt.; cooledslowly to 20°; crystals sepd. and dried in vacuo; identified by elem. anal. and IR spectrum;A n/a
B 90.3%
copper(II) choride dihydrate

copper(II) choride dihydrate

potassium iodide
7681-11-0

potassium iodide

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In water pptg. from a CuCl2*2H2O soln. with an excess of KI soln.; Debye-Scherrer XRD;
iodine
7553-56-2

iodine

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
With copper(II) sulfate In not given iodine containing compounds used;
With alkali sulfite; copper(II) sulfate In not given iodine containing compounds used;
iodine
7553-56-2

iodine

copper(I) bromide
7787-70-4

copper(I) bromide

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In water; xylene byproducts: CuBr2; shaking a soln. of CuBr in concd. Br(1-) soln. with I2 in xylol, reversible react.;;
iodine
7553-56-2

iodine

copper(l) chloride

copper(l) chloride

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In water; xylene byproducts: CuCl2; shaking a soln. of CuCl in concd. Cl(1-) soln. with I2 in xylol, reversible react.;;
iodine
7553-56-2

iodine

copper(l) chloride

copper(l) chloride

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

CuClI

CuClI

Conditions
ConditionsYield
In ethanol Kinetics; alcoholic soln. of iodine addn. to AgCl in container with ground stopper, keeping for 2, 4 or 8 h at 60°C; X-ray diffraction;
iodine
7553-56-2

iodine

copper(l) chloride

copper(l) chloride

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

copper dichloride

copper dichloride

Conditions
ConditionsYield
In acetone on addn. of a soln. of excess I2 acetone;;
sulfur dioxide
7446-09-5

sulfur dioxide

iodine
7553-56-2

iodine

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
in presence of Cu(2+);
copper (II)-fluoride

copper (II)-fluoride

iodine
7553-56-2

iodine

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In ethanol Kinetics; reaction of alcoholic soln. of iodine with CuF2 at 60°C; X-ray diffraction;
copper(II) ion

copper(II) ion

iodine
7553-56-2

iodine

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
With sulfur dioxide In water Cu salts from Cu minerals;;
iodine
7553-56-2

iodine

copper(ll) bromide
7789-45-9

copper(ll) bromide

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

copper(I) bromide
7787-70-4

copper(I) bromide

Conditions
ConditionsYield
In ethanol Kinetics; reaction of alcoholic soln. of iodine with CuBr2 at 60°C; X-ray diffraction;
iodine
7553-56-2

iodine

copper dichloride

copper dichloride

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

copper(l) chloride

copper(l) chloride

Conditions
ConditionsYield
In ethanol Kinetics; reaction of alcoholic soln. of iodine with CuCl2 at 60°C; X-ray diffraction;
copper(II) oxide

copper(II) oxide

methyl iodide
74-88-4

methyl iodide

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In neat (no solvent) byproducts: aldehyde, O2, ethylene, methane, hydrocarbons; at about 310°C in aCO2-atmoshere;;
In neat (no solvent) on treatment of CuO with gaseous methyl iodide;;
ammonium iodide

ammonium iodide

copper(II) oxide

copper(II) oxide

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

ammonia
7664-41-7

ammonia

C

water
7732-18-5

water

D

iodine
7553-56-2

iodine

Conditions
ConditionsYield
In neat (no solvent) on heating to 400-500°C;;
In neat (no solvent) on heating to 400-500°C;;
copper(I) sulfide
22205-45-4

copper(I) sulfide

silver(I) iodide

silver(I) iodide

A

copper(l) iodide
7681-65-4

copper(l) iodide

B

silver sulfide

silver sulfide

Conditions
ConditionsYield
Kinetics; solid body react. under N2 at 200-300°C;
Kinetics; solid body react. in vac.at 200-300°C;
Kinetics; solid body react. under N2 at 200-300°C;
Kinetics; solid body react. in vac.at 200-300°C;
potassium iodide
7681-11-0

potassium iodide

copper(l) chloride

copper(l) chloride

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In hydrogenchloride pptn. with KI;;
In water pptn. from the soln. of CuCl in aq. NH4Cl with KI;;>99
In water react. of CuCl with KI-soln. with passing through of N2; washing with alcohol on a filter, drying in N2 flow and then in vacuum;
In hydrogenchloride
hydrogen iodide
10034-85-2

hydrogen iodide

copper(II) sulfide

copper(II) sulfide

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
In water formation of crystals;;
potassium iodide
7681-11-0

potassium iodide

copper(II) oxide

copper(II) oxide

copper(l) iodide
7681-65-4

copper(l) iodide

Conditions
ConditionsYield
With hydrogenchloride; hydroxylamine hydrochloride; gelatin In water byproducts: N2O, KCl; NH2OH*HCl, KI added rapidly to gelatin stabilized CuO suspn. with stirring for 5 h under agitation at room temp., pH adjusted to 8-9 with HCl; washed thoroughly, vacuum dried at room temp.;
copper(l) iodide
7681-65-4

copper(l) iodide

trans-N,N'-bis(pyridin-2-ylmethylene)cyclohexane-1,2-diamine

trans-N,N'-bis(pyridin-2-ylmethylene)cyclohexane-1,2-diamine

CuI/Chxn-Py-Al

CuI/Chxn-Py-Al

Conditions
ConditionsYield
In diethyl ether; acetonitrile at 20℃; for 2h;100%
Conditions
ConditionsYield
In 1,2-dimethoxyethane Irradiation (UV/VIS); under Ar; mole ratio NaBPh4 : CuI = 1 : 1; irradn. (254 nm) for 1 h gave deposition of Cu; deposit sepd., washed with acetone and water, and dried in vac. to give pure Cu;100%
copper(l) iodide
7681-65-4

copper(l) iodide

methyllithium
917-54-4

methyllithium

MeCuILi

MeCuILi

Conditions
ConditionsYield
With N,N,N,N,N,N-hexamethylphosphoric triamide In tetrahydrofuran; diethyl ether under N2, etheral soln. of MeLi was added to a stirred suspn. of CuI in THF at -10°C, HMPT was also added, stirred for 30 min at 0°C; not isolated;100%
copper(l) iodide
7681-65-4

copper(l) iodide

tetrapropylammonium iodide
631-40-3

tetrapropylammonium iodide

bis(tetrapropylammonium) tetraiododicuprate(I)

bis(tetrapropylammonium) tetraiododicuprate(I)

Conditions
ConditionsYield
In tetrahydrofuran at 48℃; Inert atmosphere;100%
In acetonitrile dissolving CuI and NPr4I in MeCN, concg.;
copper(l) iodide
7681-65-4

copper(l) iodide

C48H38N2O6

C48H38N2O6

C48H38CuIN2O6

C48H38CuIN2O6

Conditions
ConditionsYield
In dichloromethane; acetonitrile at 20℃; for 2h;100%
copper(l) iodide
7681-65-4

copper(l) iodide

tetra-(n-butyl)ammonium iodide
311-28-4

tetra-(n-butyl)ammonium iodide

bis[(tetrabutylammonium) di-μ-iodo-diiododicuprate(I)] complex

bis[(tetrabutylammonium) di-μ-iodo-diiododicuprate(I)] complex

Conditions
ConditionsYield
In tetrahydrofuran; tert-butyl methyl ether at 10 - 48℃; for 0.75h; Inert atmosphere;100%
In tetrahydrofuran at 50℃; Inert atmosphere;600 g
Stage #1: copper(l) iodide; tetra-(n-butyl)ammonium iodide In tetrahydrofuran at 50℃; Inert atmosphere;
Stage #2: In tert-butyl methyl ether at 6℃; for 1h; Inert atmosphere;
600 g
copper(l) iodide
7681-65-4

copper(l) iodide

rac-1,2-bis[tert-butyl(anilin-2-ylthio)phosphanyl]-1,2-dicarbacloso-dodecaborane(12)

rac-1,2-bis[tert-butyl(anilin-2-ylthio)phosphanyl]-1,2-dicarbacloso-dodecaborane(12)

C22H40B10CuN2P2S2(1+)*I(1-)

C22H40B10CuN2P2S2(1+)*I(1-)

Conditions
ConditionsYield
In tetrahydrofuran at 20℃; for 18h; Inert atmosphere; Schlenk technique; stereoselective reaction;100%
copper(l) iodide
7681-65-4

copper(l) iodide

lead(II) nitrate

lead(II) nitrate

potassium iodide
7681-11-0

potassium iodide

copper lead iodide

copper lead iodide

Conditions
ConditionsYield
Stage #1: copper(l) iodide; lead(II) nitrate; potassium iodide In water for 2h;
Stage #2: at 620℃; for 72h; Sealed tube;
100%
copper(l) iodide
7681-65-4

copper(l) iodide

5-chloro-2-(pent-4-yn-1-yl)pyrimidine
126215-85-8

5-chloro-2-(pent-4-yn-1-yl)pyrimidine

(5-(5-chloropyrimidin-2-yl)pent-1-yn-1-yl)copper

(5-(5-chloropyrimidin-2-yl)pent-1-yn-1-yl)copper

Conditions
ConditionsYield
With potassium carbonate In N,N-dimethyl-formamide at 20℃; for 3h; Inert atmosphere;100%
copper(l) iodide
7681-65-4

copper(l) iodide

N,N-diethylphenylazothioformamide

N,N-diethylphenylazothioformamide

C22H30Cu2I2N6S2

C22H30Cu2I2N6S2

Conditions
ConditionsYield
In tetrahydrofuran100%
copper(l) iodide
7681-65-4

copper(l) iodide

2,6-bis(5-(tert-butyl)-1H-pyrazol-3-yl)pyridine
1380612-64-5

2,6-bis(5-(tert-butyl)-1H-pyrazol-3-yl)pyridine

C38H50Cu3I3N10

C38H50Cu3I3N10

Conditions
ConditionsYield
In tetrahydrofuran for 24h; Inert atmosphere; Schlenk technique;100%
copper(l) iodide
7681-65-4

copper(l) iodide

[((p-tert-butyl)C6H4)2B(CH2P(phenyl)2)2][5-azoniaspiro[4.4]nonane]
591215-89-3

[((p-tert-butyl)C6H4)2B(CH2P(phenyl)2)2][5-azoniaspiro[4.4]nonane]

[[(p-(t)BuPh)2B(CH2PPh2)2]CuI][5-azonia-spiro[4.4]nonane]
820219-08-7

[[(p-(t)BuPh)2B(CH2PPh2)2]CuI][5-azonia-spiro[4.4]nonane]

Conditions
ConditionsYield
In tetrahydrofuran; ethanol equiv. amt. of solid CuI and B-compd. were mixed in THF:EtOH=4:0.3, stirring for 2.5 h; volatiles were removed in vac., solid was washed with Et2O, dried in vac., elem. anal.;99.4%
copper(l) iodide
7681-65-4

copper(l) iodide

6-bromo-2,2,4,4-tetramethyl chroman-8-carbaldehyde
345964-32-1

6-bromo-2,2,4,4-tetramethyl chroman-8-carbaldehyde

trimethylsilylacetylene
1066-54-2

trimethylsilylacetylene

6-Trimethylsilanylethynyl-2,2,4,4-tetramethyl chroman-8-carbaldehyde
607714-16-9

6-Trimethylsilanylethynyl-2,2,4,4-tetramethyl chroman-8-carbaldehyde

Conditions
ConditionsYield
With triethylamine; dichlorobis(triphenylphosphine)palladium[II] In tetrahydrofuran; hexane99%
copper(l) iodide
7681-65-4

copper(l) iodide

ethyl 8-iodo-2,2,4,4-tetramethyl-chroman-6-carboxylate
607713-99-5

ethyl 8-iodo-2,2,4,4-tetramethyl-chroman-6-carboxylate

trimethylsilylacetylene
1066-54-2

trimethylsilylacetylene

Ethyl-8-trimethylsilanyl-ethynyl-2,2,4,4-tetramethyl chroman-6-carboxylate
607714-00-1

Ethyl-8-trimethylsilanyl-ethynyl-2,2,4,4-tetramethyl chroman-6-carboxylate

Conditions
ConditionsYield
dichlorobis(triphenylphosphine)palladium[II] In hexane; triethylamine99%
copper(l) iodide
7681-65-4

copper(l) iodide

methyllithium
917-54-4

methyllithium

lithium dimethylcuprate
15681-48-8

lithium dimethylcuprate

Conditions
ConditionsYield
In diethyl ether at -78 - -35℃; for 0.333333h; Inert atmosphere;99%
In tetrahydrofuran Ar, ratio CuI:CH3Li = 1:2;
In hexane
pyridine
110-86-1

pyridine

copper(l) iodide
7681-65-4

copper(l) iodide

Cu4(pyridine)4I4

Cu4(pyridine)4I4

Conditions
ConditionsYield
With KI In water pyridine was added to stirred soln. of CuI in concd. aq. KI; filtered; washed (satd. aq. KI, H2O, MeOH, hexane); recrystd. (CH2Cl2/pentane); dried (vac.);99%
In ethanol at 20℃; for 0.5h; Sealed tube;80%
With potassium iodide In water
copper(l) iodide
7681-65-4

copper(l) iodide

Iodotrifluoroethylene
359-37-5

Iodotrifluoroethylene

cadmium
7440-43-9

cadmium

trifluorovinyl copper
102682-87-1

trifluorovinyl copper

Conditions
ConditionsYield
In N,N-dimethyl-formamide byproducts: CdI2; N2; slight excess of acid-washed Cd powder added to alkene soln.; mild exothermic reaction after induction period; removal of excess Cd by press. filtrn. under N2; stirring mixt. at 0 °C for half h with CuI or CuBr; final warming to room temp.; (19)F NMR;99%
copper(l) iodide
7681-65-4

copper(l) iodide

Ag4([C12H5N2(C6(CH3)4Br)2CC]2C6H4)2([C12H4N2(C6H13)2(CCC6H4CC)2(C6H2(OCH3)C(CH3)3)]2)2(4+)*4PF6(1-)

Ag4([C12H5N2(C6(CH3)4Br)2CC]2C6H4)2([C12H4N2(C6H13)2(CCC6H4CC)2(C6H2(OCH3)C(CH3)3)]2)2(4+)*4PF6(1-)

Cu4([C12H5N2(C6(CH3)4Br)2CC]2C6H4)2([C12H4N2(C6H13)2(CCC6H4CC)2(C6H2(OCH3)C(CH3)3)]2)2(4+)*4PF6(1-)

Cu4([C12H5N2(C6(CH3)4Br)2CC]2C6H4)2([C12H4N2(C6H13)2(CCC6H4CC)2(C6H2(OCH3)C(CH3)3)]2)2(4+)*4PF6(1-)

Conditions
ConditionsYield
In not given treated at room temp. for 24 h; further intermediate; followed by UV and by ESI-MS;99%
piperidine
110-89-4

piperidine

copper(l) iodide
7681-65-4

copper(l) iodide

Cu4(piperidine)4I4

Cu4(piperidine)4I4

Conditions
ConditionsYield
In dichloromethane piperidine was dissolved in CH2Cl2 under N2 at 25°C; CuI was added; mixt. was stirred under N2 until CuI dissolved;99%
With potassium iodide In acetone excess of ligand in acetone soln. is added to a stirred soln. of CuI in concd. aq. KI soln., soln. kept standing for a few min, pptn.; filtn., washing with satd. aqueous KI, water, MeOH and hexanes, product is dried in vac.;>99
With potassium iodide In water
copper(l) iodide
7681-65-4

copper(l) iodide

cis[(μ-N(t-Bu)P)2(NC4H8O)2]
73605-90-0

cis[(μ-N(t-Bu)P)2(NC4H8O)2]

acetonitrile
75-05-8

acetonitrile

[Cu8(μ-I)8(CH3CN)4(μ-N(t-Bu)P)8(NC4H8O)8]

[Cu8(μ-I)8(CH3CN)4(μ-N(t-Bu)P)8(NC4H8O)8]

Conditions
ConditionsYield
In dichloromethane; acetonitrile cyclodiphosphazane treated with 2 equiv. of CuI in CH2Cl2/MeCN (1/1);99%
copper(l) iodide
7681-65-4

copper(l) iodide

cis[(μ-N(t-Bu)P)2(NC4H8NMe)2
1038988-00-9

cis[(μ-N(t-Bu)P)2(NC4H8NMe)2

acetonitrile
75-05-8

acetonitrile

[Cu8(μ-I)8(CH3CN)4(μ-N(t-Bu)P)8(NC4H8NMe)8]

[Cu8(μ-I)8(CH3CN)4(μ-N(t-Bu)P)8(NC4H8NMe)8]

Conditions
ConditionsYield
In dichloromethane; acetonitrile cyclodiphosphazane treated with 2 equiv. of CuI in CH2Cl2/MeCN (1/1);99%
N,N'-ethylenethiourea
96-45-7

N,N'-ethylenethiourea

copper(l) iodide
7681-65-4

copper(l) iodide

tris(iodobis(ethylenethiourea)copper(I))
1094209-90-1

tris(iodobis(ethylenethiourea)copper(I))

Conditions
ConditionsYield
In N,N-dimethyl-formamide CuI, ethylenethiourea and few drops DMF were ground together for severalminutes; DMF was evapd.;99%
In water CuI and ethylenethiourea in water were heated to boiling; supernatant was decanted while hot and cooled, product was collected andwashed with water; elem. anal.;50%
copper(l) iodide
7681-65-4

copper(l) iodide

triacetylacetonatotripyridinetetrasulfido trimolybdenum hexafluorophosphate
443287-45-4

triacetylacetonatotripyridinetetrasulfido trimolybdenum hexafluorophosphate

benzene
71-43-2

benzene

triacetylacetonatotripyridinetetrasulfidomonoiodidocoppertrimolybdenum hexafluorophosphate - benzene (1/4)

triacetylacetonatotripyridinetetrasulfidomonoiodidocoppertrimolybdenum hexafluorophosphate - benzene (1/4)

Conditions
ConditionsYield
In dichloromethane; acetonitrile; benzene stoich., CuI added to soln. of Mo complex in CH2Cl2, evapd., dissolved (CH3CN), benzene deposited; crystd. for 3 d, elem. anal.;99%
copper(l) iodide
7681-65-4

copper(l) iodide

4,5-bis(diphenylphosphino)-9,9-dimethylxanthene
161265-03-8

4,5-bis(diphenylphosphino)-9,9-dimethylxanthene

Cu[9,9-dimethyl-4,5-bis(diphenylphosphine)xanthene]I
1218788-80-7

Cu[9,9-dimethyl-4,5-bis(diphenylphosphine)xanthene]I

Conditions
ConditionsYield
In acetonitrile99%
In CH2Cl299%
In acetonitrile at 50℃; for 2h;99%
copper(l) iodide
7681-65-4

copper(l) iodide

1,2-bis(diphenylphosphino)-1′-(diisopropylphosphino)-4-tert-butylferrocene
776315-37-8

1,2-bis(diphenylphosphino)-1′-(diisopropylphosphino)-4-tert-butylferrocene

P,P',P''-[1,2-bis(diphenylphosphino)-1'-(diisopropylphosphino)-4-tert-butylferrocene]iodocopper(I)
1231929-92-2

P,P',P''-[1,2-bis(diphenylphosphino)-1'-(diisopropylphosphino)-4-tert-butylferrocene]iodocopper(I)

Conditions
ConditionsYield
In acetonitrile (Ar) to soln. triphosphine in MeCN CuI was added, refluxed for 3 h; react. mixt. was cooled, solvent was removed in vacuo; elem. anal.;99%
copper(l) iodide
7681-65-4

copper(l) iodide

1-diphenylphosphino-2-diphenylphosphino-4-tert-butyl-cyclopentadienyl-1'-diphenylphosphino-3'-tert-butyl-cyclopentadienyliron
1159850-42-6

1-diphenylphosphino-2-diphenylphosphino-4-tert-butyl-cyclopentadienyl-1'-diphenylphosphino-3'-tert-butyl-cyclopentadienyliron

P,P',P''-[1,1',2-tris(diphenylphosphino)-3',4-di-tert-butylferrocene]iodocopper(I)
1231929-91-1

P,P',P''-[1,1',2-tris(diphenylphosphino)-3',4-di-tert-butylferrocene]iodocopper(I)

Conditions
ConditionsYield
In acetonitrile (Ar) to soln. triphosphine in MeCN CuI was added, refluxed for 3 h; react. mixt. was cooled, solvent was removed in vacuo; elem. anal.;99%
copper(l) iodide
7681-65-4

copper(l) iodide

bis(diethylamino)-2,3,4,5,6-pentafluorophenylphosphane
13648-83-4

bis(diethylamino)-2,3,4,5,6-pentafluorophenylphosphane

bis[bis(diethylamino)(pentafluorophenyl)phosphate]iodidocopper(I)
1311311-97-3

bis[bis(diethylamino)(pentafluorophenyl)phosphate]iodidocopper(I)

Conditions
ConditionsYield
In chloroform-d1 inert gas; CuI (0.36 mmol) added to soln. of ligand (0.70 mmol), mixt. stirred at room temp. for 30 min; filtered, evapd.;99%
copper(l) iodide
7681-65-4

copper(l) iodide

tris(3,5-dimethylpyrazolyl)methane
28791-97-1

tris(3,5-dimethylpyrazolyl)methane

(tris(3,5-dimethyl-1-pyrazolyl)methane)CuI
1392097-26-5

(tris(3,5-dimethyl-1-pyrazolyl)methane)CuI

Conditions
ConditionsYield
In acetonitrile under N2; soln. of ligand in MeCN added to stirred soln. of CuI in MeCN;stirred for 2 h; filtered; ppt. dried under vac.; elem. anal.;99%
at 20℃;

7681-65-4Relevant articles and documents

Nano-particulate CuI film formed on porous copper substrate by iodination

Yang, Yang,Li, Xuefei,Zhao, Bin,Chen, Huilan,Bao, Ximao

, p. 400 - 404 (2004)

A nano-particulate thin CuI film is fabricated by iodination of a porous copper substrate that was prepared by using an alumina mask and characteristic properties of these films are studied.

Chemistry of heterocyclic 2-thiones: In situ generation of 3-(2-thiazolin-2-yl)thiazolidine-2-thione and 1,1′-dimethyl-2,2′- diimidazolyl sulfide and their coordination to CuI and Cu II

Lobana, Tarlok S.,Sultana, Razia,Butcher, Ray J.,Castineiras, Alfonso,Akitsu, Takashiro,Fernandez, Francisco J.,Vega, M. Cristina

, p. 5161 - 5170 (2013)

The chemical reactivity of copper(I) chloride/copper(I) bromide, [Cu I(NCCH3)4](BF4), and copper(II) nitrate towards a series of heterocyclic-2-thiones under aerobic conditions is described. Thiazolidine-2-thione (NC3H5S2) in CH3CN in the presence of copper(I) chloride/bromide and [Cu I(NCCH3)4](BF4) was transformed into 3-(2-thiazolin-2-yl)thiazolidine-2-thione (C3H4S 2N-C3H4SN) through C-S bond cleavage and the formation of a C-N bond between two heterocyclic rings. This new thio ligand (C3H4S2N-C3H4SN) chelates to CuI through N,S-donor atoms, and the third site is occupied by the halogen atoms (Cl, Br), which leads to the formation of three-coordinate CuI complexes, [CuIX(κ2-N,S-C 3H4S2N-C3H4SN)] [X = Cl (1), Br (2)], and a four-coordinate N,S-chelated complex, [Cu I(κ2-N,S-C3H4S 2N-C3H4SN)2](BF4) (3), is obtained in the presence of BF4-. In each case, the formation of CuSO4·5H2O was also observed. Upon reaction of 1-methylimidazoline-2-thione (N2C4H 6S) with [CuI(NCCH3)4](BF 4) or copper(II) nitrate in CH3CN or CH 3CN/MeOH, respectively, the thio ligand is converted into 1,1′-dimethyl-2,2′-diimidazolyl sulfide (N2C 4H5)2S (a thioether), which prefers to bind to CuII (in situ formed) to yield six-coordinate N,N-chelated octahedral complexes, namely, {CuII[κ2-N,N-(N 2C4H5)2S]2(κ 1-OH2)2}X2 [X = BF4 (6), NO3 (7)], with water in the axial positions. The transformation of the thio ligand into 1,1′-dimethyl-2,2′-diimidazolyl sulfide is also observed in its copper(I) chloride reaction in acetonitrile, which yields an N,N-chelated chloro-bridged dimer, {CuII2[κ 2-N,N-(N2C4H5)2S] 2(μ-Cl)2Cl2} (5). Reaction of copper(I) iodide with thiazolidine-2-thione and 1-methylimidazolidine-2-thione (N 2C4H8S) in acetonitrile yields an iodo-bridged dimer, [Cu2(κ1-S-NC3H5S 2)4(μ-I)2] (4), and a novel polymer, [Cu4(μ3-I)2(μ-I)2(μ-S- N2C4H8S)2(κ1-S- N2C4H8S)]n (8), respectively. Reactions of copper(I) halides (Cl, Br), [CuI(NCCH3) 4](BF4), and copper(II) nitrate with thiazolidine-2- thione, 1-methylimidazoline-2-thione, and imidazolidine-2-thione in different solvents result in C-S bond cleavage and the in situ production of sulfate. For example, thiazolidine-2-thione is transformed into a new thio ligand, 3-(2-thiazolin-2-yl)thiazolidine-2-thione, which forms compounds 1 and 2 depending on the anion. Copyright

Highly Selective Fluorescent Probe Based on 2-(2′-Dansylamidophenyl)-Thiazole for Sequential Sensing of Copper(II) and Iodide Ions

Kim, Bo-Yeon,Pandith, Anup,Cho, Chan Sik,Kim, Hong-Seok

, p. 163 - 168 (2019)

A novel highly selective fluorescent probe based on 2-(2′-dansylamidophenyl)-4-phenylthiazole (1) is developed for sequential sensing of copper(II) and iodide ions in acetonitrile. The fluorescence mechanism is based on cation-induced inhibition of excited-state intramolecular hydrogen transfer, intramolecular charge transfer, and metal–ligand electron/charge transfer. Subsequent iodide-induced extrusion of copper(II) results in partial revival of fluorescence. Probe 1 and its ensemble with copper (II) show high selectivity for copper(II) and iodide ions, respectively, in acetonitrile solution.

Synthesis of nano-CuI and its catalytic activity in the thermal decomposition of ammonium perchlorate

Liu, Yaqing,Cheng, Yun,Lv, Shiqi,Liu, Chunsheng,Lai, Junling,Luo, Genxiang

, p. 3885 - 3892 (2015)

Nano-CuI was fabricated by an element-direct-reaction route at 40°C in acetonitrile, and used as a catalyst in the thermal decomposition of ammonium perchlorate. The effects of polyvinyl pirrolidone (PVP) as an additive in the preparation of the catalyst and the addition amount of the catalyst in thermal decomposition reaction on the catalytic activity were investigated. Meanwhile, the morphologies and composition of the catalyst were also identified by X-ray diffraction, scanning electron microscopy, transmission electron microscopy, and energy dispersive X-ray spectroscopy. The results showed that nano-CuI can remarkably decrease the higher decomposition temperature of ammonium perchlorate by more than 100°C, and that the temperature can be further reduced by using the nano-CuI catalyst with PVP as an additive in preparation. In addition, smaller crystallite size and increasing addition amount of nano-CuI in the thermal decomposition are favorable for improving its catalytic activity.

Cu4Mo6Se8: Synthesis, crystal structure, and electronic structure of a new Chevrel phase structure type

McGuire, Michael A.,Ranjan, Chinmoy,DiSalvo, Francis J.

, p. 2718 - 2726 (2006)

Cu4Mo6Se8 has been synthesized by intercalation of Cu into Cu2Mo6Se8 at room temperature, and its crystal structure has been determined. This compound crystallizes in the triclinic space gr

2D compound formation during copper dissolution: An electrochemical STM study

Broekmann,Hai,Wandelt

, p. 3971 - 3977 (2006)

The reversible formation of a 2D-CuI film on Cu(1 0 0) is studied by means of cyclic voltammetry in combination with electrochemical scanning tunneling microscopy. Exposing the Cu(1 0 0) electrode surface to an acidic and iodide containing electrolyte (5 mM H2SO4/1 mM KI) leads to the formation of a well ordered c(p × 2)-I adsorbate layer at potentials close to the onset of the anodic copper dissolution reaction. Copper dissolution starts at slightly more positive potentials preferentially at step edges in the presence of the iodide adlayer via the removal of copper material from kink sites at step edges. This increase of mobile Cu+ ions causes the local exceeding of the CuI solubility product (pKL = 11.3), thereby giving rise to the nucleation and growth of a laterally well ordered 2D-CuI film. Key structural motifs of the growing CuI film are closely related to the (1 1 1) plane of bulk CuI. Quite intriguing, the 2D-CuI film does not act as a passive layer. Copper dissolution proceeds even in the presence of this binary compound via an inverse step flow mechanism.

Characterization of defect thiospinels Cu1-x[Ti2 ]S4 (0

James,Goodenough,Clayden,Banks

, p. 143 - 155 (1989)

The thiospinel framework [Ti2]S4 represents a metastable host selective to Li insertion/extraction reactions in three dimensions that is of technical interest as a battery-cathode material. Synthesis is performed by oxidative extraction of copper from Cu[Ti2]S4, but complete extraction of copper from a stoichiometric starting material has not been possible. The authors report structural, transport, magnetic, 65Cu NMR, and electrochemical data for the defect-thiospinel systems Cu1-x[Ti2]S4, 0 2 at 45°C. X-ray data show a linear decrease in lattice parameter with increasing x up to 2.4% (7.2% by volume) at Cu0.07[Ti2]S4. Neutron diffraction shows that the residual copper atoms of the x = 0.92 sample remain in the tetrahedral 8a sites of the spinel framework. Electrochemical lithiation of Cu[Ti2]S4 and Cu0.07[Ti2]S4 gave an open-circuit voltage versus lithium that is higher in the former than it is in the latter. These several properties, including the limiting composition x = 0.93, are accounted for by constructing semi-empirical band diagrams for Cu[Ti2]S4 and Cu0.07[Ti2]S4.

Synthesis, morphology, and optical properties of cui microcrystals

Shevchenko,Piskunovich,Zhuravkov,Bokshits

, p. 630 - 634 (2012)

We have studied the effect of synthesis conditions on the luminescence spectra of ultrafine CuI powders. The results demonstrate that synthesis conditions (the reductant of Cu2+, the anion of the copper(II) salt, initial solution concentrations, and the presence of a stabilizer) influence the size and shape of the forming CuI particles and, accordingly, their luminescence spectrum. The highest luminescence intensity near λmax ?720 nm (λex ?370 nm) is offered by regularly shaped tetrahedral particles 1.1-1.2 μm in average size. Pleiades Publishing, Ltd., 2012.

Effects of doping on transport properties in Cu-Bi-Se-based thermoelectric materials

Hwang, Jae-Yeol,Mun, Hyeon A.,Kim, Sang Il,Lee, Ki Moon,Kim, Jungeun,Lee, Kyu Hyoung,Kim, Sung Wng

, p. 12732 - 12738 (2014)

The thermoelectric properties of Zn-, In-, and I-doped Cu1.7Bi4.7Se8 pavonite homologues were investigated in the temperature range from 300 to 560 K. On the basis of the comprehensive structural analysis using Rietveld refinement of synchrotron radiation diffraction for Cux+yBi5-ySe8 compounds with the inherently disordered crystallographic sites, we demonstrate a doping strategy that provides a simultaneous control for enhanced electronic transport properties by the optimization of carrier concentration and exceptionally low lattice thermal conductivity by the formation of point defects. Substituted Zn or In ions on Cu site was found to be an effective phonon scattering center as well as an electron donor, while doping on Bi site showed a moderate effect for phonon scattering. In addition, we achieved largely enhanced power factor in small amount of In doping on Cu site by increased electrical conductivity and moderately decreased Seebeck coefficient. Coupled with a low lattice thermal conductivity originated from intensified point defect phonon scattering by substituted In ions with host Cu ions, a thermoelectric figure of merit ZT of 0.24 at 560 K for Cu1.6915In0.0085Bi4.7Se8 was achieved, yielding 30% enhancement compared with that of a pristine Cu1.7Bi4.7Se8 at the same temperature.

Dimorphism of a new Cul coordination polymer: Synthesis, crystal structures and properties of catena[Cul(2-iodopyrazine-N)] and poly[Cul(μ2-2-iodopyrazine-N,N′)]

Naether, Christian,Wriedt, Mario,Jess, Inke

, p. 2391 - 2397 (2003)

Two modifications of the new copper(I) iodide coordination polymer Cul(2-iodopyrazine) were obtained by the reaction of Cul and 2-iodopyrazine in acetonitrile. During this reaction, intensely yellow crystals of form I appear first which transform within several minutes to intensely red crystals of form II which is the thermodynamically most stable form at room temperature. In catena[Cul(2-iodopyrazine-N)] (form I; a = 4.1830 (6) A; b = -10.814 (1) A; c = 17.961 (4) A; V = 812.5 (2) A3; orthorhombic; P212121; Z = 4), corrugated Cul double chains are found in which each copper atom is coordinated by one additional 2-iodopyrazine ligand. In poly[Cul(μ-2-iodopyrazine-N, N′)] (form II; a = 4.2679 (5) A; b = 13.942 (2) A, c = 13.017 (2) A, b = 92.64 (1)°; V = 773.76 (2) A3; monoclinic; P21/c; Z = 4), Cul single chains occur which are connected via μ-N,N′ coordination by the 2-iodopyrazine ligands to layers parallel to (010). The thermal behavior of both forms was investigated using simultaneous differential thermoanalysis, thermogravimetry, and mass spectrometry as well as differential scanning calorimetry and temperature resolved X-ray powder diffraction. On heating, both forms decompose to copper(I) iodide, and the decomposition temperature of form I is significantly lower than that of form II. From all experiments, there is no indication of a phase transition of one form into the other or for the formation of a phase with lower amine content.

Post a RFQ

Enter 15 to 2000 letters.Word count: 0 letters

Attach files(File Format: Jpeg, Jpg, Gif, Png, PDF, PPT, Zip, Rar,Word or Excel Maximum File Size: 3MB)

1

What can I do for you?
Get Best Price

Get Best Price for 7681-65-4